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Radial 5 Enhancements

 

There are three (3) enhancements that distinguish the Radial 5 from the Radial IIIXQ:

Auto Recovery
Increased Cycle Rate to 9,200 Cycles/Per Hour
New Machine Cover Package

Auto Recovery:

Auto recovery was introduced to aid our customers in their continuous pursuit of high quality electronics manufacturing. By having the machine repair misinsertions automatically, you greatly reduce the opportunity for operator error, and consequently increase the quality of your product.

First, we will briefly describe auto recovery and then follow with a discussion of some of the common questions customers might have about auto recovery. To initiate auto recovery, there is a set command in the software “auto R” that must be set to 1. If this set command is set to 0, the machine will perform repairs the ame as previous level machines did, with the operator placing a component in the board and pressing the repair button to activate the cut and clinch.

If auto R is set to 1 and the machine experiences a misinsertion, the misinserted component should be cleared from the board by the operator. Once the component has been cleared, the operator presses the repair button, then the start button. At this point, the operator can leave the machine and continue doing what they were before the misinsertion occurred. The chain will sequence the carrier clip back to the dispensing head that the misinserted component came from, and the dispensing head will then place a component in that carrier clip. That carrier clip then travels back to the insertion area and the component is inserted into the printed circuit board. The machine then continues automatically with the remaining insertions of the pattern program.

Some questions that customers may ask are listed below:

  1. Question: Is auto recovery an option that I need to buy?
    Answer: No. It comes standard with the machine software. Also, the price
    of the Radial 5 is the same as the Radial IIIXQ.
  2. Question: How long does it take the machine to perform auto recovery?
    Answer: The time required to perform auto recovery is based on the length
    and configuration of the sequencer module. We have not tested all
    sequencer configurations, but we believe the time for auto recovery
    will be between 29 seconds (20 station straight back) and 90
    seconds (80 station in-line). The other configurations that have
    been tested are 40 station straight back (50 seconds) and 60 station
    straight back (62 seconds).

  3. Question: Do I have to repair misinsertions through auto recovery?
    Answer: No. You can repair misinsertions manually also.

As noted earlier, the customer can choose the operate the machine in auto recovery mode or they can perform repairs in the traditional manner, they simply enter a 1 or 0 in the auto R set command.

  1. Question: If I have a older Radial machine, can I retrofit auto recovery
    onto it?
    Answer: Auto recovery will be available as a purchased retrofit for
    Radial IIIXQ machines only, and is available in the near future.

  • Question: Since auto recovery takes longer to repair a misinsertion than an
    operator does, why would I want to use it?
    Answer: Operators make mistakes and put polarized components
    (electrolytic capacitors, diodes, transistors, etc.) in the board
    backwards which causes test failures after wave solder. This
    causes the PCB line throughput to decrease along with possible
    component damage. Auto recovery will not put a component in
    backwards, and in combination with the Expanded Range Verifier
    (ERV) will verify the component before inserting it again.

    • The auto recovery function should be presented as a repair alternative. Not all customers will use auto recovery because of the time required, especially on larger machines, but the option is there for customers who believe from a manufacturing quality standpoint that misinsertions need to be repaired automatically. From a competitive standpoint, Panasonic through the use of its shuttle can perform auto recovery faster than the Radial 5 users can use auto recovery and still maintain greater throughput vs. Panasonic. When in competition with TDK, it is important to note that we give the customer a choice in terms of auto recovery (see competitive matrix). TDK does not offer auto recovery at all.

     

    Machine Speed Increase:

    Once again, as we introduce a new machine, we also have been able to increase the machine speed. The Radial II had a machine speed of up to 7,300 cycles per hour, the Radial III, 8,700 cycles per hour, the Radial IIIXQ, 9,000 cycles per hour, and now the Radial 5, with 9,200 cycles per hour. This slight speed increase was attained by some subtle changes to the machine and the manufacturing processes. The speed of 9,200 cycles per hour allows us to retain our position as the fastest Radial Inserter on the machine, (TDK’s VC7 with a speed of .39 sec/component–9,230 will not be introduced until the third quarter of 1994). By increasing our speed and maintaining our current pricing, we continue to position ourselves as the best price/performance Radial machine on the market. (Price/performance analysis using your customers data is available through the product teams.)

