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Radial 5 Enhancements

 

There are three (3) enhancements that distinguish the Radial 5 from the Radial IIIXQ:

Auto Recovery
Increased Cycle Rate to 9,200 Cycles/Per Hour
New Machine Cover Package

Auto Recovery:

Auto recovery was introduced to aid our customers in their continuous pursuit of high quality electronics manufacturing. By having the machine repair misinsertions automatically, you greatly reduce the opportunity for operator error, and consequently increase the quality of your product.

First, we will briefly describe auto recovery and then follow with a discussion of some of the common questions customers might have about auto recovery. To initiate auto recovery, there is a set command in the software “auto R” that must be set to 1. If this set command is set to 0, the machine will perform repairs the ame as previous level machines did, with the operator placing a component in the board and pressing the repair button to activate the cut and clinch.

If auto R is set to 1 and the machine experiences a misinsertion, the misinserted component should be cleared from the board by the operator. Once the component has been cleared, the operator presses the repair button, then the start button. At this point, the operator can leave the machine and continue doing what they were before the misinsertion occurred. The chain will sequence the carrier clip back to the dispensing head that the misinserted component came from, and the dispensing head will then place a component in that carrier clip. That carrier clip then travels back to the insertion area and the component is inserted into the printed circuit board. The machine then continues automatically with the remaining insertions of the pattern program.

Some questions that customers may ask are listed below:

  1. Question: Is auto recovery an option that I need to buy?
    Answer: No. It comes standard with the machine software. Also, the price
    of the Radial 5 is the same as the Radial IIIXQ.
  2. Question: How long does it take the machine to perform auto recovery?
    Answer: The time required to perform auto recovery is based on the length
    and configuration of the sequencer module. We have not tested all
    sequencer configurations, but we believe the time for auto recovery
    will be between 29 seconds (20 station straight back) and 90
    seconds (80 station in-line). The other configurations that have
    been tested are 40 station straight back (50 seconds) and 60 station
    straight back (62 seconds).
  3. Question: Do I have to repair misinsertions through auto recovery?
    Answer: No. You can repair misinsertions manually also.

As noted earlier, the customer can choose the operate the machine in auto recovery mode or they can perform repairs in the traditional manner, they simply enter a 1 or 0 in the auto R set command.

  1. Question: If I have a older Radial machine, can I retrofit auto recovery
    onto it?
    Answer: Auto recovery will be available as a purchased retrofit for
    Radial IIIXQ machines only, and is available in the near future.
  • Question: Since auto recovery takes longer to repair a misinsertion than an
    operator does, why would I want to use it?
    Answer: Operators make mistakes and put polarized components
    (electrolytic capacitors, diodes, transistors, etc.) in the board
    backwards which causes test failures after wave solder. This
    causes the PCB line throughput to decrease along with possible
    component damage. Auto recovery will not put a component in
    backwards, and in combination with the Expanded Range Verifier
    (ERV) will verify the component before inserting it again.

  • The auto recovery function should be presented as a repair alternative. Not all customers will use auto recovery because of the time required, especially on larger machines, but the option is there for customers who believe from a manufacturing quality standpoint that misinsertions need to be repaired automatically. From a competitive standpoint, Panasonic through the use of its shuttle can perform auto recovery faster than the Radial 5 users can use auto recovery and still maintain greater throughput vs. Panasonic. When in competition with TDK, it is important to note that we give the customer a choice in terms of auto recovery (see competitive matrix). TDK does not offer auto recovery at all.

     

    Machine Speed Increase:

    Once again, as we introduce a new machine, we also have been able to increase the machine speed. The Radial II had a machine speed of up to 7,300 cycles per hour, the Radial III, 8,700 cycles per hour, the Radial IIIXQ, 9,000 cycles per hour, and now the Radial 5, with 9,200 cycles per hour. This slight speed increase was attained by some subtle changes to the machine and the manufacturing processes. The speed of 9,200 cycles per hour allows us to retain our position as the fastest Radial Inserter on the machine, (TDK’s VC7 with a speed of .39 sec/component–9,230 will not be introduced until the third quarter of 1994). By increasing our speed and maintaining our current pricing, we continue to position ourselves as the best price/performance Radial machine on the market. (Price/performance analysis using your customers data is available through the product teams.)

