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Auto Insertion machine CPU board EPC-1316 Boot Sector and BIOS Corruption Procedure for Re-flash

48797301 board
Procedure

Symptoms of corrupted BIOS and/or Boot Block:

  • No video signal from the EPC-1316
  • No activity on
  1. The keyboard, no status lights at power-on
  2. The floppy drive with a disk in or out
  3. The hard disk drive evident by the light off after a certain amount of time
  • The EPC-1316 is trying to access the CD-ROM drive with failed attempts every second or so.
  • The EPC-1316 is in this cycle indefinitely

Steps to take:

  1. Power down the EPC-1316 board/machine.
  2. Make sure that this instructions file is opened on a different computer.
  3. At the last step of these instructions is an embedded object of the .zip folder; it contains all of the files needed for this procedure.
  4. Right click on the .zip folder, select ‘Package Object’ and click on ‘Activate Contents’. If a message regarding a trustworthy source is displayed, confirm that this source can be trusted
  5. Create a new folder on the Desktop and rename it to “EPC-16FBD1.00.10”
  6. Click ‘File’, then select and click on ‘Extract All…’
  7. Extract the .zip folder into the folder on the Desktop, created in Step 3.
  8. Obtain a 3.5in Floppy Disk and insert it into the drive.
  9. Open the “EPC-16FBD1.00.10” folder from the Desktop
  10. To run an MS-DOS program, double click on the CRISDISK.BAT file.
  11. To run a Windows Application, double click on the WINCRIS.EXE file.
  12. Go through prompts of the program attentively; and a crisis disk will be created.
  13. Remove the EPC-16 board from the VME chassis/rack.
  14. At the bottom of the board there are 2 x 5 jumper pins: MFG/Flash. (Figure 1)


Figure 1 EPC-1316 Board jumper pin location

  1. See Figure 2 for PIN-out of the Jumper pins.


Figure 2 EPC-1316 Board jumper pin numbering

  1. Using 2 jumpers (Figure 3): place one to jumper pins 4-6. (jumper setting ‘Write Boot Block’)
  2. Place the second to jumper pins 3-5. (jumper setting ‘Force flash recovery’)


Figure 3 EPC-1316 Board flash jumpers configuration

  1. Replace the EPC-1316 board to the VME chassis/rack.
  2. Insert the 3.5in Floppy Disk that was created from the steps above into the floppy drive.
  3. Power-up the machine/chassis/EPC-1316.
  4. If the status light on the floppy drive comes on and stays on, then the floppy disk is being accessed.
  5. When the floppy drive stops accessing the Floppy Disk, wait about 5 seconds, and then remove the disk.
  6. Power down the EPC-1316, and remove it from the VME interface.
  7. Remove jumpers from the board and replace the board to the VME interface.
  8. Power-up the machine/chassis/EPC-1316 and make sure that it boots the operating system.
  9. Refer to UIC procedures for proper BIOS settings/ configuration

 

UIC, EPC-1316 Boot Sector and BIOS Corruption Procedure for Re-flash

Procedure

Symptoms of corrupted BIOS and/or Boot Block:

  • No video signal from the EPC-1316
  • No activity on
  1. The keyboard, no status lights at power-on
  2. The floppy drive with a disk in or out
  3. The hard disk drive evident by the light off after a certain amount of time
  • The EPC-1316 is trying to access the CD-ROM drive with failed attempts every second or so.
  • The EPC-1316 is in this cycle indefinitely

Steps to take:

    1. Power down the EPC-1316 board/machine.
    2. Make sure that this instructions file is opened on a different computer.
    3. At the last step of these instructions is an embedded object of the .zip folder; it contains all of the files needed for this procedure.
    4. Right click on the .zip folder, select ‘Package Object’ and click on ‘Activate Contents’.  If a message regarding a trustworthy source is displayed, confirm that this source can be trusted
    5. Create a new folder on the Desktop and rename it to “EPC-16FBD1.00.10”
    6. Click ‘File’, then select and click on ‘Extract All…’
    7. Extract the .zip folder into the folder on the Desktop, created in Step 3.
    8. Obtain a 3.5in Floppy Disk and insert it into the drive.
    9. Open the “EPC-16FBD1.00.10” folder from the Desktop
    10. To run an MS-DOS program, double click on the CRISDISK.BAT file.
    11. To run a Windows Application, double click on the WINCRIS.EXE file.
    12. Go through prompts of the program attentively; and a crisis disk will be created.
    13. Remove the EPC-16 board from the VME chassis/rack.
    14. At the bottom of the board there are 2 x 5 jumper pins: MFG/Flash. (Figure 1)

