Southern Machinery supply SMT/AI competitively priced machines world wide & proud to release S-EF 30000 Semi Automatic SMT pick and Place Machine, to the Global Market. Designed and manufactured in ShenZhen China by Southern Machinery. S-EF 30000 is one of the most economical and cost effective Surface Mount assembly solution available in the market today. It is ideally suited for Led Lighting SMT assembly.
Southern Machinery has proven upper – class , with over hundreds of machines in operation around the world. We look forward to discussing your requirements.
Features :
High-accuracy: Each of the eight pick up heads is equipped with a vision alignment camera to guarantee high accuracy. Using high resolution digital camera for fiducially recognition and programming.
High-speed: Maximum placement speed reaching 0.1s/chip.
Places SMD components from 0603 to 7474, including resistors, capacitors, standard and irregularly sha ped LEDs.
Suitable for all LED lighting products, including flexible PCB strips, circular LED light bulb boards and even irregularly shaped boards. Assembles LED PCBs up to 1.2 meters long in a single https://adderalloral.com pass.
Using motor-driven feeders for longer feeder life and higher speed under around-the-
clock production conditions.
Excellent quality hardware support by using international famous brands ensure placement repeatability and precision.
Self-developed software simplifies production, easy operating and programming.
Specification and Machine Parameters :
Model
S-EF30000
Alignment
Fixed Vision Alignment System
Number of Spindles
8 Spindles x 1 Gantry
Placement Speed (Practical)
Vision Alignment
LED 2835 27,000 CPH (Optimum)
LED 2835 29,500 CPH (Optimum)
Placement Accuracy
±0.1mm
(Based on the standard chips)
Component Range
Vision Alignment
0603(inch)~7474(mm), IC<15mm
Max Height
H=6mm
Board Dimension(mm)
Maximum
1,200(L) x 310(W)
PCB Thickness
0.5 – 3.0
Tape Feeder
Feeder Type
Motorized Feeder
Feeder Capacity
16 (12mm)
Optional
8mm, 12mm, 16mm, 24mm
Utility
Power
AC 220V ±10%
(50Hz, Single phase)
Max 2.2KW
Air Consumption
0.55-0.7MPa (5.6-7.1kgf/cm2)
Mass
Approx. 950kg
External Dimension(mm)
2,000(L) x 1,150(D) x 1,350(H)
Advantages of Motorized Feeder :
Higher feeding stability, effectively prevent pick-up failure.
Longer feeder life, hard to break down.
Motor-driven, save air source.
Higher feeding accuracy and consistency.
Higher feeding speed.
Intelligent adjustment of the feeding pitch.
Excellent Quality Hardware Support :
Ball Screws
KU RODA (Japan)
Servo Motors & Drivers
PA NASONIC (Japan)
Stepper Motors & Drivers
SHI NANO (Japan)
Vacuum System
From Taiwan
Negotiate Pressure Detecting System
KITA (Taiwan)
Cables
IGUS (Germany)
Operation
I PC
Working Efficiency:
Real Speed: 25,000-30,000 CPH
PCB Length: 1220mm / 4Ft
•Semi-Auto Screen Printer
•Semi-Auto Pick and Place MID END LED
•Buffer Conveyor LAMP SMT LINE
•Reflow Oven
•Worktable
We have been supplying surface mount assembly equipment to worldwide market since 2011, and they continue to represent excellent value, ideal for small batches and prototypes as well as for medium volume SMT assembly.
Southern Machinery have small footprint, competitively priced machines for screen printing, SMT automatic pick and placement and re-flow Oven. There are many satisfied Countries like Kingdom of Saudi Arabia, India, Brazil, Egypt, Thailand and Pakistan users and full support from SOUTHERN MACHINERY Production Equipment is assured.