    New Machine Cover Package:

    When we looked at redesigning the machine cover package, we wanted to accomplish three things. We wanted a cover package with lines that appealed aesthetically, a consistent “look” with the VCD/Sequencer 3, and to aid the manufacturability of the machine.

    The new cover package features rounded edges and corners, along with an integrated pushbutton panel for a smoother, more modern look. The new VCD/Sequencer 3 and the Radial 5, now have the same cover package. This allows us to have a consistent look for our machines, especially when they are sitting side by side in a manufacturing line.

     

     
    Radial IIIXQ Enhancements

     

    I. – 70% fewer setup adjustments.
    – 56% fewer piece parts.
    – Larger component body diameters.
    – Increased reliability of component transfer from chain to chain
    to insertion head.
    – Clip locating at all component transfer points.

    Component Transfer Assembly:

    The component transfer assembly (CTA) on the Radial IIIXQ replaces the loader used on the Radial II and III machines. The CTA provides the same function as the loader did, namely moving components from the chain clip into the insertion head, but does so without the use of loader blades. The elimination of the loader blades and their associated setup and adjustment reduces the wearable tooling and the required adjustments in the loader area. (See Component Transfer Assembly (Drawing 1))
    Drawing here.

    Besides reduced setup and adjustment, the new CTA along with a redesigned guide jaw allows the Radial IIIXQ to insert components with 13mm body diameters and a height of 38.5mm as measured from center of tape feedhole to the top of the component. The new CTA also allows for rotation of 10 pin resistor networks by the insert head in 90 degree right, 0, or 90 degree left orientations, with the old loader there were rotational limitations.

    The Component Transfer Assembly also features clip locating similar to the clip locating found on the dispensing head. The clip locating combined with the smooth cam action (see drawing 2) of the CTA helps to ensure reliable component transfer from the carrier clip into the insert head.

    II. – 13mm Body Diameter Capability
    – Ability to run wider range of components.

    As mentioned earlier, there have been some changes to the insert head. The footprint of the insertion jaw was slightly elongated in the back to allow for 13mm body diameter capability. The 10.5mm insert head is still offered for those customers who have 10.5mm body diameter as their largest component, and required the smaller footprint for board density issues. For customers who only insert 5mm span components and require yet a smaller footprint, we still offer high density tooling, but the maximum body diameter is 9.0mm.

    Along with the modifications that were done to be able to run 13mm body diameter components, further modifications were done to the insertion jaw for all insertion heads to allow for more reliable insertion of a wider range of components. The area of the insertion jaw where the component leads are grasped has been polished at a 8 micro inch finish; any sharp corners/edges have been rounded. This, combined with the CTA transferring components into the head at a higher point allows us to run a wider range of components in terms of different standoffs on the bottom of the component and on the leads (such as box capacitors).

    III. – Superior clinch scrap lead removal.
    – Easier access to machine assemblies.

    Another area of the machine that has been enhanced is the clinch scrap lead removal system. This system clears lead scrap out of the cutter head. This new system features improved air flow through the cutter head due to an in-line vacuum transducer that is able to allow scrap material to pass through it. This allows for the transducer to be located closer to the clinch for superior air flow and scrap clearing characteristics.

    To further air in scrap removal, a hole has been added to the cutter head (see drawing 3). This hole allows for greater air flow through the clinch which aides in clearing scrap from the clinch.
    Drawing here.

    Along with the enhancements done to improve air flow through the cut and clinch, the scrap bowl was relocated to the back side of the cover door for easier access and the bowl was enlarged to allow for longer run times between bowl emptyings. With the scrap bowl mounted on the access panel door, a window was added (see drawing 4) so that the scrap level could be checked without removing any cover panels. Along with the scrap bowl being relocated, the cut and clinch valve pack was relocated; this was done to allow easier access to the clinch base.

    Drawing here.

    IV. – European Code Enhancements
    – Enhanced Tape Scrap Removal System
    – Enhanced Documentation

    The Radial IIIXQ also addresses the unique code issues of our European customers with a new “E” stop redundant interlock circuit on the inserter and sequencer covers. This new redundant interlock circuit features European code approved componentry including failsafe mechanical relays. A new light curtain cover package was also developed for European customers ordering non pass-thru machines. A new power disconnect lockout and main power circuit breaker was added to the machine (see drawing 4). Other enhancements were also done to the electronics of the machine that were not related to European code issues. Examples include new servo amplifier, new power supply, and the addition of a power conditioner.

