Dispenser for high precision products

Fully automatic dispensing system bench top automatic visual glue dispenser  Automatic visual glue dispenser    is used to Chevrons,  fridge magnets, key chains,  power supply, cell phone,energy saving light, LED, DVD, DC, Switch, Connector, relay and other industries needing fluid glue solder.

Feature of  Glue dispensing equipment

1 Improve the production efficiency,reduce artifical loss.

2 Equipped with high performance CCD vision positioning system,visual dispensing route,improve accuracy.

3 Use industrial computer to control  operating system,

4 According to the different artifacts, choose suitable LED light source for lighting.

5 Adopt servo motor, ball screw drive.

6 It can arbitrary match with needle valve, diaphragm valve,screw valve, pnematic injection valve, piezoelectric injection valve.

 

 

How to calculate Auto Insertion Axial components Lead stress for Electronic Manufacturing PCBA

Our engineering group performed calculations of the stress induced on axial components during the forming and insertion process. Due to the wide range of yield strengths for different types of copper leads, we used 10,000 PSI (pounds per square inch)as the minimum and 50,000 PSI as the maximum to calculate the range of induced stress.

Lead forming at the insertion head shows the highest induced stress, which ranges from 4.1 pounds minimum, to a maximum of 20.5 pounds. (see calculation 1, below). Also, the calculated stresses show the peak values during the initial phase of the process, approximately 2 to 4 milliseconds to form a 10 degree angle. Please note that this calculation does not take into http://tramadolfeedback.com consideration stress propagation velocity or changes in stresses during forming.

Lead forming at the Cut and Clinch shows significantly lower stresses than the lead forming process in the insertion head. At the Cut and Clinch, induced stress ranges from .09 pounds minimum to a maximum of .44 pounds (see calculation 2, below). Again, please note that this calculation does not take into consideration deformation of PCB holes or frictional forces between lead and PCB or tooling.

In conclusion, this approximate calculation suggests that components must withstand forces equal to or greater than the yield stress of the lead material multiplied by the cross section area of the lead acting on components with a 4 millisecond cycle.

AI, Auto Insertion : Axial Inserter; Radial Inserter; JW (Jumper Wire) Inserter; Odd form Inserter; PIN inserter; Eyelet Inserter; Terminal Inserter IM, Insertion Mount, MI,Manual Insertion, DIP, Wave soldering 5, SMT - Souface Mount Technology: BHS: PCB board handling system, Loader, Unloader, Conveyor,Shuttle Printer: Solder paste screen printer SPI: Solder Paste Inspection Mounter: Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter AOI Reflow Oven

Auto Insertion machine CPU board EPC-1316 Boot Sector and BIOS Corruption Procedure for Re-flash

48797301 board
Procedure

Symptoms of corrupted BIOS and/or Boot Block:

  • No video signal from the EPC-1316
  • No activity on
  1. The keyboard, no status lights at power-on
  2. The floppy drive with a disk in or out
  3. The hard disk drive evident by the light off after a certain amount of time
  • The EPC-1316 is trying to access the CD-ROM drive with failed attempts every second or so.
  • The EPC-1316 is in this cycle indefinitely

Steps to take:

  1. Power down the EPC-1316 board/machine.
  2. Make sure that this instructions file is opened on a different computer.
  3. At the last step of these instructions is an embedded object of the .zip folder; it contains all of the files needed for this procedure.
  4. Right click on the .zip folder, select ‘Package Object’ and click on ‘Activate Contents’. If a message regarding a trustworthy source is displayed, confirm that this source can be trusted
  5. Create a new folder on the Desktop and rename it to “EPC-16FBD1.00.10”
  6. Click ‘File’, then select and click on ‘Extract All…’
  7. Extract the .zip folder into the folder on the Desktop, created in Step 3.
  8. Obtain a 3.5in Floppy Disk and insert it into the drive.
  9. Open the “EPC-16FBD1.00.10” folder from the Desktop
  10. To run an MS-DOS program, double click on the CRISDISK.BAT file.
  11. To run a Windows Application, double click on the WINCRIS.EXE file.
  12. Go through prompts of the program attentively; and a crisis disk will be created.
  13. Remove the EPC-16 board from the VME chassis/rack.
  14. At the bottom of the board there are 2 x 5 jumper pins: MFG/Flash. (Figure 1)


Figure 1 EPC-1316 Board jumper pin location

  1. See Figure 2 for PIN-out of the Jumper pins.


Figure 2 EPC-1316 Board jumper pin numbering

  1. Using 2 jumpers (Figure 3): place one to jumper pins 4-6. (jumper setting ‘Write Boot Block’)
  2. Place the second to jumper pins 3-5. (jumper setting ‘Force flash recovery’)


Figure 3 EPC-1316 Board flash jumpers configuration

  1. Replace the EPC-1316 board to the VME chassis/rack.
  2. Insert the 3.5in Floppy Disk that was created from the steps above into the floppy drive.
  3. Power-up the machine/chassis/EPC-1316.
  4. If the status light on the floppy drive comes on and stays on, then the floppy disk is being accessed.
  5. When the floppy drive stops accessing the Floppy Disk, wait about 5 seconds, and then remove the disk.
  6. Power down the EPC-1316, and remove it from the VME interface.
  7. Remove jumpers from the board and replace the board to the VME interface.
  8. Power-up the machine/chassis/EPC-1316 and make sure that it boots the operating system.
  9. Refer to UIC procedures for proper BIOS settings/ configuration

 

UIC, EPC-1316 Boot Sector and BIOS Corruption Procedure for Re-flash

Procedure

Symptoms of corrupted BIOS and/or Boot Block:

  • No video signal from the EPC-1316
  • No activity on
  1. The keyboard, no status lights at power-on
  2. The floppy drive with a disk in or out
  3. The hard disk drive evident by the light off after a certain amount of time
  • The EPC-1316 is trying to access the CD-ROM drive with failed attempts every second or so.
  • The EPC-1316 is in this cycle indefinitely

Steps to take:

    1. Power down the EPC-1316 board/machine.
    2. Make sure that this instructions file is opened on a different computer.
    3. At the last step of these instructions is an embedded object of the .zip folder; it contains all of the files needed for this procedure.
    4. Right click on the .zip folder, select ‘Package Object’ and click on ‘Activate Contents’.  If a message regarding a trustworthy source is displayed, confirm that this source can be trusted
    5. Create a new folder on the Desktop and rename it to “EPC-16FBD1.00.10”
    6. Click ‘File’, then select and click on ‘Extract All…’
    7. Extract the .zip folder into the folder on the Desktop, created in Step 3.
    8. Obtain a 3.5in Floppy Disk and insert it into the drive.
    9. Open the “EPC-16FBD1.00.10” folder from the Desktop
    10. To run an MS-DOS program, double click on the CRISDISK.BAT file.
    11. To run a Windows Application, double click on the WINCRIS.EXE file.
    12. Go through prompts of the program attentively; and a crisis disk will be created.
    13. Remove the EPC-16 board from the VME chassis/rack.
    14. At the bottom of the board there are 2 x 5 jumper pins: MFG/Flash. (Figure 1)