Specifications
1.Industrial Ultrasonic Cleaner
2.digital control timer
3.top quality steel made
4.digital LCD display
5.quality warranty
Industrial Ultrasonic Cleaner
Features
>Isolated-Circuit Design, Keep Water Away for Extra Safety
>Wide-Diameter Transducer for Best Cleaning Result
>Professional Design
>Powerful transducer and clear circut
>Top quality steel made for body,cover and base
>Digital LCD display leading fashion of the model Time setting,real time count-down,heation function,temperature control,live temperature display.easy operation
>Basdet and Tray Anti-noisy and Shock absorption Handle Drain Sophisticated made and customized design
>Professional testing,quality assurance
>Sophisticated design/fabulous outlook
>Digital control Timer Heating Temperature control function
Applications
Electronic factory
Jewelry factory
Chemical lab
Dental clinic
Restaurant
Repair shop
Family, etc
Specification
Ultrasonic Frequency
40000 Hz
Tank Material
Stainless Steel SUS304
Tank Capacity
3.2L
Timer
1-30 Minutes, Digital timer
Power Supply
AC 100 – 120V, 50 / 60 Hz
AC 220 – 240V, 50 / 60 Hz
Ultrasonic Power
120W
Heating Power
100W, Digital heating
Unit Size
270 X 170 X 240 MM ( L x W x H)
Tank Size
240 X 135 X 100 MM ( L x W x H)
Package Size
330 X 250 X 310 MM ( L x W x H)
N.W.
3.8 KG
G.W.
4.1 KG
Shipping Information:
Carton size (12 pcs)
775 X 685 X 320 mm(L x W x H)
Carton gross weight (12 pcs)
25 kg
Cube( 12 pcs)
0.18 M3
20` Container capacity
1980 pcs
40` Container capacity
2280 pcs
40` High container capacity
3216 pcs
Is there a revision controlled Operator Work Instruction which contains loading information for the specific product being built? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
1.2
Are Work Instructions readily available to the operator and are they followed at Component Placement?
1.3
Are component part numbers and descriptions included on the Work Instructions?
1.4
Are component descriptions sufficiently detailed to check at first-article that the correct components are being used?
1.5
Is the machine head/slot number for component loading specified for each part number on Work Instructions?
1.6
Are the reference designators and the quantity per part number specified on Work Instructions?
1.7
Is the component feeder type/size specified on Work Instructions or otherwise for each component package type?
1.8
Is the machine Program Name specified on the Work Instruction or line set-up instructions?
2. Component Loading and Verification
2.1
Is there an automated bar coded component loading verification aid in order to reduce the probability of incorrect loading? Note*
2.2
Are the component loading verification aids hard linked to the placement program so that loading is verified against program data?
2.3
Can traceability of component lot codes be demonstrated for critical devices?
2.4
Is component loading/changes verified and cross checked by an individual other than the set-up operator at product changeover? Note*
2.5
Is a component loading/changes verification log signed by the set-up operator and countersigned by the cross checker before start up? Note*
2.6
Is the correct feeder loading base used to facilitate real to feeder loading?
2.7
Are first-built boards verified against documentation for missing/misplaced components and for correct component polarity?
2.8
Are first-articles conducted using AOI methods and complemented with description verification and value metering?
2.9
Are all Resistors & Capacitors measured for a value within the tolerance (one per part number) at first-article & at reel change?
2.10
Is a first-article log signed to verify acceptance before start up?
2.11
Is the orientation of Tantalum SMT capacitors, Diodes, etc in tape format, standardized and documented for polarity orientation?
2.12
Is the IC tray loading polarity standardized for each type of polarity indicator that can be used for each component?
2.13
Is loading polarity referenced both from the tray and the component so as to ensure retrayed components are correctly loaded?
3. Nozzles, Feeders, and Tooling
3.1
Is there a document which details the standardized nozzle diameter set-up selected for each type of placement equipment?
3.2
Are these standardized nozzle diameter set-up documents readily available for when nozzles need to be replaced or changed?
3.3
Is there a document which details the range of component XYZ body sizes that each selected nozzle type can successfully place?
3.4
Is there a documented requirement to conduct daily nozzle centering and is there evidence that this is done?