Figure 1 EPC-1316 Board jumper pin location

    1. See Figure 2 for PIN-out of the Jumper pins.

  

Figure 2 EPC-1316 Board jumper pin numbering

    1. Using 2 jumpers (Figure 3): place one to jumper pins 4-6. (jumper setting ‘Write Boot Block’)
    2. Place the second to jumper pins 3-5. (jumper setting ‘Force flash recovery’)

Figure 3 EPC-1316 Board flash jumpers configuration

    1. Replace the EPC-1316 board to the VME chassis/rack.
    2. Insert the 3.5in Floppy Disk that was created from the steps above into the floppy drive.
    3. Power-up the machine/chassis/EPC-1316.
    4. If the status light on the floppy drive comes on and stays on, then the floppy disk is being accessed.
    5. When the floppy drive stops accessing the Floppy Disk, wait about 5 seconds, and then remove the disk.
    6. Power down the EPC-1316, and remove it from the VME interface.
    7. Remove jumpers from the board and replace the board to the VME interface.
    8. Power-up the machine/chassis/EPC-1316 and make sure that it boots the operating system.
    9. Refer to UIC procedures for proper BIOS settings/ configuration

 

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Product Description

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PCBA Quality Process Audit — SMT Pick and Place machine

1. Work Instructions
1.1 Is there a revision controlled Operator Work Instruction which contains loading information for the specific product being built? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
1.2 Are Work Instructions readily available to the operator and are they followed at Component Placement?
1.3 Are component part numbers and descriptions included on the Work Instructions?
1.4 Are component descriptions sufficiently detailed to check at first-article that the correct components are being used?
1.5 Is the machine head/slot number for component loading specified for each part number on Work Instructions?
1.6 Are the reference designators and the quantity per part number specified on Work Instructions?
1.7 Is the component feeder type/size specified on Work Instructions or otherwise for each component package type?
1.8 Is the machine Program Name specified on the Work Instruction or line set-up instructions?
2. Component Loading and Verification
2.1 Is there an automated bar coded component loading verification aid in order to reduce the probability of incorrect loading? Note*
2.2 Are the component loading verification aids hard linked to the placement program so that loading is verified against program data?
2.3 Can traceability of component lot codes be demonstrated for critical devices?
2.4 Is component loading/changes verified and cross checked by an individual other than the set-up operator at product changeover? Note*
2.5 Is a component loading/changes verification log signed by the set-up operator and countersigned by the cross checker before start up? Note*
2.6 Is the correct feeder loading base used to facilitate real to feeder loading?
2.7 Are first-built boards verified against documentation for missing/misplaced components and for correct component polarity?
2.8 Are first-articles conducted using AOI methods and complemented with description verification and value metering?
2.9 Are all Resistors & Capacitors measured for a value within the tolerance (one per part number) at first-article & at reel change?
2.10 Is a first-article log signed to verify acceptance before start up?
2.11 Is the orientation of Tantalum SMT capacitors, Diodes, etc in tape format, standardized and documented for polarity orientation?
2.12 Is the IC tray loading polarity standardized for each type of polarity indicator that can be used for each component?
2.13 Is loading polarity referenced both from the tray and the component so as to ensure retrayed components are correctly loaded?
3. Nozzles, Feeders, and Tooling
3.1 Is there a document which details the standardized nozzle diameter set-up selected for each type of placement equipment?
3.2 Are these standardized nozzle diameter set-up documents readily available for when nozzles need to be replaced or changed?
3.3 Is there a document which details the range of component XYZ body sizes that each selected nozzle type can successfully place?
3.4 Is there a documented requirement to conduct daily nozzle centering and is there evidence that this is done?
3.5 Is each feeder identified with its own unique serial number?
3.6 Is there a documented and effective Feeder Maintenance Program? Records (s/w or otherwise) must be by Feeder Serial Number.
3.7 Are database records maintained for each feeder serial number for the purpose of tracking its maintenance history and performance?
3.8 Is feeder maintenance history used to monitor feeder life so that problematic feeders can be removed from the process?
3.9 Can it be demonstrated that the number of feeder indexes is counted & monitored for each unique feeder using software or otherwise?
3.10 Is this information used to flag that feeder preventative maintenance is required after x number of indexes?
3.11 Is there a documented requirement to indicate that Blocks or Support Pins are needed for specific products?
3.12 Is the No, location, type and height of Support Blocks/Pins identified on a product by product basis? Score NA if in 3.11 there are not needed.
3.13 Are the Support Pin locations identified for each product using templates/tooling or some other effective solution? Comment as above.
4. Moisture Sensitive Devices
4.1 Are components stored before loading and after unloading in a manner which prevents damage?