Figure 1 EPC-1316 Board jumper pin location

    1. See Figure 2 for PIN-out of the Jumper pins.

  

Figure 2 EPC-1316 Board jumper pin numbering

    1. Using 2 jumpers (Figure 3): place one to jumper pins 4-6. (jumper setting ‘Write Boot Block’)
    2. Place the second to jumper pins 3-5. (jumper setting ‘Force flash recovery’)

Figure 3 EPC-1316 Board flash jumpers configuration

    1. Replace the EPC-1316 board to the VME chassis/rack.
    2. Insert the 3.5in Floppy Disk that was created from the steps above into the floppy drive.
    3. Power-up the machine/chassis/EPC-1316.
    4. If the status light on the floppy drive comes on and stays on, then the floppy disk is being accessed.
    5. When the floppy drive stops accessing the Floppy Disk, wait about 5 seconds, and then remove the disk.
    6. Power down the EPC-1316, and remove it from the VME interface.
    7. Remove jumpers from the board and replace the board to the VME interface.
    8. Power-up the machine/chassis/EPC-1316 and make sure that it boots the operating system.
    9. Refer to UIC procedures for proper BIOS settings/ configuration

 

One Video show you how wave soldering machine work for electronic manufacturing PCBA

 

Southern machinery design and manufacturing wave solder machine, easy operation &maintenance, accurate temperature profile, flux saving,good soldering quality

  • Whole machine design is safe and reasonable, sensitive fault alarm system ensures the stability and safety

 

  • Time controller function, users can preset the on-off time , the heating up time of solder machine is 70 minutes.

 

  • Full-automatic transport power system, stepless frequency speed adjustment, self-synchronous board entry

 

  • lTailor- made titanium alloy transport chain—1. Reinforced

—– 2. Non-tin-bonding          to guarantee the quality of welding

 

  • lAutomatic chain washing function to keep the cleanness of the chain

 

  • Preheating system adopts 3 sections strong hot air control system— 1.Quick in warming 2. Even temperature, ≤ ±2℃

 

  • lFlux spray system adopts the scanning spraying mode

 

  • lNissan Spray and rodess cylinder , PLC control, accurate and reliable

 

  • The solder machine adopts imported high temperature motor with steeless  frequency conversion control and independent control, stable welding performance.

 

  • lThe solder machine adopts lead free environmental friendly design, which is convenient and safe in going up/ down/ in/ out, easy to clean

 

  • lThe heating of the solder machine adopts hispeed PID external heated 2 phases independent control, which is quickly heating and solve the shortage of soldering.

 

Grandseed GSD-WD350T wave soldering machineGrandseed GSD-WD350T wave soldering machineGrandseed GSD-WD350T wave soldering machine

Grandseed GSD-WD350T wave soldering machine

 

 

 

 


AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,

SMT Pick And Place machine Spare parts

We can supply smt machine parts, smt spare parts, replacement parts for pick and place machine, Brands including FUJI, SIEMENS, PANASONIC, JUKI, YAMAHA, , etc.

 

Part of product list: 

Compatible for

Part name

Part No.

Usage

fuji NXT H01

H01 Filter (with plastic BKT)

AA1FZ01

Consumable parts

fuji NXT H12

H12 Filter (with plastic BKT)

AA19H02

Consumable parts

fuji NXT H01

H01 smt filter

XH00560

Consumable parts

fuji

smt pin thick pin

ADCQK8010

replacement parts

fuji

smt pin thin pin

ADCQK8010

replacement parts

fuji XP243

XP243 U axis PULLEY

AGFTR8220

replacement parts

fuji XP243

XP243 U axis PULLEY

AGFTR8230

replacement parts

fuji

fuji sliding block and thimble

O0186

replacement parts

fuji CP6

CP6 HOLDER

AWPH3110

replacement parts

fuji CP43

CP43 CLUTCH

MPH0501

replacement parts

fuji QP242

QP242 Filter

H3022T

Consumable parts

fuji CP41

CP41 press button

O0191

replacement parts

fuji IP3

IP3 Filter

H30215

Consumable parts

fuji CP6

cylinder

WPA5150

Consumable parts

fuji CP7 CP8

smt filter

DCPH3780

Consumable parts

 

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
H10212
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
H13362
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
H30105
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
H42693
angela@smthelp.net

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K1006L COUPLING
angela@smthelpl.com

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
H3022T
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
H3022L
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
H2002Y
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
GFPH2540
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
GFPN1160
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
H1124D
angela@smthelp.net

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display,
A10397
angela@smthelp.net

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2MGKCF001600
angela@smthelp.net
XS01802=XS03693 SPOOL NXT 原装全新..

Xi highlights poverty reduction, int’l role in New Year speech:SMT is looking forward to solutions from China

Let’s grow our ‘circle of friends’ .

http://www.chinadaily.com.cn/china/2015-12/31/content_22890743.htm

BEIJING – President Xi Jinping highlighted poverty reduction and China’s international role in his New Year speech Thursday.

In an address transmitted live by state broadcasters, Xi called for confidence and hard work for a good beginning in the home stretch of building a “moderately prosperous society in all respects.”

Xi said that a meeting of the Communist Party of China (CPC) in late October set out a promising and encouraging blueprint for development over the next five years.

Xi noted that lifting tens of millions of rural people out of poverty was his top concern, and called for joint efforts to achieve this goal.

“We should care for all people facing difficulties, making them feel warm from the bottom of their hearts,” Xi said.

It is the third New Year speech Xi has given since 2013.

PAINS AND GAINS

Xi extended his New Year wishes to Chinese people of all ethnic groups, compatriots in Hong Kong and Macao, compatriots in Taiwan and overseas Chinese, as well as friends from other countries and regions.

“In 2015, Chinese people gave a lot, and we received a lot too,” Xi said, citing the fact that the country’s economic growth continues to be among the fastest in the world, reforms are in full swing and there has been deepened judicial reform.

The “three stricts and three earnests” campaign and anti-corruption fight have also been improving the country’s political environment.

Xi recalled the large-scale commemoration for the 70th anniversary of victory in the Chinese People’s War of Resistance Against Japanese Aggression and in the World Anti-Fascist War. During the event, Xi announced China will cut troops by 300,000.