3.5
Is each feeder identified with its own unique serial number?
3.6
Is there a documented and effective Feeder Maintenance Program? Records (s/w or otherwise) must be by Feeder Serial Number.
3.7
Are database records maintained for each feeder serial number for the purpose of tracking its maintenance history and performance?
3.8
Is feeder maintenance history used to monitor feeder life so that problematic feeders can be removed from the process?
3.9
Can it be demonstrated that the number of feeder indexes is counted & monitored for each unique feeder using software or otherwise?
3.10
Is this information used to flag that feeder preventative maintenance is required after x number of indexes?
3.11
Is there a documented requirement to indicate that Blocks or Support Pins are needed for specific products?
3.12
Is the No, location, type and height of Support Blocks/Pins identified on a product by product basis? Score NA if in 3.11 there are not needed.
3.13
Are the Support Pin locations identified for each product using templates/tooling or some other effective solution? Comment as above.
4. Moisture Sensitive Devices
4.1
Are components stored before loading and after unloading in a manner which prevents damage?
4.2
Are the Moisture Sensitive Devices (MSDs) and their sensitivity level readily known to the operator?
4.3
Are MSDs time stamped at opening and their exposure time monitored against pre determined limits?
4.4
Is there a flag to indicate that the exposure time has been exceed for any given device in a dry box?
4.5
Is there a flag to indicate the MSD exposure has expired for any MSD device currently loaded in the placement machines?
4.6
Have MSD procedures been updated to reflect the JEDEC standard for MSD control? (J-STD-033A MSD released in July 2002)
4.7
Is there evidence of correct implementation of J-STD-0033A for all MSD devices?
4.8
Are there MSD procedures in place to ensure MSD shelf life is reduced based on measured Relative Humidity conditions?
4.9
Is there a method in place to address the time spent in dry storage and its effect on remaining life based on MS Level and RH Level?
4.10
Is it clearly understood that MSD ‘shelf life’ continues to degrade during dry cabinet storage of some MSD devices?
4.11
If MSDs are on both sides of a PCBA, is there an effective method to account for time between 1st and 2nd reflow?
4.12
Can MSD control be demonstrated for MSD devices that need internal/external pre-programming?
4.13
Can MSD control be demonstrated for rejected devices and devices used for rework?
4.14
Have MSD recovery methods been defined and adequate for all component types?
4.15
Does the control of Moisture Sensitive Components include those components on reels?
4.16
Is the baking or hot room storage time and temperature documented and controlled for component recovery?
4.17
Has this time and temp been determined based on the component supplier’s guidelines / J-STD-0033A?
4.18
Is there evidence to demonstrate that the control process for MSDs is in use and is effective?
5. Machine Capability
5.1
Are Component Placement Programs generated from CAD XY coordinate data?
5.2
Is there a standardized nomenclature for Shape Code definition?
5.3
Can this nomenclature be used to determine the most appropriate shape code to allocate to a given part of given dimensions?
5.4
Are localized fiducials used for fine pitch devices when localized component fiducials exist on the board?
5.5
Has manual component moving been eliminated given correct CAD, nozzle set-up, Shape Code allocation, local fiducials, Cam speed, etc?
5.6
Does the Fine Pitch placement machine have the capability to check lead Coplanarity in xyz?
5.7
Does the Fine Pitch placement machine use its coplanarity capability on all leads of 20 mil pitch or less, and all programmed parts?
5.8
Does the Fine Pitch placement machine have the capability to check ball arrays? If no such device, score NA.
5.9
Does the Fine Pitch placement machine use its ball array verification capability for all BGA devices? If no such device, score NA.
5.10
Is the machine Program Name revision controlled to show traceability of program changes?
5.11
Is the machine Program Name traceable to the PWB and PCBA part number?
6. PCBA
6.1
Are outputted boards at least sample inspected pre reflow for placement positional accuracy for machine control purposes?
6.2
Is the frequency for this verification defined and documented, and is there evidence to suggest it is followed?