4.2 Are the Moisture Sensitive Devices (MSDs) and their sensitivity level readily known to the operator?
4.3 Are MSDs time stamped at opening and their exposure time monitored against pre determined limits?
4.4 Is there a flag to indicate that the exposure time has been exceed for any given device in a dry box?
4.5 Is there a flag to indicate the MSD exposure has expired for any MSD device currently loaded in the placement machines?
4.6 Have MSD procedures been updated to reflect the JEDEC standard for MSD control? (J-STD-033A MSD released in July 2002)
4.7 Is there evidence of correct implementation of J-STD-0033A for all MSD devices?
4.8 Are there MSD procedures in place to ensure MSD shelf life is reduced based on measured Relative Humidity conditions?
4.9 Is there a method in place to address the time spent in dry storage and its effect on remaining life based on MS Level and RH Level?
4.10 Is it clearly understood that MSD ‘shelf life’ continues to degrade during dry cabinet storage of some MSD devices?
4.11 If MSDs are on both sides of a PCBA, is there an effective method to account for time between 1st and 2nd reflow?
4.12 Can MSD control be demonstrated for MSD devices that need internal/external pre-programming?
4.13 Can MSD control be demonstrated for rejected devices and devices used for rework?
4.14 Have MSD recovery methods been defined and adequate for all component types?
4.15 Does the control of Moisture Sensitive Components include those components on reels?
4.16 Is the baking or hot room storage time and temperature documented and controlled for component recovery?
4.17 Has this time and temp been determined based on the component supplier’s guidelines / J-STD-0033A?
4.18 Is there evidence to demonstrate that the control process for MSDs is in use and is effective?
5. Machine Capability
5.1 Are Component Placement Programs generated from CAD XY coordinate data?
5.2 Is there a standardized nomenclature for Shape Code definition?
5.3 Can this nomenclature be used to determine the most appropriate shape code to allocate to a given part of given dimensions?
5.4 Are localized fiducials used for fine pitch devices when localized component fiducials exist on the board?
5.5 Has manual component moving been eliminated given correct CAD, nozzle set-up, Shape Code allocation, local fiducials, Cam speed, etc?
5.6 Does the Fine Pitch placement machine have the capability to check lead Coplanarity in xyz?
5.7 Does the Fine Pitch placement machine use its coplanarity capability on all leads of 20 mil pitch or less, and all programmed parts?
5.8 Does the Fine Pitch placement machine have the capability to check ball arrays? If no such device, score NA.
5.9 Does the Fine Pitch placement machine use its ball array verification capability for all BGA devices? If no such device, score NA.
5.10 Is the machine Program Name revision controlled to show traceability of program changes?
5.11 Is the machine Program Name traceable to the PWB and PCBA part number?
6. PCBA
6.1 Are outputted boards at least sample inspected pre reflow for placement positional accuracy for machine control purposes?
6.2 Is the frequency for this verification defined and documented, and is there evidence to suggest it is followed?
6.3 Is there a visual aid available which identifies the populated locations with polarity, and also the no-pop locations?
6.4 Is there a placement standard pre reflow to validate placement accuracy for the shape code, nozzle allocation, etc. parameters used?
6.5 Is there evidence to demonstrate that action is taken to adjust the machines performance for when this standard is exceeded?
7. Attrition Rates and Rejected Components
7.1 Is attrition rate monitoring conducted systematically to ensure feeder and/or nozzle problems are captured at least hourly?
7.2 Is there documented evidence to ensure attrition rates are checked and actioned at least hourly to ensure process control?
7.3 Is there a specification defined for acceptable attrition rates for the individual feeders?
7.4 Is there a specification defined for the maximum allowable number of nozzle skips per machine before it is shut down for repair?
7.5 Are these specifications determined based on a percentage combined with the number of placements for a given time period?
7.6 Is there evidence to demonstrate that attrition rate monitoring is conducted, effective, and used to make process control decisions?
7.7 Is there a documented process for the disposition or reuse of machine rejected components? Rs and Cs must not be reused even for rework.
7.8 Are rejected components reviewed and repaired to ensure conformance before reuse, even if only used for rework?
7.9 Are there repair blocks available or a lead conditioner in use for repairing ‘real’ Coplanarity rejects? Score 0 if parts not repaired.
7.10 Does the re-traying process always ensure that component polarity wrt the tray and the component loading polarity is preserved?
7.11 Is there a documented Process Deviation procedure to manage machine skips for hand placement if hand placement is allowed?
8. Process Capability
8.1 Has a Process Capability Analyses (PCA) been conducted and the Cpk acceptable for the suite of shape codes in use?
8.2 Were shape code allocations, component nozzle allocations, cam speeds, etc. recorded for this PCA?
8.3 Are the recorded shape code allocations, component nozzle allocations, and cam speeds, the same as those used today?
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SMT Lead-Free Reflow Over S-R1000 for electronic manufacturing PCB assembly