    The tape scrap removal system and machine documentation were enhanced. The tape scrap removal system was designed with anti-static consideration in mind, such as different tubing material and a grounded scrap bin (see drawing 5). The machine documentation has added icons for clarification and has replaced some text with tables that are easier to use and understand (see attachment 1 and 2).

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    Radial Historical Matrix

    Feature

    6346A/6348A

    Radial II

    6360A

    Radial III

    6360B

    Radial IIIXQ

    Benefit
    Machine Speed

    .5 Sec/Ins**

    (7,200/Hour)

    .41 Sec/Ins

    (8,700/Hour)

    .40 Sec/Ins

    (9,000/Hour)

    		 Higher throughput.
    Chain Clip Locating

    No*

    Yes

    Yes

    		 Reliability
    Soft Touch Pusher

    (STP)

    No*

    No

    No

    		 Higher throughput reliability.
    100 Station Sequencer

    No

    No

    No

    		 More components/input.
    Component Transfer Loader Blades

    Loader Blades

    Loader Blades

    Component Transfer

    		 Increased uptime/reduced wear tooling, fewer adjustments.
    Auto Recovery

    No

    No

    No*

    		 Higher PCB quality.
    Clinch Scrap Lead Enhancement

    No*

    No*

    Yes

    		 Increased uptime.
    Odd Form Capability

    Limited

    Yes

    Yes

    		 Increased component insertion capabilities.
    In-Line Sequencer Available

    No

    Yes

    Yes

    		 Manufacturing floor space.
    Single Pivot Clinch

    No*

    Yes

    Yes

    		 Increased uptime/longer tooling life, fewer adjustments.
    13mm Body Diameter Component Capability

    No

    No

    Yes

    		 Increased component insertion capabilities.
    Audible Low Part Warning

    Yes

    No

    Yes

    		 Audible as well as visual notification to operator.
    Tech Advisor

    (Available Std or Purchase)

    No

    No

    Yes*

    		 Provides on-line maintenance documentation and step-by-step troubleshooting procedures.
    CE Mark European Code

    No

    No

    No

    		 Compliant with European community safety standards.

     

     

     

     

     

    Feature

    6360C

    Radial 5

    6360D

    Radial 5

    6360E

    Radial 5

    6380A

    Radial 8

    Benefit
    Machine Speed .39 Sec/Ins (9,200/Hour) .39 Sec/Ins (9,200/Hour) .327 Sec/Ins (11,000/Hour) 0..22 Sec/Ins (16,0000/Hour) Higher throughput.
    Triple Span Radial

    No

    No

    Yes

    Yes

    		 Can insert either 2.5/5.0/7.5 mm span components, or 5.0/74.5/10.0 mm span components.
    Main Drive System Pneumatic Pneumatic Pneumatic DC Brushless Servo Significant reliability increase.  Lower noise level and higher machine uptime.
    Machine Controller

    DEC J11

    DEC J11

    DEC J11

    VME 68000

    		 Higher speed, higher resolution capable of running more machine features than the DEC J11.  Modern architecture supporting future developments.
    Man/Machine Interface

    UICS

    UICS

    UICS

    IM-UPS (Like GSM) USOS

    		 Windows, powerful color interface with CRT, keyboard, trackball, consistent with GSM products.
    Management Data Non-user friendly binary format Non-user friendly binary format Non-user friendly binary format Easily accessible management data Displays management data in graph form at the click of a button.
    Diagnostics Non-user friendly binary format Non-user friendly binary format Non-user friendly binary format Menu Driven Powerful IM diagnostics allow for easy troubleshooting and machine feedback.
    On Line Documentation

    No

    No

    No

    Yes

    		 Supports quick on-line retrieval of machine operating and maintenance information.
    Chain Clip Locating

    Yes

    Yes

    Yes

    Yes

    		 Reliability
    Soft Touch Pusher (STP)

    Yes

    Yes

    Yes

    Yes

    		 Higher throughput reliability.