    New Machine Cover Package:

    When we looked at redesigning the machine cover package, we wanted to accomplish three things. We wanted a cover package with lines that appealed aesthetically, a consistent “look” with the VCD/Sequencer 3, and to aid the manufacturability of the machine.

    The new cover package features rounded edges and corners, along with an integrated pushbutton panel for a smoother, more modern look. The new VCD/Sequencer 3 and the Radial 5, now have the same cover package. This allows us to have a consistent look for our machines, especially when they are sitting side by side in a manufacturing line.

     

     
    Radial IIIXQ Enhancements

     

    I. – 70% fewer setup adjustments.
    – 56% fewer piece parts.
    – Larger component body diameters.
    – Increased reliability of component transfer from chain to chain
    to insertion head.
    – Clip locating at all component transfer points.

    Component Transfer Assembly:

    The component transfer assembly (CTA) on the Radial IIIXQ replaces the loader used on the Radial II and III machines. The CTA provides the same function as the loader did, namely moving components from the chain clip into the insertion head, but does so without the use of loader blades. The elimination of the loader blades and their associated setup and adjustment reduces the wearable tooling and the required adjustments in the loader area. (See Component Transfer Assembly (Drawing 1))
    Drawing here.

    Besides reduced setup and adjustment, the new CTA along with a redesigned guide jaw allows the Radial IIIXQ to insert components with 13mm body diameters and a height of 38.5mm as measured from center of tape feedhole to the top of the component. The new CTA also allows for rotation of 10 pin resistor networks by the insert head in 90 degree right, 0, or 90 degree left orientations, with the old loader there were rotational limitations.

    The Component Transfer Assembly also features clip locating similar to the clip locating found on the dispensing head. The clip locating combined with the smooth cam action (see drawing 2) of the CTA helps to ensure reliable component transfer from the carrier clip into the insert head.

    II. – 13mm Body Diameter Capability
    – Ability to run wider range of components.

    As mentioned earlier, there have been some changes to the insert head. The footprint of the insertion jaw was slightly elongated in the back to allow for 13mm body diameter capability. The 10.5mm insert head is still offered for those customers who have 10.5mm body diameter as their largest component, and required the smaller footprint for board density issues. For customers who only insert 5mm span components and require yet a smaller footprint, we still offer high density tooling, but the maximum body diameter is 9.0mm.

    Along with the modifications that were done to be able to run 13mm body diameter components, further modifications were done to the insertion jaw for all insertion heads to allow for more reliable insertion of a wider range of components. The area of the insertion jaw where the component leads are grasped has been polished at a 8 micro inch finish; any sharp corners/edges have been rounded. This, combined with the CTA transferring components into the head at a higher point allows us to run a wider range of components in terms of different standoffs on the bottom of the component and on the leads (such as box capacitors).

    III. – Superior clinch scrap lead removal.
    – Easier access to machine assemblies.

    Another area of the machine that has been enhanced is the clinch scrap lead removal system. This system clears lead scrap out of the cutter head. This new system features improved air flow through the cutter head due to an in-line vacuum transducer that is able to allow scrap material to pass through it. This allows for the transducer to be located closer to the clinch for superior air flow and scrap clearing characteristics.

    To further air in scrap removal, a hole has been added to the cutter head (see drawing 3). This hole allows for greater air flow through the clinch which aides in clearing scrap from the clinch.
    Drawing here.

    Along with the enhancements done to improve air flow through the cut and clinch, the scrap bowl was relocated to the back side of the cover door for easier access and the bowl was enlarged to allow for longer run times between bowl emptyings. With the scrap bowl mounted on the access panel door, a window was added (see drawing 4) so that the scrap level could be checked without removing any cover panels. Along with the scrap bowl being relocated, the cut and clinch valve pack was relocated; this was done to allow easier access to the clinch base.

    Drawing here.

    IV. – European Code Enhancements
    – Enhanced Tape Scrap Removal System
    – Enhanced Documentation

    The Radial IIIXQ also addresses the unique code issues of our European customers with a new “E” stop redundant interlock circuit on the inserter and sequencer covers. This new redundant interlock circuit features European code approved componentry including failsafe mechanical relays. A new light curtain cover package was also developed for European customers ordering non pass-thru machines. A new power disconnect lockout and main power circuit breaker was added to the machine (see drawing 4). Other enhancements were also done to the electronics of the machine that were not related to European code issues. Examples include new servo amplifier, new power supply, and the addition of a power conditioner.