6.3
Is there a visual aid available which identifies the populated locations with polarity, and also the no-pop locations?
6.4
Is there a placement standard pre reflow to validate placement accuracy for the shape code, nozzle allocation, etc. parameters used?
6.5
Is there evidence to demonstrate that action is taken to adjust the machines performance for when this standard is exceeded?
7. Attrition Rates and Rejected Components
7.1
Is attrition rate monitoring conducted systematically to ensure feeder and/or nozzle problems are captured at least hourly?
7.2
Is there documented evidence to ensure attrition rates are checked and actioned at least hourly to ensure process control?
7.3
Is there a specification defined for acceptable attrition rates for the individual feeders?
7.4
Is there a specification defined for the maximum allowable number of nozzle skips per machine before it is shut down for repair?
7.5
Are these specifications determined based on a percentage combined with the number of placements for a given time period?
7.6
Is there evidence to demonstrate that attrition rate monitoring is conducted, effective, and used to make process control decisions?
7.7
Is there a documented process for the disposition or reuse of machine rejected components? Rs and Cs must not be reused even for rework.
7.8
Are rejected components reviewed and repaired to ensure conformance before reuse, even if only used for rework?
7.9
Are there repair blocks available or a lead conditioner in use for repairing ‘real’ Coplanarity rejects? Score 0 if parts not repaired.
7.10
Does the re-traying process always ensure that component polarity wrt the tray and the component loading polarity is preserved?
7.11
Is there a documented Process Deviation procedure to manage machine skips for hand placement if hand placement is allowed?
8. Process Capability
8.1
Has a Process Capability Analyses (PCA) been conducted and the Cpk acceptable for the suite of shape codes in use?
8.2
Were shape code allocations, component nozzle allocations, cam speeds, etc. recorded for this PCA?
8.3
Are the recorded shape code allocations, component nozzle allocations, and cam speeds, the same as those used today?
While decide to purchase SMT Pick and Place Machine !
let us instruct you and provide you complete suitable SMT/THT machines according to your choice and requirements with a comprehensive Buyers’s Guide to save your time and Money. To search Out for your company’ which Pick and Place machine is best suited to your production needs – and your Budget.
Southern Machinery Helps you :
Identify your production requirements and your needs.
Make sense of your equipment specifications.
Calculate your speed and feeder needs.
Create equipment benchmarks and apple to apple comparison of models and brands.
Provides machines and spare parts according to your choice and specifications with a comprehensive Buyers Guide.
The Through Hole Assembly, also known as thru hole assembly, process uses the latest models with the quickest possible turnaround rate in the industry. Assembling excellent stable sequencing performance with easy operating software utilizing its high precision through hole assembly both by hand and automation to create electronic solder connections.
1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be more than 99.99%.
2.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ ambient temperature to a temperature stabilization .
3.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display.
4.Cooling System: new cooling zone, quick and easy adjustment, easily reach the cooling requirements of different slopes.
5.Temperature protection: using third-party over-temperature protection, multiple layers protection to ensure safe operation.
6.Products comply with CE, CCC, UL , other standards and specifications.
7.User-friendly design: fault detection (such as heaters abnormal alarm, etc.), regular maintenance reminders, the economy functions and tool-free maintenance, reducing equipment failure rates.
8.Heating module: Transverse reflow design makes temperature from each zone is not influenced by neibour to ensure accurate temperature curve, while ensuring a high production capacity and heat exchange capacity to achieve high adaptability (to meet the soldering of automotive, communications, electronics, computers and mobile phones consumer electronics.)
9.Hot air motor with independently inverter controlled, set operating frequencies depending on different technology to meet a variety of lead-free processes.
10. Machine using zero gas source design, furnace cover with motor lifting, safety rod support, providing significant security.
11.Main parts:Imported main parts ensure equipment runs smoothly and lower the maintenance cost.
12. Customers can choose optional flux processing system according to their own production features to ensure furnace chamber clean.