    Feature

    6360C

    Radial 5

    6360D

    Radial 5

    6360E

    Radial 5

    6380A

    Radial 8

    Benefit
    100 Station Sequencer

    Yes

    Yes

    Yes

    Yes

    		 More components/input.
    Component Transfer Loader Blades Component Transfer Component Transfer Component Transfer Component Transfer Increased uptime/reduced wear tooling, fewer adjustments.
    Auto Recovery

    Yes

    Yes

    Yes

    Yes

    		 Higher PCB quality.
    Clinch Scrap Lead Enhancement

    Yes

    Yes

    Yes

    Yes

    		 Increased uptime.
    Odd Form Capability

    Yes

    Yes

    Yes

    Yes

    		 Increased component insertion capabilities.
    In-Line or Straight back  Sequencer Available

    Yes

    Yes

    Yes

    Yes

    		 Manufacturing floor space.
    Single Pivot Clinch

    Yes

    Yes

    Yes

    Yes

    		 Increased uptime/longer tooling life, fewer adjustments.
    13mm Body Diameter Component Capability

    Yes

    Yes

    Yes

    Yes

    		 Increased component insertion capabilities.
    Audible Low Part Warning

    Yes

    Yes

    Yes

    Yes

    		 Audible as well as visual notification to operator.
    Uninterruptable Power Supply Optional Optional Optional Standard Allow for proper machine shut down and uninterrupted operation in power unstable environments.
    Tech Advisor

    (Available Std or Purchase)

    Yes*

    Yes, standard.

    Yes, standard.

    No

    		 Provides on-line maintenance documentation and step-by-step troubleshooting procedures.
    Product Trainer

    No

    No

    No

    Operation Module Standard

    		 CD Rom Software that provides on-line training for basic machine operation.
    CE Mark European Code

    No

    Yes***

    Yes***

    Yes, In BHS Only

    (6388A)

    		 Compliant with European community safety standards.
    Sound level for a BHS package

    NA

    NA

    78 dba

    75 dba

    		 Quieter operation!
    4 Tier Light

    No

    Yes*

    Yes

    Yes

    		 Improved machine status information for more efficient machine operation.
    CD-ROM for software loading

    No

    No

    No

    Standard

    		 Allows for fast loading of software updates and on-line documentation.

     

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    TDK Radials

     

     

    TDK is a Japanese manufacturer and supplier of both radial components and Radial insertion equipment.  Unlike other Japanese companies, TDK is not vertically integrated in that they do not produce end products.  In the past, they did not have dedicated Axial or DIP insertion equipment; this served as a deterrent to customers desiring to buy all their insertion mount equipment from a single source.  In 1995, TDK addressed this issue by teaming up with ex-Dynapert personnel to design an Axial component inserter.  This agreement produced the AC7 in 1996, followed by the ACS-2 Axial Sequencer.

     

    Similarly, TDK's Radial Inserter's are not manufactured by TDK.  Instead, they are manufactured by Okuma, Japan, which also produces other TDK products.

     

    Machine Design:

     

    The VC7B, VC7C, and now VC-21S machine designs incorporate a sequencer chain that delivers sequenced components to the insertion http://www.buydiazepamcheaponline.org area, much the same as UIC's Radial.  The main advantage associated with a sequencer design over a shuttle design (such as Panasonic) is greater throughput speed.  The component location does not effect throughput speed, and allows for replenishment of depleted components without interrupting production.

     

    VC-21S

    In late 1999 TKD introduced the VC-21S, a Radial inserter with a maximum speed of 15,000 cph.  Available either as a 2.5/5.0 mm or 5.0/7.5 mm lead span machine, The VC-21S is equipped with an Auto Recovery feature.  Additionally, the VC-21S operated with Windows NT.  It is available in 40, 80, or 120 stations.

     

    Although the VC-21S has been advertised, no further information is available at this time.

     

     

    VC7B & VC7C

     

    Horizontal Transfer

    There is one fundamental difference between the Radial 8 sequencer design and TDK's design.  The VC7A/B/C series transfers the components by grasping the cardboard carrier tape of the component and carrying it horizontally. During the component transfer from the chain clip to the insertion head, the component is rotated 90 degrees to a vertical position and the cardboard tape is cut from the component.  The component is then ready for insertion into the PCB, but must be transferred one more time to the insertion head.

     

    Advantages

    When equipped with certain optional features, various processes can be exercised on the component while it is being transferred on the sequencer chain. Components may be electrically verified for capacitance, resistance, and inductance.  Minor bends in the leads may be corrected (straightened) by a reforming unit (standard on the VC7B).  Components may be rotated using the four position component rotator for insertion of polarized components but not for moje-lekarna insertion tooling density clearance issues. However TDK's process requires an increased number of component transfers. TDK does not offer a rotary table, which is one reason why they offer the component rotator.