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CatchBDD7(02-01-(02-01-11-12-19)

 

 

Features:

1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be more than 99.99%.

2.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ ambient temperature to a temperature stabilization .

3.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display.

4.Cooling System: new cooling zone, quick and easy adjustment, easily reach the cooling requirements of different slopes.

5.Temperature protection: using third-party over-temperature protection, multiple layers protection to ensure safe operation.

6.Products comply with CE, CCC, UL , other standards and specifications.

7.User-friendly design: fault detection (such as heaters abnormal alarm, etc.), regular maintenance reminders, the economy functions and tool-free maintenance, reducing equipment failure rates.

8.Heating module: Transverse reflow design makes temperature from each zone is not influenced by neibour to ensure accurate temperature curve, while ensuring a high production capacity and heat exchange capacity to achieve high adaptability (to meet the soldering of automotive, communications, electronics, computers and mobile phones consumer electronics.)

9.Hot air motor with independently inverter controlled, set operating frequencies depending on different technology to meet a variety of lead-free processes.

10. Machine using zero gas source design, furnace cover with motor lifting, safety rod support, providing significant security.

11.Main parts:Imported main parts ensure equipment runs smoothly and lower the maintenance cost.

12. Customers can choose optional flux processing system according to their own production features  to ensure furnace chamber clean.

13.Closed-loop transmission speed control systems, transportation accuracy ± 2mm / min, ensuring more stable transmission speed.

14.Central support, dual transmission, external water cooling system is optional.

TOP Advantage:

1.Simple: combined with advanced international concepts, based on the Oriental-designed operating system, easy to understand, easy to learn, easy to maintain.

2.Expertise: learn imported reflow oven’s advanced design concepts, and the machine core components are using imported top brands.

3.Hedging: Import hardware configuration,low failure rate in production,more than a decade service life.

4.Safety: Based on the general rules of international design, close to imported reflow rating, the highest security level.

5.Stable: mature software, hardware and top production processes ensures stability of each equipment.

Application  

Widely used in high precision products like 01005-QFP, BGA, CSP, Flip,and POP ,automotive electronics, mobile devices, home appliances, communications, LED, semiconductor and other industries.

Specification:

 

Southern Machinery  Reflow Oven Specifications
S – Standard, O – Option, M – Manual, A – Auto, N/A – Not Availible)
Specifications S-R800 S-R1000 Specifications E8 E10
Dimension (L*W*H)mm 5310x1353x1490 6100x1353x1490 Board Dropped Alarm S S
Standard Color Computer Grey Computer Grey Electrical SMEMA Interface S S
Weight Approx.2150KG Approx.2400KG Computer Lenovo Lenovo
Number Of Heating Zones Up8/Bottom8 Up10/Bottom10 Max.Width Of PCB 400mm 400mm
Length Of Heating Zones 3121mm 3891mm Temperature Deviation on PCB ± 1.0℃ ± 1.0℃
Rail Width Adjustment A and M(Multi mode) A and M(Multi mode) Max. Temp. Gap Between Preheat Zones Setting 40℃ 40℃
Rail Number 1 Lane or 2 Land 1 Lane or 2 Land Temperature Control Precision ± 1.0℃ ± 1.0℃
Exhaust Volume 10M3/minx2 Exhausts 10M3/minx2 Exhausts Conveyor Height 900+/-20mm 900+/-20mm
Control System PLC+Computer PLC+Computer Length Of Cooling Zones 600mm 600mm
Transmission Agent  Chain + Mesh  Chain + Mesh Center Support O O
Electric Supply Required 3phase,380V 50/60Hz 3phase,380V 50/60Hz Siemens PLC S S
Power For Warm Up 30KW 36KW Lubrication Auto-Afflux S S
Power Consumption 8KW 12KW Ups S S
Warming Time Approx.25 minute Approx.25 minute Temp. Thermocouple Slot S S
Temp. Setting Range Room Temp.– 300℃ Room Temp.– 300℃ Driven Top Hood Opening A A
Oil Supply A and M(Multi mode) A and M(Multi mode) Temperature Control Method PID + SSR S S
Conveyor Speed Range 300~2000mm/min 300~2000mm/min Number of Cooling Zones 2 2
Components Clearance Top/ Bottom is 25mm Top/ Bottom is 25mm On Line Editing S S
Conveyor Direction L→R (Option: R→L) L→R (Option: R→L) Max.Temp.Gap Between Preheat & Reflow Setting 80℃ 80℃
Commutated Element Aluminum Alloy Plate (8mm) Aluminum Alloy Plate (8mm) Max. Temp. Gap Between Reflow Zones Setting 50℃ 50℃
Fixed Rail Side Front Fixed  (Option:Rear  Fixed) Front Fixed  (Option:Rear  Fixed) Process Data & Status Storage S S
Cooling Method Forced-Air Motor and fan (Standard) Forced-Air Motor and fan   (Standard) Temperature Alarm S S