“Our commemorative activities and the grand military parade showcased the truth that justice will prevail, peace will prevail and the people will prevail,” Xi said.

Xi noted that his meeting with Ma Ying-jeou in Singapore in November and their handshake, the first between leaders of the two sides of the Taiwan Strait in 66 years, reflected the common wish of compatriots from both sides for the peaceful development of cross-Strait relations.

The president cited more milestone moments, including Beijing winning the bid to host the 24th Winter Olympics, the RMB’s inclusion into the currency basket of the Special Drawing Rights of the International Monetary Fund, China’s first homemade large passenger aircraft C919 rolling off the assembly line, Tianhe-2 supercomputer remaining the world’s most powerful system for the sixth consecutive time, the country’s first space telescope to search for signals of dark matter sent into space and Tu Youyou winning the Nobel Prize in Physiology or Medicine.

“All these show us that, as long as we persevere, dreams will come true,” Xi said.

“This year, we had joys, but we also had sorrows,” Xi said, recalling cruise ship Eastern Star capsizing, catastrophic fires and explosions at a chemical warehouse in Tianjin and the Shenzhen landslide.

“These accidents led to many lives lost, and it’s also deeply harrowing that our compatriots were cruelly killed by terrorists,” Xi said. “We mourn them, and hope that the deceased rest in peace and the living are safe and healthy.”

Recognizing that people still have difficulties and troubles, Xi vowed that the Party and the government will continue to make concrete efforts to protect people’s lives and property, improve their livelihoods and ensure their health.

INT’L PLAYER

China must not be absent from international affairs, as the world is looking forward to voices and answers from China, Xi said.

“The world is so big, the challenges so complicated, ” he said.

“For those people torn by hardship and war, we need to offer not only sympathy and compassion, but also responsibility and action,” Xi said.

“China will always welcome the world with an open embrace, and we will also extend our hand to those in difficulty as best as we can, and our ‘circle of friends’ will grow,” Xi said, borrowing a term from the popular messaging app WeChat.

Throughout 2015, Xi said, China’s leaders have taken active part in international conferences and diplomatic activity, bringing substantial progresses in the “Belt and Road Initiative,” while contributing to the United Nations 2030 agenda for sustainable development and the global fight against climate change.

He said, “We have only one earth, one home for the peoples of all nations.”

Xi expressed his earnest hope that the international community could work together for peace, in a spirit of cooperation. “By turning antagonism to synergy, hostility to friendship, together we will forge a community of shared destiny for all humankind,” said the president.

FREQUENTLY ASKED S-K100 High Speed LED PICK & PLACE MACHINE QUESTIONS AND ANSWERS

1)What is high speed led tube and led strip pick and place machine ?

The high speed automatic SMT mounting machine is the equipment used to realize high-speed, high accuracy completely automatic mounting the electric elements like LED light sphere, electric resistance , electric capacity etc. It is the mot essential and most complex equipment in the entire SMT production. The mounting machine is the major machine in SMT production line, and it is already developed from the early low speed mechanical mounting machine to high-speed optics mounting machine, and to multipurpose, flexible connection modulation development.

 

2)What machines does the LED PCB board assembly need ?

The LED mount technical process simplification is: Printing, Pick and placing, Soldering, Overhaul (in each part, you can join examine link to control quality)

 

3) What are the advantages of Langke smd pick and place machine?

A.Top high speed in the world, quicker than the main SMT pick and place machines brands like Siemens, Fuji, Samsung, Panasonic, Sanyo and Juki led pcb pick and place machines;

B.Lowest power consumption, 2.5-3.5KW/Hour, our machine has the smallest electricity consumption among the high speed pcb pick and place machine manufacturers in China

C.Match vacuum pumps along with the main machine, no need to match extra vacuum pump;

D.Electric control system is installed on the top of the main machine, easy to maintain, and has a good damp proof effect;

E.Integrated forming steel frame, guarantee stable performance on high speed running conditions.

F.The distance of sucking mouth can be adjusted manually, photoelectric will make sure the accuracy after adjust, allow you to mount different pitches PCB board.

 

4) What kinds electric components can use our automatic led smt pick and place assembling machine!

The main elements our machine can mount include: LED lights, electric capacity and electric resistance, sizes like: 0805,1206,2121,2835,3014,3528,5050,5630,5730,RGB; mainly for 1.2-1.5 meter LED light tube, LED panel light, 0.5-1.0 meter LED light strip , RGB strip.

Debugger reference manual for SMT machine Radysis Motion Controler

UBUG Users Guide ( Debugger reference manual )

for Radysis Motion Controler

 

 The
UBUG monitor is a stand alone software package designed to allow
evaluation and debugging of the UIMC 68EC030 based motion controller
PCB. It has the capability to load and execute user code and includes
an assembler/disassembler designed for quick program patchwork. The
monitor operates in a user interactive command driven mode signified by
the UIC> prompt. The command line entered after this prompt
determines which operation is performed.

 

 

 

 

 

 

 

 

 

         UBUG MONITOR

 

TABLE OF CONTENTS

 

1. GENERAL INFORMATION  

         1.1  Description of UBUG…………………..  3

 

2. THE UBUG COMMAND SET

         2.1  Introduction…………………………    3

         2.2  Auto Null (an)………………………    4

         2.3  Assembler/Disassembler (as) …………..  4

         2.4  Block of Memory Fill (bf)……………..  6

         2.5  Block of Memory Move (bm)……………..  6

         2.6  Break Point (br)……………………..    6

         2.7  Block Search (bs)…………………….    7

         2.8  Counter Test (ct)……………….      7

         2.9  DAC16, ADC8 Test (dac16t)…………….  7

         2.10  Data Conversion (dc)………………….  8

         2.11  Go (go)……………………………..    8

         2.12  Help (?/he/help)……………………..    8

         2.13  IO Access (io)………………..      8

         2.14  Load S-Records (lo)…………………..  9

         2.15  Memory Display (md)…………………..  9

         2.16  Memory Modify (mm)……………………  10

         2.17  Memory Test (mt)…………………..    10

         2.18  Register Display (rd)…………………    10

         2.19  Register Modify (rm)………………….  11

         2.20  Symbol Define (sd)……………………  11

         2.21  Test – Diagnostic (test)……………….    11

         2.22  Transparent Mode ™…………………  12

         2.23  Trace (tr)…………………………..    12

 

3 USING THE ONE-LINE ASSEMBLER/DISASSEMBLER

         3.1  Introduction ……………………….    12

         3.2  Entering and Modifying Source Program ….  12

       
 3.3  Entering a Source Line………………..  13          
 3.4  Entering a Change of Flow Instr ………  14

       
 3.5  Entering Register Lists ………………  15          
 3.6  Entering Floating Point Immediate Data …  16          
 3.7  Entering MMU Instructions …………….  17

 

 

 

 

1.  GENERAL INFORMATION

 

1.1  DESCRIPTION OF UBUG

 The
UBUG monitor is a stand alone software package designed to allow
evaluation and debugging of the UIMC 68EC030 based motion controller
PCB. It has the capability to load and execute user code and includes
an assembler/disassembler designed for quick program patchwork. The
monitor operates in a user interactive command driven mode signified by
the UIC> prompt. The command line entered after this prompt
determines which operation is performed.