13.Closed-loop transmission speed control systems, transportation accuracy ± 2mm / min, ensuring more stable transmission speed.
14.Central support, dual transmission, external water cooling system is optional.
TOP Advantage:
1.Simple: combined with advanced international concepts, based on the Oriental-designed operating system, easy to understand, easy to learn, easy to maintain.
2.Expertise: learn imported reflow oven’s advanced design concepts, and the machine core components are using imported top brands.
3.Hedging: Import hardware configuration,low failure rate in production,more than a decade service life.
4.Safety: Based on the general rules of international design, close to imported reflow rating, the highest security level.
5.Stable: mature software, hardware and top production processes ensures stability of each equipment.
Application
Widely used in high precision products like 01005-QFP, BGA, CSP, Flip,and POP ,automotive electronics, mobile devices, home appliances, communications, LED, semiconductor and other industries.
Specification:
Southern Machinery Reflow Oven Specifications
S – Standard, O – Option, M – Manual, A – Auto, N/A – Not Availible)
Specifications
S-R800
S-R1000
Specifications
E8
E10
Dimension (L*W*H)mm
5310x1353x1490
6100x1353x1490
Board Dropped Alarm
S
S
Standard Color
Computer Grey
Computer Grey
Electrical SMEMA Interface
S
S
Weight
Approx.2150KG
Approx.2400KG
Computer
Lenovo
Lenovo
Number Of Heating Zones
Up8/Bottom8
Up10/Bottom10
Max.Width Of PCB
400mm
400mm
Length Of Heating Zones
3121mm
3891mm
Temperature Deviation on PCB
± 1.0℃
± 1.0℃
Rail Width Adjustment
A and M(Multi mode)
A and M(Multi mode)
Max. Temp. Gap Between Preheat Zones Setting
40℃
40℃
Rail Number
1 Lane or 2 Land
1 Lane or 2 Land
Temperature Control Precision
± 1.0℃
± 1.0℃
Exhaust Volume
10M3/minx2 Exhausts
10M3/minx2 Exhausts
Conveyor Height
900+/-20mm
900+/-20mm
Control System
PLC+Computer
PLC+Computer
Length Of Cooling Zones
600mm
600mm
Transmission Agent
Chain + Mesh
Chain + Mesh
Center Support
O
O
Electric Supply Required
3phase,380V 50/60Hz
3phase,380V 50/60Hz
Siemens PLC
S
S
Power For Warm Up
30KW
36KW
Lubrication Auto-Afflux
S
S
Power Consumption
8KW
12KW
Ups
S
S
Warming Time
Approx.25 minute
Approx.25 minute
Temp. Thermocouple Slot
S
S
Temp. Setting Range
Room Temp.– 300℃
Room Temp.– 300℃
Driven Top Hood Opening
A
A
Oil Supply
A and M(Multi mode)
A and M(Multi mode)
Temperature Control Method PID + SSR
S
S
Conveyor Speed Range
300~2000mm/min
300~2000mm/min
Number of Cooling Zones
2
2
Components Clearance
Top/ Bottom is 25mm
Top/ Bottom is 25mm
On Line Editing
S
S
Conveyor Direction
L→R (Option: R→L)
L→R (Option: R→L)
Max.Temp.Gap Between Preheat & Reflow Setting
80℃
80℃
Commutated Element
Aluminum Alloy Plate (8mm)
Aluminum Alloy Plate (8mm)
Max. Temp. Gap Between Reflow Zones Setting
50℃
50℃
Fixed Rail Side
Front Fixed (Option:Rear Fixed)
Front Fixed (Option:Rear Fixed)
Process Data & Status Storage
S
S
Cooling Method
Forced-Air Motor and fan (Standard)
Forced-Air Motor and fan (Standard)
Temperature Alarm
S
S
Independent Upper and Lower PID Temperature Controls for Each Heating Zone Permit Precise Temperature Profiling
S-R1000’s heating zone temperature controllers have an accuracy of ±1°C and, in conjunction with a high-speed blower adjacent to each heat source for maximum convection, ensure a ΔT of ±2°C across the PCB assembly. The Series diffuser design provides low-velocity, low-turbulence air flow to prevent component shift or disturbance.