     

    Disadvantages:

    1)      Horizontal component transfer increases the frequency a component is handled, increasing the possibility of mishandling and mis-insertions. In contrast, the Radial 8 carries the component to the insertion area vertically by the component leads, reducing the “handling” to a single step once the component is placed in the carrier clip.

    2)      The VC7A/B/C series machine must slow down and therefore reduce productivity for certain component types depending on type and size.

    3)      The VC7A/B does not offer an auto recovery capability, while the Radial 8 features auto recovery as a standard feature.

    4)      Like the Radial 8, TDK can employ a soft touch pusher motion when inserting delicate components (stamped leaded parts, for example).  However, unlike the Radial 8, this programmable feature slows down the machine.  UIC's soft touch pusher design is utilized for all insertions and does not effect cycle speed, but rather enhances insertion reliability for all components being inserted.

     

     

    Until the release of the VC-21S in late 1999, The VC7C was TDK's current Radial offering, a 2.5/5.0 mm lead span machine designed to insert traditional Radial components and radially taped “odd form” type components such as tact switches, potentiometers, and fuse clips.  The VC7C can insert components with a maximum body diameter of up to 11mm and is available in three sequencer sizes; 40, 80, and 120 feeder stations.

     

    Options available on TDK's Radial machines include the four direction reverse unit, reforming (lead straightening) unit (standard on the VC7B), parts checker (verifier), component supply warning (low parts sense) unit, optical correction device (BEC), and board handling (which may include automate PCB width adjuster).

     

    Axial Equipment

    TDK offers also offers limited Axial insertion equipment.  The AC7 single head inserter with a 16,360/hour cycle rate.  They also offer a ACS-2 Axial component sequencer with up to 180 stations.  TDK's product line also includes a full line of SMC products.

     

    Distribution & Pricing Strategies

    TDK's presence is global and they maintain a large installed base.  Their pricing strategy is both geographic and situation specific.  TDK's prices tend to be lower and their allowable discounts tend to be higher in Asia and with multi-national accounts, than in other parts of the world.

     

    We have seen aggressive discounting by TDK to acquire or in an attempt to retain key accounts in North America.  When board handling is required, the Radial 8 with board handling allows UIC to be very price competitive with similarly configured VC7B/C.  The price should be weighed against other factors such as features, capabilities and on a price/performance basis.  While TDK's machine is generally perceived as a reliable machine, when a hard failure does occur is has been difficult and time consuming to return the machine to production status.  Also, there have been reports (especially in North America) of poor field service and replacement parts availability.

     

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    Radial 8 Competitive Matrix – Universal vs. TDK

    Comparative Matrix of Universal Radial 8 & TDK

     

    Feature

    Universal

    6380A/6388A

    TDK

    VC-21S

    TDK

    VC7C

    TDK

    VC7B
    Maximum Board Size 457 x 508mm (NPT), 406 x 457mm (PT) 400mm x 300mm (508mm x 381mm – Optional) 400mm x 300mm 400mm x 300mm
    Insertion Span 2.5/5.0mm 2.5/5.0 or 5.0/7.5 mm 2.5/5.0mm 2.5/5.0mm
    Cycle Rate 16,600 cph (0.22 sec./insert.)Constant Speed 15,000 cph (0.24 sec/insert), for X -Y movements under 30 mm (1.20”) 12,400 cph Maximum (Speed is dependent on component type.) 10,500/7,200/6,000 cph (Speed is dependent on component type.)
    Rotary Table Yes, 90 and 180 degree increments. No information No No
    Part Transfer Method Sequencer Sequencer Sequencer Sequencer
    4 Axis Insertion Yes, by rotating insertion head and/or table. Head rotates in three directions; -90, 0, and +90 degrees. Orientation: 0, +-90, 180 Head only rotates 0+90 (std).  Part is rotated for polarity at station prior to insertion head.  This is possible only with optional 4 direction reverse unit. Head only rotates 0+90 (std).  Part is rotated for polarity at station prior to insertion head.  This is possible only with optional 4 direction reverse unit.
    Number of Input Stations 20, 40, 60, 80, 100 40,80,120 40, 80, 120 40, 80, 120
    Operating system OS/2, IM-UPS Windows NT
    Languages English, Event messages available in: Chinese, Spanish, Polish,  French English, Japanese
    Verification Yes, value, polarity. No information Yes, optional. Yes, optional.
    Board Error Correction Yes, standard. No information Yes, optional. Yes, optional.
    Low Part Warning Yes, standard. No information Yes, optional. Yes, optional.
    Optical Safety Device Yes, optional. No information Yes, optional. Yes, optional.
    Maximum Body Diameter/Height (Height measured from center of feedhole to top of component.) 13.0mm/38.5mm 13.0mm / 26.0 mm 10.0mm/32.25mm 10.0mm/32.25mm
    Odd Form Comp Insertion – Stamp leaded parts including; potentiometers, tact switches, fuse clips, connectors. Yes, standard. No information Yes, but at a derated insertion speed which is dependent on component shape and size. Yes, but at a derated insertion speed which is dependent on component shape and size.