    The tape scrap removal system and machine documentation were enhanced. The tape scrap removal system was designed with anti-static consideration in mind, such as different tubing material and a grounded scrap bin (see drawing 5). The machine documentation has added icons for clarification and has replaced some text with tables that are easier to use and understand (see attachment 1 and 2).

    Radial Historical Matrix

    Feature

    6346A/6348A

    Radial II

    6360A

    Radial III

    6360B

    Radial IIIXQ

    Benefit

    Machine Speed

    .5 Sec/Ins**

    (7,200/Hour)

    .41 Sec/Ins

    (8,700/Hour)

    .40 Sec/Ins

    (9,000/Hour)

    Higher throughput.
    Chain Clip Locating

    No*

    Yes

    Yes

    Reliability
    Soft Touch Pusher

    (STP)

    No*

    No

    No

    Higher throughput reliability.
    100 Station Sequencer

    No

    No

    No

    More components/input.
    Component Transfer Loader Blades

    Loader Blades

    Loader Blades

    Component Transfer

    Increased uptime/reduced wear tooling, fewer adjustments.
    Auto Recovery

    No

    No

    No*

    Higher PCB quality.
    Clinch Scrap Lead Enhancement

    No*

    No*

    Yes

    Increased uptime.
    Odd Form Capability

    Limited

    Yes

    Yes

    Increased component insertion capabilities.
    In-Line Sequencer Available

    No

    Yes

    Yes

    Manufacturing floor space.
    Single Pivot Clinch

    No*

    Yes

    Yes

    Increased uptime/longer tooling life, fewer adjustments.
    13mm Body Diameter Component Capability

    No

    No

    Yes

    Increased component insertion capabilities.
    Audible Low Part Warning

    Yes

    No

    Yes

    Audible as well as visual notification to operator.
    Tech Advisor

    (Available Std or Purchase)

    No

    No

    Yes*

    Provides on-line maintenance documentation and step-by-step troubleshooting procedures.
    CE Mark European Code

    No

    No

    No

    Compliant with European community safety standards.

     

     

     

     

     

    Feature

    6360C

    Radial 5

    6360D

    Radial 5

    6360E

    Radial 5

    6380A

    Radial 8

    Benefit

    Machine Speed .39 Sec/Ins (9,200/Hour) .39 Sec/Ins (9,200/Hour) .327 Sec/Ins (11,000/Hour) 0..22 Sec/Ins (16,0000/Hour) Higher throughput.
    Triple Span Radial

    No

    No

    Yes

    Yes

    Can insert either 2.5/5.0/7.5 mm span components, or 5.0/74.5/10.0 mm span components.
    Main Drive System Pneumatic Pneumatic Pneumatic DC Brushless Servo Significant reliability increase.  Lower noise level and higher machine uptime.
    Machine Controller

    DEC J11

    DEC J11

    DEC J11

    VME 68000

    Higher speed, higher resolution capable of running more machine features than the DEC J11.  Modern architecture supporting future developments.
    Man/Machine Interface

    UICS

    UICS

    UICS

    IM-UPS (Like GSM) USOS

    Windows, powerful color interface with CRT, keyboard, trackball, consistent with GSM products.
    Management Data Non-user friendly binary format Non-user friendly binary format Non-user friendly binary format Easily accessible management data Displays management data in graph form at the click of a button.
    Diagnostics Non-user friendly binary format Non-user friendly binary format Non-user friendly binary format Menu Driven Powerful IM diagnostics allow for easy troubleshooting and machine feedback.
    On Line Documentation

    No

    No

    No

    Yes

    Supports quick on-line retrieval of machine operating and maintenance information.
    Chain Clip Locating

    Yes

    Yes

    Yes

    Yes

    Reliability
    Soft Touch Pusher (STP)

    Yes

    Yes

    Yes

    Yes

    Higher throughput reliability.