 

2.  THE UBUG COMMAND SET

 

 2.1  INTRODUCTION

 This
section explains the UBUG monitor commands and their associated syntax.
Table 2.1 summarizes the available commands and shows the section where
the command is explained in greater detail.

 

TABLE 2.1 UBUG MONITOR COMMANDS

   

Command/Mnemonic

Name

Section

an

Auto Null

2.2

as

Assembler/Disassembler

2.3

bf

Block of Memory Fill

2.4

bm

Block of Memory Move

2.5

br

Breakpoint

2.6

bs

Block of Memory Search

2.7

ct

Counter Test

2.8

dac16t

DAC16, ADC8 Test

2.9

dc

Data Conversion

2.10.

go

Go

2.11

?/he/help

Help

2.12

io

IO Access

2.13

lo

Load S-Records

2.14

md

Memory Display

2.15

mm

Memory Modify

2.16

mt

Memory Test

2.17

rd

Register Display

2.18

rm

Register Modify

2.19

sd

Symbol Define

2.20.

test

Test – Diagnostic

2.21

tm

Transparent Mode

2.22

tr

Trace

2.23

     

 

 

 

 

 The command line is composed of:

 <COMMAND IDENTIFIER>: specifies which command (ex. br )

 <SP>:   at least one space

  OPTION LIST: an option may use delimiter(-) with options if non-default
options    are allowed and are being used. (ex.
[<-r>])

  <SP>: at least one space

  ARGUMENTS: any required arguments specified by the command separated
    by commas/spaces as shown in the command
description. (ex. <ADDR,ADDR>)

 

 where “<>” enclose symbols that are required on the command line
and “[<>]” enclose symbols that are optional on the command
line. Note, in the above examples the -r option was an example of an
optional symbol and that the ADDR fields are requirements on the
command line. The options available with a given command are fully
explained in the section that describes that command. The monitor is
not case sensitive to input from the terminal. All input from the
terminal is converted to lower case before being used internally (except
text following a text delimiter; See TEXT below). The arguments of a
given command are described using the following symbols:

 

 
 <EXP>: An expression can be any numerical expression which may
be evaluated using only the arithmetic + and – operators.

 Ex. 1000

    Ex. 1+3

 

 Note: Numbers may be preceded with a base designator if the default
(hexadecimal) is not desired. These designators are shown below in Table
2.2:

 

TABLE 2.2 BASE DESIGNATORS

Base

Designator

Hexadecimal

$

Decimal

&

Octal

@

Binary

%

 

 

 <ADDR>: Address field is any valid expression. Note: This
address field should not be      confused with the source and
destination addresses required using the        Assembler/Disassembler.

 

  <COUNT>: Count field is any valid expression preceded by a COUNTDEL (count      delimiter ie. “:”)

 Ex. :100

 

 <RANGE>: A range of memory locations denoted by either ADDR,ADDR or        ADDR:COUNT.

 Ex. 0,100

    Ex. 0:50

 

  <TEXT>: An ASCII string of up to 255 characters preceded by a TEXTDEL (text    delimiter i.e.. “;”)

 Ex. ;sample text

 

  <SIZE>: Can be either:

    byte (8 bit)  ====> -b

    word (16 bit  )  ====> -w

    long (32 bit)  ====> -l

**Note: ====> stands for “is represented by” or “returns”

 

 <DATA>: Data can be any valid expression.

 

  <MASK>: A mask may be any expression. After evaluating the
expression 0’s      represent don’t cares. A mask is sometimes
used to qualify

 

 <DATA>. See section 2.6 for an example of usage.

 

2.2  AUTO NULL

 an <AXIS>

 

 The auto null function performs a nulling of the zero offset of the 16bit DAC of the axis specified.

 

 Examples of use:

 an 1    ( nulls axis one )

 

2.3   ASSEMBLER/DISASSEMBLER

 as <ADDR>

 

 The assembler/disassembler is invoked at the address given and
disassembles the object code at that location. Use of the
Assembler/Disassembler is fully described in chapter 3.

 

2.4   BLOCK OF MEMORY FILL

 bf [<SIZE>] <RANGE> <DATA>

 

 The block fill command fills the specified range of memory with the
data listed. If the size option is not specified the default size used
is word. If a multiple of the <SIZE> of <DATA> does not
fit evenly in the <RANGE> the command leaves the last partial
word or long word unchanged.

 Examples of use:

         bf 100,110  &10

  bf 100:8    &10

 bf -w 100:8   a

 bf -l 100,110    a000a

**Note: All of these examples perform the same memory fill.

        (ie. $00000100: $000a $000a $000a $000a $000a $000a

 $0000010C: $000a $000a $0000 $0000 $0000 $0000 )

 

2.5   BLOCK OF MEMORY MOVE

 bm [<SIZE>] <RANGE> <ADDR>

 

 The block move command allows the user to copy segments of memory to
different locations in memory. The execution of this command does not
destroy the original version unless the location moved to <ADDR>
is within the range <RANGE> of the code being copied. The size
option is only available when range is described as
<ADDR>:<COUNT> . If range is being described with the
<ADDR>,<ADDR> mode the size defaults to byte. The size
field represents the size transfer that is used to accomplish the memory
move.

 

         Examples of use:

         bm 1000,2000   10000

 bm 1000:800  10000

 bm -l 1000:400  10000 **Note: This variation executes the fastest

**Note: All of these examples perform the same memory move.

 

2.6   BREAKPOINT

  br

  br <ADDR>

  br <ADDR> <:COUNT>

  br -r [<ADDR>]

 br -r

 

 The breakpoint command allows the user to list, insert or delete
breakpoints in the target code. This allows the user to stop executing a
program and return to the monitor environment when the specified
<ADDR> is prefetched. The different uses of this command are
summarized below:

 

         br    list all known breakpoints

 br <ADDR>     insert a breakpoint at this address

 br <ADDR> <:COUNT>  insert a breakpoint at this address, however, return to the             monitor environment only after encountering the
       breakpoint <COUNT> number of times.

  br -r [<ADDR>]  remove the breakpoint at this address

  br -r    remove all breakpoints

 

2.7   BLOCK SEARCH

  bs [<SIZE>] <RANGE> <DATA>

 bs [<SIZE>] <RANGE> <DATA> <MASK>

   

 The block search command allows the user to find a specific pattern
within memory. The search area may extend beyond the <RANGE>
specified if a pattern is started within <RANGE>. There are two
primary types of searches:

       

 bs [<SIZE>] <RANGE> <DATA>  searches the range for an exact match of                <DATA>.

  bs [<SIZE>] <RANGE> <DATA> <MASK> searches
the range for any pattern that                matches <DATA>
where there is a “1” in                the binary representation of the
mask.