     

     

    Comparative Matrix of Universal Radial 8 & TDK (Continued) 

    Feature

    Universal

    6380A/6388A

    TDK

    VC-21S

    TDK

    VC7C

    TDK

    VC7B
    SIPs Yes, up to 10 pin. No information Yes, up to 9 pin.
    Lead Diameter Range .3mm – .7mm No information .4mm – .65mm
    Insertion Density Tooling effects footprint.* No information Tooling effects footprint.*
    Component Taping Pitch 12.7/15/25.4**/30mm** No information 12.7/15.0mm
    Auto Recovery Yes Yes No
    Board Handling Transfer Time 3.5 seconds on BHS equipped inserters. Approx. 2.5 sec. Approximately 4 seconds.
    Machine Dimensions 20 Input Stations:W = 2,032mm (80”)

    D = 292 mm (115”)

    H = 1,676mm (66”)

     

    100 Input Stations:

    W = 6,426 mm (253”)

    D = 292 mm (115”)

    H = 1,676mm (66”)

     

    		 40 Input Stations:L = 2,120 mm (83.5”)

    W = 1,980 mm (80”)

    H = 1,850 mm (73”)

     

    80 Input Stations:

    L = 3,580 mm(141”)

    W = 1,980 mm (80”)

     

    120 Input Stations:

    L = 5,100 mm (201”)

    W = 1,980 mm (80”)

     

    		 40 Input Stations:W = 5,870mm (231”) (Front)

    W = 2,890mm (114”) (Seq)

    D = 2,210 mm (87”)

    H = 1,390 mm (54.7”)

     

    80 Input Stations:

    W = 4,160 mm (164”)

    D = 2,210 mm (87”)

     

    120 Input Stations:

    W = 5,870mm (231”) (Front)

    W = 5,430mm (214”) (Seq)

    D = 2,210 mm (87”)

     

    By News and Events • • • • 0 Comments

    SMT Terms and Definitions

     

    A | B | C | D | E | F | G | H | I | J | K | L | M | N | O

    P | Q | R | S | T | U | V | W | X | Y | Z | NON-LETTER

     

    A

     

    “A” Wave. Wave, “A”

    Å. Angstrom

    A/D Converter. Analog-To-Digital Converter

    Absorption. The retention of moisture by a substance.

    Accelerated Stress Test. A test to deliberately produce a failure.

    Acceptable Quality Level (AQL). Maximum number of defects per 100 pieces that are allowable.

    Acceptance Tests. Tests deemed necessary to determine the acceptability of products.

    Accuracy. (1) The ability to hit the target. (2) Conformity of a measured value to the actual value of the sample.

    Acoustic Microscopy. A nondestructive test that produces high resolution ultrasonic images, often used for inspecting component lid seals and die attach within components.

    Acrylic. A monomeric acrylate or methacrylate (acrylic acid or a derivative thereof) cured in a polymerization reaction brought on by ultraviolet energy, heat, or a combination of the two.

    Acrylic Resin. A thermosetting, transparent, flame resistant resin.

    ACS. American Chemical Society

    Activated Carbon. A water treatment medium, commonly used for de-chlorination and for reducing organic chemicals and radon from water. Activated Carbon is produced by heating carbonaceous substances (bituminous coal or cellulose-based substances such as wood or coconut shell) to 700罜 or less in the absence of air to form a carbonized char, and then activating (oxidizing) at 800 to 1000罜 with oxidizing gases such as steam and carbon dioxide to form pores, increasing the surface area of this adsorbent material. It can be in block, granulated, or powdered form.