    Feature

    6360C

    Radial 5

    6360D

    Radial 5

    6360E

    Radial 5

    6380A

    Radial 8

    Benefit

    100 Station Sequencer

    Yes

    Yes

    Yes

    Yes

    More components/input.
    Component Transfer Loader Blades Component Transfer Component Transfer Component Transfer Component Transfer Increased uptime/reduced wear tooling, fewer adjustments.
    Auto Recovery

    Yes

    Yes

    Yes

    Yes

    Higher PCB quality.
    Clinch Scrap Lead Enhancement

    Yes

    Yes

    Yes

    Yes

    Increased uptime.
    Odd Form Capability

    Yes

    Yes

    Yes

    Yes

    Increased component insertion capabilities.
    In-Line or Straight back  Sequencer Available

    Yes

    Yes

    Yes

    Yes

    Manufacturing floor space.
    Single Pivot Clinch

    Yes

    Yes

    Yes

    Yes

    Increased uptime/longer tooling life, fewer adjustments.
    13mm Body Diameter Component Capability

    Yes

    Yes

    Yes

    Yes

    Increased component insertion capabilities.
    Audible Low Part Warning

    Yes

    Yes

    Yes

    Yes

    Audible as well as visual notification to operator.
    Uninterruptable Power Supply Optional Optional Optional Standard Allow for proper machine shut down and uninterrupted operation in power unstable environments.
    Tech Advisor

    (Available Std or Purchase)

    Yes*

    Yes, standard.

    Yes, standard.

    No

    Provides on-line maintenance documentation and step-by-step troubleshooting procedures.
    Product Trainer

    No

    No

    No

    Operation Module Standard

    CD Rom Software that provides on-line training for basic machine operation.
    CE Mark European Code

    No

    Yes***

    Yes***

    Yes, In BHS Only

    (6388A)

    Compliant with European community safety standards.
    Sound level for a BHS package

    NA

    NA

    78 dba

    75 dba

    Quieter operation!
    4 Tier Light

    No

    Yes*

    Yes

    Yes

    Improved machine status information for more efficient machine operation.
    CD-ROM for software loading

    No

    No

    No

    Standard

    Allows for fast loading of software updates and on-line documentation.

     

    Comparative Matrix of Universal Radial 8 & the Panasonic RHS and RH III

    Feature

    Universal

    6380A6389A

    Panasonic

    RHS

    Panasonic

    RH III

    Insertion Rate

    16,000/Hour Constant Speed 14,400 Maximum  10,000 Maximum   (Speed slows depending on component type.)

    4 Axis Insertion

    Yes, by rotating insertion head and/or table.  Head rotates in three directions; -90, 0, and +90 degrees. Yes, the insertion head can rotate in four directions; 0, -90, +90, and 180 degrees. Yes, but optional.(Standard Only)

    0, 90 Degrees by Head

    Rotary Table

    Yes, 90 and 180 Degree Increments No – Head Rotates 3600 No

    Insertion Span

    2.5/5.0mm Dual Span2.5/5.0/7.5 or 5.0/7.5/10.0 Triple Span 2.5/5.0mm 2.5/5.0mm
    Maximum Body Diameter/Height (Height from center of feedhole to top of component.) 13.0mm/38.5mm 13mm/38mm 13mm/38mm
    Board Handling Transfer Time 3.5 seconds with BHS. “About 3 seconds” Approximately 4.5 to 6 seconds.

    Maximum Board Size

    457 x 508mm (NPT)406 x 457mm (PT) 381mm x 508mm 508mm x 381mm (NM 8225 A,B,C) 330mm x 250mm (NM 8224 A,B,C)

    Part Transfer Method

    Sequencer Sequencer Shuttle

    Number of Input Stations

    20, 40, 60, 80, 100 80 40, 62 (Single Shuttle)80 (Dual Shuttle)

    Component Taping Pitch

    12.7/15/25.4**/30mm** 12.7/15.0mm 12.7/15.0mm
    Odd Form Component Insertion Yes, at a constant rate of speed Yes, but at a derated insertion speed, dependent on component shape/size. Yes, but at a derated insertion speed,  dependent on component shape/size.

    Verification

    Yes, value polarity. No No

    Board Error Correction

    Yes, Standard Yes Yes

    Low Part Warning

    Yes, Standard No No

    Insertion Density

    Tooling effects footprint .5mm on all sides–use of guide pins allows for same insertion density capabilities regardless of component

    Auto Recovery

    Yes – Semi-Automatic Yes – Interrupt Recovery Enabled (Automatic supply recovery function) Yes – Fully Automatic

    Component Replenishment

    Any disp. Head location can be spliced w/o stopping the machine.