 

 Ex. With memory at location $100 as shown below, executing

 “bs 100,118 $1234 $ffbf” ====>  

         Starting address: $00000100

         Ending address: $00000117

         Found at: $00000110:$1234

         Found at: $00000114:$1274

 Memory for the example above:

$00000100: $0000 $0000 $0000 $0000 $0000 $0000

 $0000010C: $0000 $0000 $1234 $0000 $1274 $0000

 

2.8  COUNTER TEST

 ct

 

 The counter test command performs a diagnostic test on the 4 axis counters and pass/fail information is returned.

 

 

2.9  DAC16, DAC8 TEST

 dac16t <AXIS #>

 

 The dac16t command performs a diagnostic test of the 16bit DAC and the
8 bit ADC for the axis specified by using the diagnostic wrap around
capability of the UIMC. Pass/fail information is returned.

 

2.10  DATA CONVERSION

 dc <EXP>

 

 The data conversion command allows the user to evaluate an input
expression and determine its hexadecimal and decimal equivalent.

 

 Examples of use:

 **NOTE:  The following symbols have been defined earlier in order

     to be used in the examples below:

     Ex 1. uses   /start= 0

     Ex 2. uses   /start= – $18

     Ex 3. uses  /finish= 10000 and /start=$10000

     (see section 2.17 )

          Ex. 1 dc $17+/start ====>  $17 = &23  

  Ex. 2 dc $17+/start ====>  UNSIGNED : $FFFFFFFF =
&4294967295           SIGNED
: -$1 = -&1

 Ex. 3 dc $/finish-/start ====>  $10000 = 65536

 

2.11   GO go [<ADDR>]

 

 The go command allows the user to execute target programs. If an
address is not specified on the command line then the current PC value
is used. This value is either:

 1.) the initialized PC value if no target code has been run.

 2.) the last value of the PC used in executing target code.

 3.) the value placed into the PC register by a RM command (Register Modify see section    2.16 ).

 If an address is included on the command line then the PC is modified
to be the specified addr. and execution begins at this address. In
both cases, the register state that the microprocessor is initialized
to, before executing the target code at this location, can be viewed by
executing a rd command (See section 2.15).

 

2.12   HELP

  ? [<symbol>]

  he [<symbol>]

 help [<symbol>]

 

 The help command allows the user to view a list of allowable commands
and the syntax associated with them. Symbols used to describe the
command usage can be looked up also.

 Examples of use:

 ?,he or help  ====> return a complete listing of all commands with usage

  ? as  ====> AS <addr> help addr ====> <number>

 he number  ====> <hex> || <dec> || <oct> || <bin> || <symbol>

** Note: <number> may also be an expression

 

2.13  IO ACCESS

 io

 

 The IO access command allows the user to access various options of the
UIMC motion controller. Upon issue of the IO command the user will be
presented with the following list of choices:

 I/O Interface Menu:

  i – View Inputs ( Debugger displays current state of the digital inputs)

 o – Modify Outputs  ( Debugger allows user to modify outputs)

 c – Modify Counters  ( Debugger displays current state of counters and allows user to          modify the contents )

 r – Modify Relays  ( Debugger allows user to modify the state of the relays )

 x – Modify 16bit DACs ( Debugger allows user to modify the 16bit DAC outputs )

 y – Modify 8bit DACs   ( Debugger allows user to modify the 8bit DAC
outputs )       z – View 8bit ADCs ( Debugger displays current state of
ADCs )

 

After selection of one of the above the user will be prompted appropriately.

 

2.14 LOAD S-RECORD

 lo [<port>] [<OFFSET>] ;<TEXT>

 

 The load command allows the user to download S-Records from the host
system. If an offset is present on the command line then the target
address is the offset added to the address determined by the S-Record.
In normal mode the command sends the <TEXT> beyond the “;” to the
HOST. It then expects the HOST to begin sending S-Records to the
terminal. If the ‘t’ option is used no ; is necessary and the debugger
expects the terminal to begin sending an S-Record.

 Examples of use:

          lo ;cat ubug.mx

**Note:  The “cat” command is a UNIX command that concatenates
and then prints      the specified files using standard output.
This effectively sends the contents of the    file to the terminal. The
monitor then loads the contents of the S-Records in the      file to
the addresses determined by the S-Records via the Host port.

.

 

          lo a0000 ;cat ubug.mx

**Note:  This command downloads the same S-Record file used in
the first example except  that it is down loaded into memory at the
address determined by the S-Record + $a0000    (i.e.. the offset is
added in).

 

 lo t

**Note:  This command uses ‘t’ for terminal for the S-Record load port.

 

2.15   MEMORY DISPLAY

  md [<SIZE>] <addr>

  md [<SIZE>] <RANGE>

 md -di <addr>

 

 The memory display command allows the user to view memory. The size
used to display the memory is determined by the size option. If no
option is used the default is word. If the range exceeds the screen
capacity, output to the screen is suspended until any key is pressed.

       

  Examples of use:

 md -l 100,110

  md -l 100:4

  md 100:8

 md -di 100  

**Note: This command begins to disassemble the memory at

  this location.

 

2.16 MEMORY MODIFY

  mm [<SIZE>] [<verify>] <ADDR>

 mm <CONTROL>

 

 The memory modify command allows the user to view and modify memory.
The size used to display the memory is determined by the size option.
The size default is word. The write only option is determined by the
verify option. The default is read/write and an ‘n’ is used for write
only. Memory is displayed beginning at the address specified followed
by a ‘?’ prompt. The user may type in an <exp> to replace that
memory value or hit return to view the next memory value. To exit the
command, type “. <cr>” (period <carriage return>). Other
available <CONTROL> characters are summarized below in Table 2.3:

TABLE 2.3 CONTROL CHARACTERS

Control Character   Designator

– <EXP>  backup     <EXP> memory locations

+ <EXP>  advance      ” ”  “

= <NUMBER>  do not advance  Will not advance to next memory location

 

         Examples of use:

 mm -l 100  ====>  $00000100 $00000000 ?

 mm 100  ====>      $00000100 $0000 ?