    Activated Rosin Flux. Flux, Rosin Activated

    Activator. Thermally reactive compounds (such as amine hydrochlorides or various halides) that break down at elevated temperatures and enhance the ability of a flux to remove oxides and other contaminants from surfaces being joined.

    Active Components. Electronic components such as semiconductors, transistors, diodes, etc., that can change the characteristics applied electrical signal.

    Active Hold-Down. The process of pressing a component lead directly in contact with a bonding pad during soldering to ensure intimate contact between the lead and pad.

    Activity. (1) Activities may consist of moving or handling materials and components, changing machine or tool settings, turning equipment on or off, etc. Poorly control of activities can create process variability and varying quality. (2) Flux Activity

    ADC. Analog-To-Digital Converter

    Additive Plating. Plating, Additive

    Adhesion. The state in which two surfaces are held together by interfacial forces which may consist of valence forces or interlocking action.

    Adhesion, Mechanical. Adhesion between surfaces in which the adhesive holds the parts together by interlocking action.

    Adhesive. A substance capable of holding material together by surface attachment.

    Adhesive, Anisotropic. An adhesive with a low concentration of metal particles to permit conduction in the z-axis only.

    Adhesive, Conductive. A two part system comprised of a polymer base and a conductive filler.

    Adhesive Failure. Failure resulting from insufficient bond between the adhesive and one or both substrates. Adhesive strips away from substrates.

    Adhesive Specific. Adhesion between surfaces which are held together by valence forces or molecular bonding.

    Adhesive Tensile Loading. When the acting forces are applied at right angles to the plane of the adhesive. The tensile strength of a bond is the maximum tensile load per unit area, required to break the bond expressed in pounds per square inch.

    Adhesive, Thermoplastic melt on application. The process is reversible.

    Adhesive, Thermoset undergo a chemical change during heating. The change is not reversible. Epoxies and acrylics are thermosets.

    AFM. See atomic force microscope.

    Ag. Chemical symbol for the element silver.

    Aging. The change in the properties of a material over time and under varying conditions of humidity, temperature, pressure, etc.

    Air Knife. (1) A mechanical air pressure amplifier. (2) A plenum with a narrow opening used develop high velocity air from a low pressure air source to (a) dry / remove liquid films from surfaces (b) control the coating of surfaces, or (c) heat or cool.

    Algorithm. A set of rules specifying a sequence of actions taken to solve a problem.

    Alignment Hole. Tooling Hole

    Alloy. A substance made by melting two or materials together.

    Alumina. A common substrate material composed of approximately 95% Al2O3.

    Ambient Level. The values of signals and noise that exist at a test location when the device under test is not active.

    Amorphous Phase. Non-crystalline. Most plastics are amorphous at processing temperature. Many retain this strength under normal temperatures.

    Analog Circuit. An electrical circuit that provides a continuous relationship between its input and output.

    Analog-To-Digital Converter (ADC or A/D converter). An electronic circuit that produces a digital output directly proportional to an analog signal input.

    Anechoic Chamber. An enclosure especially designed with walls that absorb sound or radiation, creating an essentially free-field environment for testing.

    Angle Of Attack. The angle between the squeegee and the stencil or screen.

    Angstrom. A unit of length equal to one hundred-millionth (10^-8) of a centimeter, often used to specify radiation wavelengths.

    Anion. An ion with a negative charge. An anion [such as chloride (Cl-), nitrate (NO3-), bicarbonate (HCO3-), or sulfate (SO4–)] may result from the dissociation of a salt, acid, or alkali.

    Anion Exchange. Ion Exchange. A water conditioning process.

    Antioxidants. Compounds that retard the rate of oxidation of a polymer.

    Anisotropic. Exhibiting different physical properties in different directions.

    Anisotropic Adhesive. Adhesive, Anisotropic

    Annular Ring. The pad area that remains after a hole is drilled through the pad.

    ANSI. American National Standards Institute

    Antistatic Materials resist turbocharging more than ?00 volts.

    Anti-Pad. The area of copper etched away around a via or a plated through-hole on a power or ground plane, thereby preventing an electrical connection being made to that plane.

    AOI. Automated Optical Inspection

    Application-Specific Integrated Circuit (ASIC). An IC device whose function is designed for a specific application(s).

    Aperture. An opening in a stencil or screen.