    Uninterrupted Power Supply

    Standard.  When the UPS detects a power interruption, it’s fully –charged battery can run the machine for up to 10 minutes. No No

    Language

    English is the main language, however Chinese is available for event messages Japanese/Chinese Japanese/Chinese

    Optical Safety Device

    Yes, Optional Yes Yes
    Machine Dimensions 20 Input Stations:W = 80 Inches (2032mm)

    D = 115 Inches (2921mm)

    H = 66 Inches (1676mm)

     

    100 Input Stations:

    W = 253 Inches (6426mm)

    D = 115 Inches (2921mm)

    H = 66 Inches (1676mm)

    80 Input Stations:W =Inches (3125mm)

    D = Inches (2210mm)

    H = Inches (1560mm)

    40 Input Stations:W = 151.97 Inches (3860mm)

    D = 62.6 Inches (1590mm)

    H = 63 Inches (1600mm)

     

    62 Input Stations:

    W = 168.5 Inches (4280mm)

    D = 65.74 Inches (1670mm)

     

    80 Input Stations:

    W = 203.1 (5160mm)

    D = 83.0 (2110mm)

     

    Radial 8 Competitive Matrix – Universal vs. TDK

    Comparative Matrix of Universal Radial 8 & TDK

     

    Feature

    Universal

    6380A/6388A

    TDK

    VC-21S

    TDK

    VC7C

    TDK

    VC7B

    Maximum Board Size 457 x 508mm (NPT), 406 x 457mm (PT) 400mm x 300mm (508mm x 381mm – Optional) 400mm x 300mm 400mm x 300mm
    Insertion Span 2.5/5.0mm 2.5/5.0 or 5.0/7.5 mm 2.5/5.0mm 2.5/5.0mm
    Cycle Rate 16,600 cph (0.22 sec./insert.)Constant Speed 15,000 cph (0.24 sec/insert), for X -Y movements under 30 mm (1.20”) 12,400 cph Maximum (Speed is dependent on component type.) 10,500/7,200/6,000 cph (Speed is dependent on component type.)
    Rotary Table Yes, 90 and 180 degree increments. No information No No
    Part Transfer Method Sequencer Sequencer Sequencer Sequencer
    4 Axis Insertion Yes, by rotating insertion head and/or table. Head rotates in three directions; -90, 0, and +90 degrees. Orientation: 0, +-90, 180 Head only rotates 0+90 (std).  Part is rotated for polarity at station prior to insertion head.  This is possible only with optional 4 direction reverse unit. Head only rotates 0+90 (std).  Part is rotated for polarity at station prior to insertion head.  This is possible only with optional 4 direction reverse unit.
    Number of Input Stations 20, 40, 60, 80, 100 40,80,120 40, 80, 120 40, 80, 120
    Operating system OS/2, IM-UPS Windows NT
    Languages English, Event messages available in: Chinese, Spanish, Polish,  French English, Japanese
    Verification Yes, value, polarity. No information Yes, optional. Yes, optional.
    Board Error Correction Yes, standard. No information Yes, optional. Yes, optional.
    Low Part Warning Yes, standard. No information Yes, optional. Yes, optional.
    Optical Safety Device Yes, optional. No information Yes, optional. Yes, optional.
    Maximum Body Diameter/Height (Height measured from center of feedhole to top of component.) 13.0mm/38.5mm 13.0mm / 26.0 mm 10.0mm/32.25mm 10.0mm/32.25mm
    Odd Form Comp Insertion – Stamp leaded parts including; potentiometers, tact switches, fuse clips, connectors. Yes, standard. No information Yes, but at a derated insertion speed which is dependent on component shape and size. Yes, but at a derated insertion speed which is dependent on component shape and size.