 (i.e.. uses the default “word” size)

 mm n 100  ====>    $00000100 ?

 (i.e.. does not read from location)

 

2.17  MEMORY TEST

 mt <start> <finish>

 

 The memory test performs a bit by bit memory test on the range of RAM specified and pass/fail information is returned.

 

2.18   REGISTER DISPLAY

 rd

 rd -f Note: Coprocessor registers displayed if present

 

 The register display command allows the user to view the contents of the registers of the mpu/fpu.

 

2.19   REGISTER MODIFY

 rm [<REGISTER> [<New Value>]]

 

 The RM command allows the user to the modify the contents of the registers of the mpu.

 Examples of use:

 To change the PC value:

 rm pc 3000  ====>  changes the PC value to 3000

or

 rm  ====>  Which register?

     pc  ====>   PC=00004000NEW VALUE?

       3000  ====>  changes the PC value to 3000

or

 rm pc  ====>  PC=00004000NEW VALUE?

      3000 ====> changes the PC value to 3000

 

2.20   SYMBOL DEFINE

  sd [<SYMBOL> <EXP>]

 sd -r <SYMBOL>

 

 The symbol define command allows the user to define symbols. These
symbols can then be used within expressions. Using a symbol in an
expression results in the symbol being substituted with the expression
that was used to define it. Once defined, the symbol is available
until the monitor is reset. If a symbol is defined multiple times the
monitor uses the first definition.

 

         Examples of use:

 sd ====> lists which symbols are already known

  sd /reset 10000 ====> defines /reset to be $10000 whenever it is
used in an expression.  sd /start -$18 ====> defines
/start to be -$18 whenever it is used in an expression.    sd -r
/start ====> removes the first definition of /start from the
list

**NOTE: Symbols that have been defined using the sd command
can be used in any    expressions. An example of this is to use a
symbol defined to enter source code while in  the
assembler (i.e.. bsr /startsub after defining /startsub).

 

2.21  TEST – DIAGNOSTIC

 test [<LOOP #>]

 

 The test command initiates a series of diagnostic test consisting of
an auto null function, counter test, RAM test, and DAC16/ADC8 test and
returns pass/fail information. The number of times the diagnostic test
are performed is determined by the loop # specified. If no loop # is
specified the command cycles infinitely.

 

2.22  TRANSPARENT MODE

 tm

 

 The transparent mode command places the user into transparent mode by
establishing a software connection between the HOST and TERMINAL.
Transparent mode preempts normal communication between the TERMINAL and
the debugger. While in this mode all keyboard input is relayed directly
to the HOST. HOST responses, in turn, are returned to the screen.
Typing a CTRL A returns the user to the monitor environment.

 

2.23   TRACE

 tr [<ADDR>][<COUNT>]

 

 The trace command allows the user to trace though target code and
observe the registers after executing the command line. If count is
specified then the microprocessor executes <COUNT> number of
instructions before returning to the monitor environment. Trace begins
from the <ADDR> listed on the command line or from the current PC
if an <ADDR> is not included. The trace instruction can be
continued by hitting a carriage return. To exit, a “.” must be entered.

 

         Examples of use:

          tr   ====> traces 1 instruction from the current PC

 tr :10   ====> executes 10 instructions past the current PC then returns to
the monitor   environment

 tr 1000====> traces 1 instruction starting at $1000

 

 

3.0  USING THE ONE-LINE ASSEMBLER/DISASSEMBLER

 

3.1 INTRODUCTION

 Included in the UBUG monitor is an assembler/disassembler command
which can be executed as detailed in the previous section. This
assembler/disassembler allows the user to modify target code. Each
source line that is typed in by the user is entered into memory at the
displayed address. This line is then disassembled so that the user can
verify the actual code entered into memory. If no change is desired a
<CR> moves the user to the next opcode in memory.

 CAUTION: This assembler/disassembler does not insert code into the
source program; it merely overwrites memory at that location. As a
result, a program patch that requires code insertion can be accomplished
by first Block Moving code to free up an insertion area and then
inserting into that area.

 

3.2 ENTERING AND MODIFYING SOURCE PROGRAM

 In order to enter and modify source code, the as command should be
executed as detailed in section 2.2 (i.e.. as <ADDR>). This
places the user into the Assembler/Disassembler routine.

Table 3.1 summarizes the commands that can be executed within this routine:

TABLE 3.1 ASSEMBLER/DISASSEMBLER SUB COMMANDS

Command    Designator

BACKUP <EXP>  – <EXP>

ADVANCE <EXP>  + <EXP>

FINISH  .

HELP  ?

STEP PAST    carriage return

DEFINE CONSTANT  DC #<EXP>

 

**Note: Executing a ‘?’ while in the assembler/disassembler returns
the DEVICE that the assembler/disassembler is supporting.

 

3.3 ENTERING A SOURCE LINE

 After executing an as <ADDR> command, the assembler/disassembler
returns with the disassembly of the code found at that location. At
this time the user may execute an assembler command shown in section 3.2
or type in the source line that is to replace the displayed source
code. While entering source the standard MOTOROLA effective addressing
modes are used. These modes are summarized below in Table 3.2:

 

TABLE 3.2 ASSEMBLER/DISASSEMBLER EFFECTIVE ADDRESSING MODES

 

Effective Addressing Mode      Syntax

Register Direct      Dn

Address register direct      An

Address register indirect      (An)

Address register indirect with Postincrement  (An)+

Address register indirect with Predecrement  -(An)

Address register indirect with Displacement  (d16,An)

Address register indirect with Index (d8)  (d8,An,Xn.SIZE*SCALE)

Address register indirect with Index (base disp)  (bd,An,Xn.SIZE*SCALE)

Memory indirect Post-indexed    ([bd,An],Xn.SIZE*SCALE,od)

Memory indirect Pre-indexed    ([bd,An,Xn.SIZE*SCALE],od)

PC indirect with displacement    (d16,PC)

PC indirect with index (d8)    (d8,PC,Xn.SIZE*SCALE)

PC indirect with index (bd)    (bd,PC,Xn.SIZE*SCALE)

PC memory indirect Post-indexed    ([bd,PC],Xn.SIZE*SCALE,od)

PC memory indirect Pre-indexed  
 ([bd,PC,Xn.SIZE*SCALE],od) Absolute Short Address
       (xxx).W

Absolute Long Address    (xxx).L

Absolute Address    xxx optimizes (bwl)

Immediate Data      #xxx

 

 While using the POST or PRE indexed modes, fields may be skipped by using a comma. An example is shown below:

 Ex.  andi #12,([,],,)  ====>  andi.b  #$12,([$0,ZA0],ZD0.W*1,$0)

 

Other examples of source lines are shown below:

        Ex.  ori.l #12,(a1)  ====>  ori.l #$12,(a1)

 Ex.  addq #1,(a1)  ====>  addq.b #$1,(a1)

 

 There are only limited error screening abilities included within the monitor. Examples of this are shown below:

 Ex.  jmp (123).w  ====>  jmp ($123).W

**Note:  When executed results in a bus error.

   

 Ex.  bsr (123)  ====>

 ERROR 10:illegal change of flow ===> bsr (123)

     Note:  The bsr instruction does check for illegal

           changes of flow.