Optional thermocouples can be attached at critical locations on the PCB and connected to three built-in inputs (standard) on the oven for communication with control software for accurate, real-time temperature profiling to match any solder paste manufacturer’s specifications.
Pin-Over-Mesh Conveyor Meets Virtually Any Product Specification or Production Requirement
The S-R1000 is supplied as standard with an adjustable-rail, pin-type conveyor system that handles PCBs up to a maximum of 450 mm (17.7″) installed over a 570 mm (22″) stainless-steel mesh belt. The pin conveyor permits inline and double-sided processing. The mesh belt is ideal for fast changeovers.
To eliminate the possibility of jamming or dropped PCB assemblies, all components are constructed of high-quality, high-strength, stainless steel and are built to maintain dimensional tolerances at the high temperatures of lead-free processing.
Advanced automatic chain lubrication and motorized width adjustment are standard features on the pin conveyor. Automatic width adjustment of the pin conveyor, based on the parameter settings for specific reflow programs, is available as an option. For processing of larger PCBs at higher lead-free temperatures, a center support system is available to prevent board warpage.
Conveyor speed is programmable from 400-1800 mm (16″-71″) per minute to accommodate any process requirement.
While the debate over air or inert reflow atmospheres continues, as an option, offers the S-R1000 in a nitrogen-compatible configuration for manufacturers who want the flexibility for soldering in both environments.
Most experts agree that the reduction of oxygen through the introduction of an inert gas (usually N2) will allow a wider process window and provide better solder joints through reduced oxidation. The enhanced flow design of the heating chamber in the S-R1000 nitrogen compatible system lends itself to efficient heat transfer and ensures low nitrogen consumption while maintaining O2 levels between 300-1000 ppm.
Internal Water Cooling Provides Maximum Control Over Critical Cooling Rates Required By Some Lead-Free Solders
Because the higher liquidus temperatures required by lead-free solders approach the limits of many SMT components and PCB assemblies, more aggressive cooling is often required to reduce peak temperature exposure times. Some recent studies also indicate that cooling rates have a significant effect on solder joint grain structure.
For these reasons, an internal water-chilled recirculating cooling system is available for the S-R1000. It allows users to alter cooling rates to meet solder paste manufacturers recommendations to a much greater degree than is possible with the exclusive use of air cooling.
Advanced Functionality and Process Management Capability
Operation and control of all reflow systems is accomplished through an attractive, colorful, visual user interface that features a full-screen, virtual view of the system with display of pre-set and actual zone temperatures, system status and conveyor speed.
The Windows-based operating system and control software includes advanced functions for temperature profiling, timed automatic startup and shutdown, audible and visual alarms, and password protection.
A PC-controller with 15″ flat screen monitor, keyboard and trackball allow unlimited storage and networking capability.
All systems employ UPS battery backup to ensure removal of all product from the oven in the event of a power outage.
Axial Sequencer – The axial sequencer machine takes axial leaded through-hole components from reels and creates a tape chain of components in order of insertion for use on the axial insertion machine.
Component Lead Hole Guidelines
PCBs should be punched or drilled for component lead insertion to the following recommended hole diameters for optimum performance:
Hole Diameter = Lead Diameter + 0.48 mm (0.019 in.) ± 0.08 mm (0.003 in.)
Hole sizes:
• Less than recommended – Might result in reduced insertion reliability
• Greater than recommended – Might result in loose components in the PCB
Holes used for board error correction should be 1.0 mm (0.040 in.) ± 0.5 mm (0.020 in.). Plated holes or translucent PCBs might affect performance
Southern Machinery Products are Productive and long life operative. We design according to the New technology and fully automatic SMT Pick Place Machines, THT Machines according to the Clients requirements with in Short time delivery Period according to the specification of Clients with Affordable Price.