 

 

Independent Upper and Lower PID Temperature Controls

Independent Upper and Lower PID Temperature Controls for Each Heating Zone Permit Precise Temperature Profiling

S-R1000’s heating zone temperature controllers have an accuracy of ±1°C and, in conjunction with a high-speed blower adjacent to each heat source for maximum convection, ensure a ΔT of ±2°C across the PCB assembly. The Series diffuser design provides low-velocity, low-turbulence air flow to prevent component shift or disturbance.

Optional thermocouples can be attached at critical locations on the PCB and connected to three built-in inputs (standard) on the oven for communication with  control software for accurate, real-time temperature profiling to match any solder paste manufacturer’s specifications.

CR-10000 SMT Reflow Oven Pin over mesh conveyor

Pin-Over-Mesh Conveyor Meets Virtually Any Product Specification or Production Requirement

The S-R1000 is supplied as standard with an adjustable-rail, pin-type conveyor system that handles PCBs up to a maximum of 450 mm (17.7″) installed over a 570 mm (22″) stainless-steel mesh belt. The pin conveyor permits inline and double-sided processing. The mesh belt is ideal for fast changeovers.

To eliminate the possibility of jamming or dropped PCB assemblies, all components are constructed of high-quality, high-strength, stainless steel and are built to maintain dimensional tolerances at the high temperatures of lead-free processing.

Advanced automatic chain lubrication and motorized width adjustment are standard features on the pin conveyor. Automatic width adjustment of the pin conveyor, based on the parameter settings for specific reflow programs, is available as an option. For processing of larger PCBs at higher lead-free temperatures, a center support system is available to prevent board warpage.

Conveyor speed is programmable from 400-1800 mm (16″-71″) per minute to accommodate any process requirement.

Nitrogen Atmosphere Compatible Models Widen Lead-Free Processing Window Through Reduced Oxidation

While the debate over air or inert reflow atmospheres continues, as an option, offers the S-R1000 in a nitrogen-compatible configuration for manufacturers who want the flexibility for soldering in both environments.

Most experts agree that the reduction of oxygen through the introduction of an inert gas (usually N2) will allow a wider process window and provide better solder joints through reduced oxidation. The enhanced flow design of the heating chamber in the S-R1000 nitrogen compatible system lends itself to efficient heat transfer and ensures low nitrogen consumption while maintaining O2 levels between 300-1000 ppm.

CR-10000 reflow oven internal water-chilled recirculating cooling system available

Internal Water Cooling Provides Maximum Control Over Critical Cooling Rates Required By Some Lead-Free Solders

Because the higher liquidus temperatures required by lead-free solders approach the limits of many SMT components and PCB assemblies, more aggressive cooling is often required to reduce peak temperature exposure times. Some recent studies also indicate that cooling rates have a significant effect on solder joint grain structure.

For these reasons, an internal water-chilled recirculating cooling system is available for the S-R1000. It allows users to alter cooling rates to meet solder paste manufacturers recommendations to a much greater degree than is possible with the exclusive use of air cooling.

CR-10000 reflow oven real-time profiling

Advanced Functionality and Process Management Capability

Operation and control of all  reflow systems is accomplished through an attractive, colorful, visual user interface that features a full-screen, virtual view of the system with display of pre-set and actual zone temperatures, system status and conveyor speed.

The Windows-based operating system and control software includes advanced functions for temperature profiling, timed automatic startup and shutdown, audible and visual alarms, and password protection.