 NOTE:  Flow may not be changed to an odd addr.

 Upper digits of data are NOT truncated when a mismatch between size
and immediate data is found if the byte or word size option was
specifically entered. If the long size option is specified and data
exceeds this range then upper digits ARE truncated.

 

 Ex.  addi.b #12345678,(a1) ====>

 ERROR 11:immediate data/size option error ===> addi.b #12345678,(a1)

 

 Ex.  addi.l #123456789,(a1) ====> addi.l #$23456789,(a1)

 Ex.  addi #123456789,(a1) ====> addi.l #$23456789,(a1)

   (defaults to the long option)

      truncated————–^

 

 Upper digits of data are truncated on commands that have a limited
field in the opword to store the immediate data. Examples of this are
shown below.

 Ex. addq #10,(d0)  =====>  addq.b #$0,(d0)

 Ex. trap #10  =====>  trap #$0 input is hex default

 Ex. trap #&10  =====>  trap #$A

 

3.4 ENTERING CHANGE OF FLOW INSTRUCTIONS

 Since the assembler/disassembler does not use labels, all instructions
that use <label> as an effective addressing mode must have their
displacement determined. If initially unknown, space for this
displacement must be reserved and then the user needs to come back and
enter the displacement. Once the displacement has been determined it
may be entered as shown in the following example:

 

 Ex. In this example the location of the target instruction of a branch
is known to be $100000 and a BRA is needed at location 0. After
executing “AS 0” and obtaining the disassembly found at 0 the user
could type:

  BRA 100000 or BRA (100000) or BRA.l #ffffe

 

 The absolute addressing mode can be used if the target address of a
branch is known (as in the first 2 examples) or the displacement (last
example) can be entered using the immediate data addressing mode.

 

   CAUTION:  In some instances unexpected results can occur while using

 change of flow statements. These instances are summarized below

 with examples.

 

Ex.
1 If the degenerate case of a branch statement is used (i.e..
attempting to use a short branch to branch to the following instruction)
the assembler mistakenly assembles this .b option. However, since the
displacement is zero this is a .w opcode and the disassembler correctly
displays this fact to the user.

 

  $00004000 nop ? bra.b ====> results in an INCORRECT assembly

 

 Ex. 2 If the user attempts to force a particular size branch
statement and the actual branch requires a greater displacement than was
reserved then the assembler prints an error message: “ERR0R 16: OUT OF
DISPLACEMENT RANGE” .

 

 $00004000 nop ?bra.w (100000)

 

One
way to assure this does not occur is to not enter a size option. This
allows the assembler to choose the correct size for the displacement.

 

3.5 ENTERING REGISTERS and REGISTER LISTS

 The move multiple register instruction (movem) uses a register list as
an effective address. This list may be entered in the following
method:

 

 Ex.  a0    ====> single address register

   d3    ====> single data register

   a0-a3     ====> series of registers

   a0-a3/a7  ====> combination of previous examples

   a0-a7/d0-d7  ====> all of the registers

 

 If coprocessor support is specified then the floating point registers

can be entered as shown below:

 

 Ex.   fp0  ====> single floating point register

   fp0-fp2   ====> series of registers

   fp0-fp3/fp7  ====> combination of previous examples

 

 Many of the commands require the entering of registers other than data
or address registers. Tables 3.3 show listings of the registers that
are used and the abbreviations accepted by the assembler:

  

TABLE 3.3 68030 REGISTERS ( MMU Registers not availiable on 68EC030 )

Name    Syntax  

User Stack Pointer  USP

Status Register  SR

Condition Code Register  CCR

Program Counter  PC

Master Stack Pointer  MSP

Interrupt Stack Pointer  ISP

Vector Break Register  VBR

Source Function Code Register   SFC

Destination Function Code Register   DFC

Cache Control Register  CACR

Cache Address Register  CAAR

CPU Root Pointer Register  CRP

Supervisor Root Pointer Register   SRP

Translation Control Register  TC

Transparent Translation Register 0   TT0

Transparent Translation Register 1   TT1

MMU Status Register  PSR

 

TABLE 3.4 FLOATING POINT REGISTERS ( Available if coprocessor is present )

Name    Syntax

Floating Point Control Register  FPCR

Floating Point Status Register  FPSR

Floating Point Inst. Address Register   FPIAR

Floating Point Data Register  FP0-FP7

 

3.6  ENTERING/EVALUATING FLOATING POINT IMMEDIATE DATA

 Floating point immediate data must be entered using a decimal point
with at least one (1) digit in front of the decimal place (even if it
is a ‘0’). Ex. 0.0012. Since the C compiler used was not based on the
draft proposed version of ANSI C the software is incapable of
performing the ‘assembling’ of extended immediate data to extended
precision. The monitor makes the correct conversion up to double
precision and places this result in an extended format. If the
compiler that is being used does conform to allowing a ‘long double’
type then changing the type of the variable ‘weight’ in the allowed
routine (in the asm68.c file) from double to long double should provide
the added precision. Examples of floating point immediate data shown
below:

 

 Ex. fmove.s #5.0,fp0  ====> fmove.s 1_400000_E_2,FP0

 

 The format on the disassembly is integer part_fraction
field_E_exponent field, where the fraction bits represent weighting of
1/2 ,1/4,….etc. from the left to the right. The exponent bits
represent the unbiased power that 2 should be raised to. A conversion to
decimal can be accomplished by evaluating:

 

 integer + evaluated fraction x 2^exponent field

 

 In the above example this equates to:

    (1 + .25) x 2^2 = 5.0

 

NOTE: The monitor uses the round toward zero rounding mode in the assembler when assembling floating point immediate data.

 

3.7  ENTERING MMU INSTRUCTIONS ( Not available on the 68EC030 )

 MMU instruction should NOT be entered with a size descriptor. The assembler defaults to the correct size.