     

     

    Comparative Matrix of Universal Radial 8 & TDK (Continued) 

    Feature

    Universal

    6380A/6388A

    TDK

    VC-21S

    TDK

    VC7C

    TDK

    VC7B

    SIPs Yes, up to 10 pin. No information Yes, up to 9 pin.
    Lead Diameter Range .3mm – .7mm No information .4mm – .65mm
    Insertion Density Tooling effects footprint.* No information Tooling effects footprint.*
    Component Taping Pitch 12.7/15/25.4**/30mm** No information 12.7/15.0mm
    Auto Recovery Yes Yes No
    Board Handling Transfer Time 3.5 seconds on BHS equipped inserters. Approx. 2.5 sec. Approximately 4 seconds.
    Machine Dimensions 20 Input Stations:W = 2,032mm (80”)

    D = 292 mm (115”)

    H = 1,676mm (66”)

     

    100 Input Stations:

    W = 6,426 mm (253”)

    D = 292 mm (115”)

    H = 1,676mm (66”)

     

    40 Input Stations:L = 2,120 mm (83.5”)

    W = 1,980 mm (80”)

    H = 1,850 mm (73”)

     

    80 Input Stations:

    L = 3,580 mm(141”)

    W = 1,980 mm (80”)

     

    120 Input Stations:

    L = 5,100 mm (201”)

    W = 1,980 mm (80”)

     

    40 Input Stations:W = 5,870mm (231”) (Front)

    W = 2,890mm (114”) (Seq)

    D = 2,210 mm (87”)

    H = 1,390 mm (54.7”)

     

    80 Input Stations:

    W = 4,160 mm (164”)

    D = 2,210 mm (87”)

     

    120 Input Stations:

    W = 5,870mm (231”) (Front)

    W = 5,430mm (214”) (Seq)

    D = 2,210 mm (87”)

     

    Competitive Checklist – RH II vs. Radial 5

    RH II

     

     

    Radial 5

     

     

     

     

     

     

    62 Input, Single Shuttle

    X

    20-100 Input Sequencer

    Top Speed – 8,000 CPH

    X

    Machine Speed – 11,000 CPH; 37% Faster than Panasonic

    Automatic Recovery

    Automatic Recovery

    No electronic support system.

    X

    Electronic support system (Tech Advisor – Bi-Lingual).

    X

    Pin Method – High density insertion.  (Sell Around:  Pin method is complex and expensive, pins break.  See sell around section.)

    Guide Jaw – Provides positive control of the component leads; non-fragile.

    Small Machine Footprint

    Footprint is relative to cost/insertion.  UIC offers superior cost per insertion and two machine shapes.

    Machine speed can vary based on component type; 4,000, 6,000, 8,000 CPH.

    X

    Constant machine speed for all insertable components; 11,000 CPH.

    No parts checker.

    X

    Parts Checker (ERV)

    Optical Correction Unit

    Optical Correction Unit

    Competitive Checklist – VC7A or B vs. Radial 5

    VC7

     

     

    Radial 5

     

     

     

     

     

     

    25% faster than VC5.

    X

    Radial 5 is 19% faster than the VC7A or B.

    X

    Smaller machine footprint than the Radial 5.  (Sell Around:  Production capability per square foot.)

    The VC7A or B is only 4 square meters smaller; comparisons should be speed based.

    Four direction reversing unit.

    X

    The VC7A or B’s four direction unit slows the machine down.

    No electronic support system.

    X

    Electronic support system (Tech Advisor – Bi-Lingual).

    X

    Lead Reforming Unit (Sell Around:  Questionable performance.)

    No lead reforming unit.

    X

    Square Pin Inserter (Sell Around:  Significantly decreases throughput.)

    No square pin inserter.

    Optical Correction Unit

    Optical Correction Unit (BEC)

    Parts Checker

    Parts Checker (ERV)

    Bad Board Sensor

    Bad Board Sensor

    Three Lead Sensing Clinch (See sell around section.)

    X

    Only two lead sensing needed.

    Machine speed can vary based on components.

    X

    Two component transfer points.

    X

    120 station sequencer capability (40, 89, 120).

    100 station sequencer capability (20, 40, 60, 80. 100).

    10mm maximum body diameter.

    X

    13mm maximum body diameter.

    No auto recovery capability.

    X

    Auto recovery capability.

    PC Board Design Checklist

     

    For Through Hole Components

    This document should be used as a supplement to existing machine General Specifications and IM Design Guidelines.  This document is designed as a checklist rather than a reference for use when examining an existing or new product.  For detailed specifications refer to the appropriate General Specification.

     

    PC board considerations

    For Axial or Radial auto insertion:

     

    • Is the overall size of the board within specification?  (max/min size varies by machine and board handling type)
    • Is the board thickness within specification?

    Possible challenges:

    Radial can accept boards from 0.032” to 0.093” thick with no set up change, axial machines require mechanical adjustment to handle thickness variations.