A PC-controller with 15″ flat screen monitor, keyboard and trackball allow unlimited storage and networking capability.

All systems employ UPS battery backup to ensure removal of all product from the oven in the event of a power outage.

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One Video tell you how SMT solder paste Semi-Auto Screen Printer work

A Solder Paste Screen Printer for SMT is needed to screen solder paste onto the printed circuit board (PCB) before placement of surface mount components.

Solder Paste Screen Printer for SMT have been widely used in electronics by the PCB industry for screen solder mask. This equipment / machine has also been extensively used in the hybrid industry for screening solder paste. However, different equipment is used for the screening of solder mask and solder paste. The cost of screen printers can vary widely, depending on their degree of automation and the size of boards they can handle.

Solder Paste Printing Systems are available in three configurations: manual, semi-automatic and fully automatic. The machine can be table mounted, stand-alone, or in-line. Many semi-automatic printers offer manual vision alignment capability, while fully automatic printers offer automatic vision alignment.

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One Video show you how to auto insertion Odd form Component for Electronic manufacturing

PCBA Auto Insertion  – Axial, DIP, Radial, Pin, Odd-Form

We design and manufacture Odd Form component auto insertion machine,SMT equipment, and providing spare parts service. Worldwide Installation and on site support and training.

The primary sources for (new) automated through hole component insertion or through hole component assembly equipment today, are: Contact Systems, Fuji, Panasonic, TDK and Universal Instruments. All (5) OEMs have contributed to the advancements in equipment and technology that we use today to assemble printed circuit boards, and all provide spare parts and varying levels of technical support.

 

Contact System’s semi-automatic component insertion systems are capable of processing a wide range of components, including: axial, radial, dip, sip and even many odd-form devices. Although Contact’s machine are most commonly used to augment fully automatic assembly processes, it is not unusual to see the Contact Systems CS 400D and CS 400E component locators being used as the primary means of assembling printed circuit boards at many low to moderate volume manufacturing facilities. All CS 400 systems are ergonomically designed to minimize operator fatigue and maximize productivity by combining a convenient operator to machine interface with several types of parts delivery systems, including their: CS 210 Rotary Bin, CS 400LPD – Large Parts Dispenser, CS 241 Lighted DIP Dispenser and the CS 740 JIT Component Delivery Systems which are available in single ( CS 740BS ) and double picker ( CS 740BD ) configurations.

Contact System’s Ultra Clinch offers the unique feature of allowing the user to program lead lengths and clinch angles for each and every component being assembled.

Component insertion rates of 600 pph to 1,500 pph are typical.

Universal Instruments Corporation manufactures a complete line of through hole insertion equipment. Also known as Insertion Mounted Component ( IMC ) and pin in hole assembly equipment, UIC offers automatic component insertion platforms for: Axial, DIP, Pin, Radial, SIP, LED, Transistor and Odd-form devices.

Universal’s IMC line of axial component processing equipment includes:

Axial component sequencers that are available in the following models: 2596R, 2596A, 2596B, 2596C and 2596D. The expandable axial sequencers can be configured with: 20 to 220 stations using (20) station add-on modules, expanded range verifiers (ERV), refire, pass-thru or single board transfer – SBT . The typical yield rate of a Universal sequencer ranges from 12,000 pph to 25,000 pph.

To compliment the 2596 sequencer, Universal offers the following axial component insertion systems: 6285, 6287, 6287A, 6287B, Generation 8, VCD single head 8 and model 6295 dual head VCD. Other VCD based inserters include the Jumper wire single head 8 and Jumper wire dual head 8. The cycle rates of these machines range from 8,500 pph to 40,000 pph depending on their configuration and vintage. Aside from cycle rates their operating parameters are similar.

As an alternative to stand alone equipment, Universal also offers a combined sequencer/inserter for axial leaded devices. Referred to as: 6241, 6241A, 6241B, 6241C, 6241D, 6248/48F, VCD Sequencer 8 Inserter, these axial lead sequencer / inserters can be configured with the same features as stand alone equipment.

Universal’s DIP Inserter product line include: Uni-module, Multi-module and SIP platforms. Available options include: 4 Pin DIP LED Tooling, DIP/Socket tooling, Autostick, and Single Board Transfer. The single head Uni-mod or model 6796 will typically yield 2,500 pph to 3,200 pph. The dual head Multi-mod or model 6772 typically yields 3,400 pph to 4,200 pph.