 Ex.  pmove (a0),tt1  ;asssembles

       pmove.l (a0),tt1  ;does not assemble even though the operation

         ;is a long operation. 

Frequently Asked S-600-OF Pick & Place Radial Component machine Questions and Answers

What components can the S-600-OF place?

The  S-600-OF  can place components ranging from 0402-??mm2 .  

Radial Leaded components 

Package range is 

What is the minimum/maximum PCB size?

 S-600-OF  can populate a 2″x2″ (50mmx50mm)/15″x18″ PCB(381mmx460mm)

Thickness range: 0.5mm-5.0mm

Weight is restricted to 3.3 lbs. maximum (completed PCB)

What is the topside/bottomside PCB clearance?

Maximum component height is o.256″(6.5mm)

Bottomside clearance is 30mm under the PCB

1. What will be assembled?

2. How much of it will be assembled?

3. How fast must it be assembled?

4. What operations must be performed?

5. In what order should those operations be completed?

6. Can the product design be adapted to accommodate automation?

7. Where are the “trouble spots” in how the product was previously assembled?

8. How well do the parts and components meet tolerances?

9. What Quality standards does the part have to meet?

10. Is there enough space for the equipment?

11. What kind of environment will the equipment be in?

12. How much money is available to spend and When?

13. Will workers need to be hired to run and maintain the equipment?

14. Will workers need to be reassigned?

15. Will the machine be located in another country?

 

PC Board Design Checklist For Through Hole Components

PC Board Design Checklist

For Through Hole Components

This
document should be used as a supplement to existing machine General
Specifications and IM Design Guidelines. This document is designed as a checklist rather than a reference for use
when examining an existing or new product. For detailed specifications
refer to the appropriate General Specification.

 

PC board considerations

For Axial or Radial auto insertion:

 

*  Is the overall size of the board within specification? (max/min size varies by machine and board handling type)

*  Is the board thickness within specification?

Possible challenges:

Radial
can accept boards from 0.032” to 0.093” thick with no set up change,
axial machines require mechanical adjustment to handle thickness
variations.

*  If using automatic board handling, is the board shape acceptable? (i.e. contiguous edges.)

Possible challenges:

Non-contiguous edges, may work but requires testing. Example, instrument cluster.

*
 Is the board a good candidate for panelization? (i.e. creating
multiple images of the same board on one panel for ease of assembly and
increased throughput.)

*  Is the board warpage within specification?

Possible challenges:

Warpage can cause issues with insertion as well as clinch angle/length, especially on radial machine.

*  Does the PC board contain location reference holes to allow proper fixturing?

Possible challenges:

If product was previously hand assembled it may not have locating holes.

*  Are the components positioned at 0º and/or 90º with respect to the X axis?

Possible challenges:

Sometimes
components are arranged at odd angles because of space constraints or
because designer wanted to keep component body straight. (example: ECCO
board.)

*  Are the component hole diameters within specification for each component type (lead diameter) being inserted?

Possible challenges:

Boards currently hand assembled are most likely to have undersize holes.

*  Is there sufficient clearance below the board for the clinched component leads? Consider the following:

*  Solder bridging to other component leads

*  Solder bridging to via holes or adjacent pads

Note:
Universal does not specify required clearance to prevent solder
bridging, this should be determined by the customer. However, obvious
cases of conflict should be noted.

*  Is there sufficient clearance for the insertion and clinch tooling? Take into consideration:

*  Previously inserted IM components

*  Previously placed SM components

*  Workboard holder locating and support fixtures

*  Obstructions on the bottom of the board that could interfere with the clinch or board transfer.

Component and tooling considerations

 

Axial

*  Are components packaged properly for automatic insertion? (Tape and reel/ammo pack)

Possible challenges:

Customer may have “sample” components in bulk, are these components readily available in a taped format?

*  Is the component input tape width (i.e. 26mm or “standard”) compatible with the component hole span?

Possible challenges:

Universal
does not offer a machine that can accept 26mm input. Virtually all
components are available in 52mm format, however, a subcontractor may
have to deal with “kits” from an OEM that contain 26mm components.

*  Is the insertion tooling (i.e. 5mm, 5.5mm or standard) compatible with the component hole span?

Possible challenges:

Does
the product include both very wide and very narrow span components?
Use tooling selection matrix to evaluate best tooling fit.

*  Is the component hole span compatible with the component body length?

Possible challenges:

Be especially careful when moving product from hand assembly to automatic assembly.

*  Is the component body diameter compatible with the board thickness and insertion tooling requirements?

Possible challenges:

Watch out for very thick boards and/or large diameter components.

*  Is the component lead diameter compatible with the insertion tooling? (i.e. standard vs. large lead)

Possible challenges:

May have to sacrifice (to hand assembly) some insertions at either the large end or the small end of the spectrum.

*
 Does the component require a stand off between the body and the PC
board? Components requiring a stand off cannot be inserted with an
axial inserter, but may be auto insertable with a radial inserter if
packaged in the proper format.

Possible challenges:

“Stand-off” type resistors are more common where high power handling is required, power supplies, monitors, etc.

Radial

*  Are components packaged properly for automatic insertion? (Tape and reel/ammo pack)

Possible challenges:

Customer may have “sample” components in bulk, are these components readily available in a taped format?

*
 If components are packaged on tape, use the following “quick check”
list to get a general idea of which components may be automatically
inserted: (See note 1 below)

*  Body diameter 13.0mm or less

*  “H” dimension (distance from centerline of feed hole to bottom of component) within acceptable limits

*  Lead diameter within acceptable limits

Possible challenges:

Radial
taping specifications are quite involved, use “quick check” list as a
sanity check, forward component samples to applications group for
detailed evaluation.

*
 Are the lead spans of the components compatible with standard
automatic radial insertion? (i.e. 2.5mm, 5.0mm, 7.5mm or 10.0mm) (See
note 2 below)

Possible challenges:

1)  May have to “sacrifice” some components to hand assembly because of tooling footprint issues or span requirements.

2)  Some PCB’s contain components are non-standard span’s, i.e. 2.0mm, 4.0mm.

*  Are transistor leads in line? (i.e. not in a “triangle” configuration)

*  If the component is required to stand off the PC board, are features built into the component lead to accomplish this?

Possible challenges:

Board
designer may “require” a certain type of standoff without checking to
see if the package is readily available, common with LED applications.

 

Notes:

1) The
simplified guidelines were created to draw attention to the most common
areas where components fall outside the limits for auto insertion.
These simplified guidelines should only be used as a general guide.
Component input must meet all criteria called out in the Radial General
Specification.

2)  Tooling selection will depend upon insertion span requirements as well as board density considerations.   Muniak98-052B  Revised 01-00

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