2.ADVANCED SOFTWARE
Compatible with all Electronic Design Automation software.
3.MULTILINGUAL
The software is 100% translated in Chines as well as in English.
4.COMPUTER VISION
Southern Machinery is using an advanced software that is using Computer Vision for calibration and when it is placing the electronic components.
5. VERY AFFORDABLE
Southern Machinery proves Total Solution for PCB – Professional solution of SMT/THT/AI, Provides Spare parts worldwide and Complete Training on site with affordable price. Where your ROI is 100 times of your investment.
6. VIDEO TUTORIALS
There will be plenty video tutorials to learn how to use Southern Machines to start assembling PCB s
7. EASY TO USE
The Southern Machines Products are easy to learn and Cool to use !
And many more qualities …………………
Southern Machinery Products – 2016 (New)
1.Automatic Loader SLD-400B 2.Automatic Unloader SULD-400B 3.Buffer Conveyor S-350C 4.Semi-Auto Screen Printer SP-1200 5.Automatic Screen Printer SP-1008 6.Pick & Place S-600-L 7.Pick & Place S-1200-LV 8.Pick & Place Machine S-320 9.LED High Speed Pick And Place S-K100 10.SCRAP TAPE CUTTER 11.Lead Free Reflow Oven S-6600 12.Lead Free Reflow Oven S-6600-PC 13.S1688 Pneumatic Stencil Cleaner Machine 14.S-DS300 Automatic dip soldering machine 15.S3000 Series- Radial Insertion Machine 16.S4000 Axial Auto Insertion Machine 17.S-7000I Odd Form Inserter 18.S-WS250 Wave Solder Machine 19.S-500S Auto-Dip Soldering machine 20.Automatic Spray Fluxing System 21.S8300 Shuttle conveyor -to merger production line 2 in 1 22.Solder Chip FEEDER 23.SMT Feeder Calibration jig 24.Desktop Pick & Place S-48V 25.Vibrating Feeder -for LED lens 26.Solder Paste Mixer 27.N2 Dry Cabinet
Southern machinery design and manufacturing wave solder machine, easy operation &maintenance, accurate temperature profile, flux saving,good soldering quality
Whole machine design is safe and reasonable, sensitive fault alarm system ensures the stability and safety
Time controller function, users can preset the on-off time , the heating up time of solder machine is 70 minutes.
Full-automatic transport power system, stepless frequency speed adjustment, self-synchronous board entry
lTailor- made titanium alloy transport chain—1. Reinforced
—– 2. Non-tin-bonding to guarantee the quality of welding
lAutomatic chain washing function to keep the cleanness of the chain
Preheating system adopts 3 sections strong hot air control system— 1.Quick in warming 2. Even temperature, ≤ ±2℃
lFlux spray system adopts the scanning spraying mode
lNissan Spray and rodess cylinder , PLC control, accurate and reliable
The solder machine adopts imported high temperature motor with steeless frequency conversion control and independent control, stable welding performance.
lThe solder machine adopts lead free environmental friendly design, which is convenient and safe in going up/ down/ in/ out, easy to clean
lThe heating of the solder machine adopts hispeed PID external heated 2 phases independent control, which is quickly heating and solve the shortage of soldering.
A Solder Paste Screen Printer for SMT is needed to screen solder paste onto the printed circuit board (PCB) before placement of surface mount components.
Solder Paste Screen Printer for SMT have been widely used in electronics by the PCB industry for screen solder mask. This equipment / machine has also been extensively used in the hybrid industry for screening solder paste. However, different equipment is used for the screening of solder mask and solder paste. The cost of screen printers can vary widely, depending on their degree of automation and the size of boards they can handle.
Solder Paste Printing Systems are available in three configurations: manual, semi-automatic and fully automatic. The machine can be table mounted, stand-alone, or in-line. Many semi-automatic printers offer manual vision alignment capability, while fully automatic printers offer automatic vision alignment.
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