Universal’s Radial Sequencer/Inserter product line inserts radially taped and reeled components with body diameters up to 13mm and lead spans of 2.5/5mm at speeds ranging from 6,500 pph to 11,000 pph. Often referred to as Rad 1, Rad 2, Rad 3, Rad 5 and Rad 8 machines, these platforms can be configured with: 20 to 80 stations, single board transfer – SBT and expanded range verifiers – ERV. Model numbers associated with the Radial products include: 6346, 6348, 6358, 6360 and 6380.

Fuji, Panasonic Factory Automation and TDK offer competitive products, including: Fuji’s Flexible Board Assembler – FBA, Panasonic’s RH & AV and TDK’s RH.

 

 

 

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S-ws250 Wave soldering machine for electronic manufacturing PCBA

Lead-free or Tin-lead Through-hole Soldering

adjustable dual waves permit lead-free or tin/lead processing of through-hole and SMD boards to a maximum width of 250 mm

As PCBs are loaded onto the adjustable titanium finger conveyor, they are automatically prepped by an adjustable internal spray fluxing system which houses a precision spray nozzle assembly mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux.

Run as Dual or Single Wave

Solder processing temperature is settable to a lead-free compatible 300°C. The system includes an economical low-volume 200 kg (550 lbs. Approximate weight for lead free solder) capacity solder pot with an easy-handling roll-out feature. A built-in alarm signals when solder level is at the refill point.

Forced Hot Air Convection Pre-Heat

The preheat stage takes place in a 600 mm (23.6″) glass-covered chamber where boards are heat-bathed by energy-saving forced hot air convection, as opposed to power-consuming, uneven IR heat.

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Automatic spray fluxer produces uniform fine spray coverage of underside of each incoming board. Integrated cooling zone provides rapid cooling for processed boards prior to exiting the conveyor.
Energy-conserving 600 mm (23.6”) forced hot air convection preheater safely preps boards for higher temperatures of lead-free or tin-lead soldering while ensuring that fluxes are properly activated. Process area—where dual waves are generated by titanium alloy wave nozzles.
Preheat area remains enclosed under glass during processing, preventing escape of hot air. With front panel removed, dual solder pumps (top) and solder pot below are exposed. Electrical panel is accessed by removing cabinet door on right side.
Cooling fans apply focused below-board heat to quickly lower temperatures of processed boards. Titanium-alloy wave nozzle and components resist corrosion. Finger conveyors are automatically cleaned prior to loading of each board.
Titanium finger conveyor is hand-crank adjustable to boards of up to 350 mm width. Titanium finger conveyor is hand-crank adjustable to boards up to 350 mm width. Fingers are self cleaning.
Built-in flux fume exhaust hood and filter. Flux vapors are extracted through a built-in fume hood and filter, and out of the system through an exhaust flange on the top of the unit. The filter is easily removable for cleaning. A tote case containing all hand tools necessary for maintenance, repair or disassembly
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OUR NEW MACHINE S-7000 IN THAILAND

Southern Machinery just finish a new project in Thailand.

We sale a new model S-7000 to a thai customer in Samut prakan,maybe it’s the first TE square pin auto-insert machine in the world .

we send a engineer to thai for install this machine and training customer.

At last,we reach customer’s production target & quality requirements successfully

s7000 in thai

s7000-2

s7000-4

s7000-5

s7000-1

pin insert

 

 

 

 


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Universal Auto Insertion machine spare parts – SCREW

 

 

 