    • If using automatic board handling, is the board shape acceptable?  (i.e. contiguous edges.)

    Possible challenges:

    Non-contiguous edges, may work but requires testing.  Example, instrument cluster.

    • Is the board a good candidate for panelization?  (i.e. creating multiple images of the same board on one panel for ease of assembly and increased throughput.)
    • Is the board warpage within specification?

    Possible challenges:

    Warpage can cause issues with insertion as well as clinch angle/length, especially on radial machine.

    • Does the PC board contain location reference holes to allow proper fixturing?

    Possible challenges:

    If product was previously hand assembled it may not have locating holes.

    • Are the components positioned at 0º and/or 90º with respect to the X axis?

    Possible challenges:

    Sometimes components are arranged at odd angles because of space constraints or because designer wanted to keep component body straight.  (example: ECCO board.)

    • Are the component hole diameters within specification for each component type (lead diameter) being inserted?

    Possible challenges:

    Boards currently hand assembled are most likely to have undersize holes.

    • Is there sufficient clearance below the board for the clinched component leads?  Consider the following:
      • Solder bridging to other component leads
      • Solder bridging to via holes or adjacent pads

    Note: Universal does not specify required clearance to prevent solder bridging, this should be determined by the customer.  However, obvious cases of conflict should be noted.

    • Is there sufficient clearance for the insertion and clinch tooling?  Take into consideration:
      • Previously inserted IM components
      • Previously placed SM components
      • Workboard holder locating and support fixtures
      • Obstructions on the bottom of the board that could interfere with the clinch or board transfer.

     

    Component and tooling considerations

     

    Axial

    • Are components packaged properly for automatic insertion?  (Tape and reel/ammo pack)

    Possible challenges:

    Customer may have “sample” components in bulk, are these components readily available in a taped format?

    • Is the component input tape width (i.e. 26mm or “standard”) compatible with the component hole span?

    Possible challenges:

    Universal does not offer a machine that can accept 26mm input.  Virtually all components are available in 52mm format, however, a subcontractor may have to deal with “kits” from an OEM that contain 26mm components.

    • Is the insertion tooling (i.e. 5mm, 5.5mm or standard) compatible with the component hole span?

    Possible challenges:

    Does the product include both very wide and very narrow span components?  Use tooling selection matrix to evaluate best tooling fit.

    • Is the component hole span compatible with the component body length?

    Possible challenges:

    Be especially careful when moving product from hand assembly to automatic assembly.

    • Is the component body diameter compatible with the board thickness and insertion tooling requirements?

    Possible challenges:

    Watch out for very thick boards and/or large diameter components.

    • Is the component lead diameter compatible with the insertion tooling?  (i.e. standard vs. large lead)

    Possible challenges:

    May have to sacrifice (to hand assembly) some insertions at either the large end or the small end of the spectrum.

    • Does the component require a stand off between the body and the PC board?  Components requiring a stand off cannot be inserted with an axial inserter, but may be auto insertable with a radial inserter if packaged in the proper format.

    Possible challenges:

    “Stand-off” type resistors are more common where high power handling is required, power supplies, monitors, etc.

     

    Radial

    • Are components packaged properly for automatic insertion?  (Tape and reel/ammo pack)

    Possible challenges:

    Customer may have “sample” components in bulk, are these components readily available in a taped format?

    • If components are packaged on tape, use the following “quick check” list to get a general idea of which components may be automatically inserted:  (See note 1 below)
      • Body diameter 13.0mm or less
      • “H” dimension (distance from centerline of feed hole to bottom of component) within acceptable limits
      • Lead diameter within acceptable limits

    Possible challenges:

    Radial taping specifications are quite involved, use “quick check” list as a sanity check, forward component samples to applications group for detailed evaluation.

    • Are the lead spans of the components compatible with standard automatic radial insertion?  (i.e. 2.5mm, 5.0mm, 7.5mm or 10.0mm)  (See note 2 below)

    Possible challenges:

    1)    May have to “sacrifice” some components to hand assembly because of tooling footprint issues or span requirements.

    2)    Some PCB’s contain components are non-standard span’s, i.e. 2.0mm, 4.0mm.

    • Are transistor leads in line? (i.e. not in a “triangle” configuration)
    • If the component is required to stand off the PC board, are features built into the component lead to accomplish this?