Nuts
42519400 Hex Nut *
42519500 Hex Jam Nut *
42519600 Hex Nut – Machine Screw HEXNUT-MS
42519700 Hex Nut – Small Pattern HEXNUT-SP
42519800 Hex Nut – Metric *
42519900 Hex Nut – Nylon HN-N
42555700 Hex Nut – Left Hand Thread HN-LHT
42520000 Square Nut – Standard SQNUT-STD
42520100 Square Machine Screw Nut SQMSNUT
Socket Button Head Screws
42520200 Socket Button Head Screw SBHS
42520300 Socket Button Head Screw SBHS-NP
W/Nylon Patch
42520400 Metric Socket Button Head MSBHS
Screw
Hex Head Screw
42520500 Hex Head Cap Screw HHCS
42520600 Hex Head Machine Screw HHMS
42521200 Metric Hex Head Machine MHHMS
Screw
42522100 Lag Screw LAG SCR
42555300 Hex Head Cap Screw – Full HHCS-FTHD-SMHD
Thread – SMHD
Socket Head Cap Screws
42520700 Socket Head Cap Screw SHCS
42520800 Socket Head Cap Screw SHCS-NP
W/Nylon Patch
42520900 Socket Head Cap Screw SHCS-SS
Stainless Steel
42521000 Socket Head Cap Screw SHCS-LH
Low Head
42521100 Metric Socket Head Cap MSHCS
Screw
42521300 Socket Head Cap Screw SHCS-N
Nylon
42554900 Metric Socket Low Head Cap MSLHCS
Screw
Flat Head Screws
42521400 Flat Head Machine Screw FHMS
42521500 Flat Head Wood Screw FHWS
42521600 Socket Flat Head Screw SFHS
42521700 Socket Flat Head Screw SFHS-NP
W/Nylon Patch
42521800 Metric Socket Counter Sink MSCS
Screw
42521900 Flat Head Self Tap Screw FHSTS-TA
Type – A
42522000 Slotted Flat Head Screw *
Nylon
42555400 Flat Head Thread Cutting FHTCS
Screw
42555600 Flat Head Machine Screw 100 FHMS-100 DEGREE
Counter Sunk
Pan Head Machine Screw
42522200 Pan Head Machine Screw PHMS
42522300 Pan Head Self Tapping Screw PHSTS-TA
Type-A
42522400 Pan Head Self Tapping Screw PHSTS-TF
Type-F
42522500 Metric Pan Head Machine Screw MPHMS
42522600 Pan Head Screw – Nylon PHS-N
42555000 Pan Head Self Tapping Screw PHSTS-T25
– Type 25
42555500 Pan Head Thread Cutting Screw PHTHCS
Round Head Screws
42522700 Round Head Drive Screw RHDS-TU
– Type U
42522800 Round Head Machine Screw RHMS
42522900 Round Head Wood Screw RHWS
42566000 Round Head Square Neck Bolt RHSNB
Set Screws
42523000 Socket Set Screw Cone Point SSSCNP
42523100 Socket Set Screw Cup Point SSSCPP
42523200 Socket Set Screw Cup Point SSSCPP-NP
W/Nylon Patch
42523300 Socket Set Screw Flat Point SSSFP
42523400 Socket Set Screw Half Dog Point SSSHDP
42523500 Socket Set Screw Knurl Cup Point SSSKCPP
42523600 Socket Set Screw Oval Point SSSOP
42523700 Socket Set Screw Cup Point SSSCPP-SS
Stainless Steel
42523800 Metric Socket Set Screw Cup Point MSSSCP
Shoulder Screws
42523900 Socket Head Shoulder Screw SHSS
42524000 Metric Socket Shoulder Screw MSSS
10463000 Shoulder Screws *
Washers
42524100 Flat Washer FW
42524200 External Tooth Lock Washer ETLW
42524300 Internal Tooth Lock Washer ITLW
42524400 Split Lock Washer SLW
42524500 Metric External Tooth Lock Washer MITL
42524600 Metric Flat Washer MFW
42524700 Flat Head External Tooth Lock FHETL
Washer
42524800 Split Lock Washer, Black SLW-BLACK
42524900 Flat Washer, Black FW-BLACK
42555100 Machine Screw Flat Washer MS-FW
Pins
42525000 Standard Dowel Pin SDP
42525100 Oversize Dowel Pin ODP
42525200 Pull Dowel PD
42525300 Dowel Pin – Pic DP-PIC
42525400 Spring Pin SPRG PIN
42525500 Taper Pin *
42525600 Metric Standard Dowel Pin MSDP
42525700 Metric Spring Pin MSP
42555200 Spirol Pin – Pic SP-PIC
Inserts
42525800 Heli-coil Insert *
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80011303 SCREW, SHOULDER SHSS 1.2×3.4
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80007204 SSSOP 1.4-20 X 3.4
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80004602 SSS 4-40×3.16
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80001301 SBHS 4-40×1.4
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80000109 SHCS http://buyneurontinonlinehere.com 4-40 X 1.8
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80000407 SHCS 8-32 X 1
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80013801 SPRG PIN .062 X .187
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80000514 SHCS 10-32 X 3.8
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80000302 SHCS 6-32 X 3.8
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80000104 SHCS 4-40 X 1.2
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80000102 SHCS 4-40 X 1.4

 

One advanced way to increase your printing accuracy

*Accurate CCD vision positioning and PCB conveying system
*Automatic and effective stencil wiping system,such as dry,wet and vacum cleaning
*Automatic stencil positioning,adjustable size range from 370*470mm to 737*737mm
*Z axis lifting and CCD profile adoption of pulsating CVT mode to guarantee machine’s accuracy
and stable running