    Possible challenges:

    Board designer may “require” a certain type of standoff without checking to see if the package is readily available, common with LED applications.

     

    Notes:

    1)  The simplified guidelines were created to draw attention to the most common areas where components fall outside the limits for auto insertion.  These simplified guidelines should only be used as a general guide.  Component input must meet all criteria called out in the Radial General Specification.

    2)         Tooling selection will depend upon insertion span requirements as well as board density considerations.     Muniak98-052B  Revised 01-00

    Global Semiconductor Report

    Global Semiconductor Report

    New Trends Impacting Electronics Assembly

     

    Not only are the ubiquitous “smaller, cheaper, faster” drivers forever reshaping electronics, but the demand for multi-functionality and mobility is also fueling the convergence of the computer, telecommunications, and consumer markets.  Computer games can now be linked to the Internet. Cellular phones can be used to purchase soft drinks and send e-mail.  Bluetooth technology is making wireless data transfer possible for computer and consumer products.  With all of these changes in the products themselves, we can expect to see modifications in their manufacturing requirements.

     

    The increasing sophistication of electronics products is driving advances in a number of aspects of electronics assembly, from components and substrates to the materials and processes used in production. We can start to see new trends at the component level.  The explosion of the wireless market and increasing demands for advanced functionality in cellular phones have led to a steady rise in the number of components per phone within the same small space.  Due to the throughput and yield constraints these requirements place on cellular phone manufacturers, we are experiencing a resurgence of multi-chip modules.

     

    Because multi-chip modules can be pre-assembled and tested, performance issues affecting yield are typically resolved prior to production of the final product. Additionally, if a performance issue does arise with a multi-chip module, the module can be removed from the circuit and replaced without sacrificing the other components on the circuit board.

     

    In turn, the growing volumes of multi-chip modules are driving the need for much smaller (less than 1 mm) and thinner (less than 0.1 mm) dies as well as smaller capacitors (0201).  At the other end of the spectrum, microprocessors and high-end Asics are pushing die sizes above 400 square millimeters and pin counts above 2000 I/O’s. Wafer sizes are scheduled to migrate to 300mm, which will significantly impact all semiconductor-related equipment.

     

    On the substrate side of the package, new challenges arise as the demand for advanced packaging and high density rigid and flex substrates increases. Challenges associated with manipulating and imaging these novel carriers and ensuring accurate placement of fine pitch components, which can be compromised by solder mask registrations, are driving changes in equipment handling, illumination (see figure 1) and vision systems.

     

    Regarding process, flip chip and wafer level packaging present requirements for new fluxes, new underfills, and flux and underfill combinations with some level of particle fillers and new conductive adhesives. This translates into dispensing, vision and placement challenges for the assembly equipment.  Additionally, the regulatory push in Asia and Europe to eliminate lead will force the use of more lead free solders, whose higher reflow temperatures place more pressure on substrate materials and component reliability.  The drive to eliminate lead will also increase the use of conductive adhesives that require higher pressure and temperature during placement, greatly impacting machine throughput.

     

    In light of these challenges, what is the ultimate package?  Unfortunately, there is no ultimate package or silver bullet.  Everyone has a favorite BGA, CSP, and WLCSP “du jour” from different suppliers.  Today’s applications require different permutations of materials and processes, leading to a multiplicity of packages and form factors. The traditional boundaries between component (first level packaging) and card assembly (second-level packaging) have all but disappeared.

     

    To handle a myriad of different substrates and new process materials, placement equipment is facing new requirements for increased flexibility and more sophisticated vision systems and lighting schemes. To keep up with the volatility of the market, electronics manufacturers are looking to partner with suppliers that provide both placement equipment and process solutions for state-of-art assemblies, global supply capabilities and best-of-breed cost of ownership.

     

    Biography:

    Richard Boulanger is Vice President of the Advanced Semiconductor Assembly Division of Universal Instruments Corporation.  This business unit focuses on bare die and flip chip applications such as plastic and ceramic ball grid arrays, flip chip on flexible circuits and hybrid assemblies.

     

     

     

     

    [CAPTION, for figure 1, attached “BlueLight.jpg”]: New approaches to illumination are improving vision clarity and increasing placement accuracy on advanced substrates such as flexible circuits.