    Aperture, Chemical Etched. An opening in metal stencil created by coating the metal foil with photoresist, exposing an image both sides the resist using a phototool, and etching the foil from both sides.

    Aperture, Electroformed. An opening in stencil formed by imaging a photoresist on a substrate and then plating the nickel foil around the resist to the desired thickness.

    Aperture, Electropolished. An electrolytic post-process that “smooths” the walls of aperture walls to improve solder paste printing.

    Aperture Files. Precise x-y location and shape of all apertures required on a printed circuit board.

    Aperture, Laser Cut. An opening in a metal stencil created by using Gerberâ and aperture data to position a laser cutting head.

    Aperture, Trapezoidal. An aperture with the board side opening 1 to 2 mils larger than the squeegee side opening.

    API. Application Program Interface

    Application Program Interface. The interface between the application’s software and the application platform.

    Application Software. A program that performs a specific service or solves a particular problem.

    AQL. Acceptable Quality Level

    Aqueous. A water soluble.

    Aqueous Cleaning. Cleaning, Aqueous

    Architecture. A structured set of protocols that implement the functions of the system.

    Array. A group of components arranged on rows and columns.

    Artwork. A phototool used to create (1) features during printed circuit board fabrication or (2) apertures on a screen or a chem-etched stencil.

    Artwork Generation. The process of transferring the CAD circuit layout to reproducible artwork for use by stencil and printed circuit board fabricators.

    Artwork Master. Artwork used to produce production masters.

    ASIC. Application Specific Integrated Circuit

    ASME. American Society of Mechanical Engineers

    Aspect Ratio. (1) Thickness of a printed circuit board to the diameter of the smallest hole. (2) Thickness of a stencil to the width of the smallest aperture.

    Assembler. A program that translates mnemonics into binary codes that run on a computer.

    Assembly. A functional subdivision of a component, consisting of parts or subassemblies that perform functions necessary for the operation of the component as a whole. Examples: regulator assembly, power amplifier assembly, gyro assembly, etc.

    AST. Accelerated Stress Testing

    ASTM. American Society for Testing and Materials

    Asynchronous. An action that takes place at an arbitrary time, without synchronization to a reference timer or clock.

    ATE. Automatic (Automated) Test Equipment

    Atm. Atmosphere pressure

    Atomic Force Microscope (AFM). A microscope that works by bringing a fine needle right up to the surface of a semiconductor and tracing the topography of the material. AFMs are an alternative to scanning electron microscopes as a means of measuring and monitoring the widths and heights of critical dimensions on an integrated circuit die.

    Au. Chemical symbol for the element gold.

    Automated Optical Inspection (AOI). A mechanized visual inspection process.

    AWG. American Wire Gage

    Axial Lead. Lead wire extending from a component or module body along its long axis.

    Axial Leaded Components are usually cylindrical in shape and have leads exiting from opposite ends along its long axis.

    Azeotrope. A liquid mixture with a constant maximum or minimum Où peut-on acheter les Cialis Génériques sans ordonnance? boiling point lower or higher than the boiling points of its components and with the capacity to distill without change in composition.

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    B-Stage Resin. An intermediate stage in curing a thermoset resin. Prepreg

    Back End Of The Line (BEOL). Test, assembly, and packaging of wafer manufacturing.

    Ball Bonding. Bonding, Ball

    Ball Grid Array (BGA) is surface mount technology IC package that provides electrical advantage of shorter signal and power paths and the mechanical advantage of greater interconnects and higher lead pitch, while decreasing package size.

    Bare Board. An unpopulated printed circuit board.

    Bare Die. An unpackaged integrated circuit.

    Barrel. The cylinder formed in the drilled through hole in a printed circuit board.

    Base Board. Base Material

    Base Material. In printed circuit board fabrication, the insulating laminate where the conductor pattern is formed.

    Batch. An entity that represents the production at any point in the process. A batch is a running control recipe. The material that is being produced or that has been produced by a single execution of a recipe is also considered a batch.

    Batch Control. Consists of a sequence of one or more steps (phases) that must be performed in a defined order for a finite period of time to process finite quantities of input material to produce finished product.

    Batch Manufacturing. Manufacturing in groups, lots or batches in which each part or finished good is identical.

    Batch Processing. The method adopted when the required product volumes do not allow continuous production of one product on particular machines.

    BBA. Bus Ball Array

    Bed-Of-Nails. A test fixture, used with (automated) test equipment, made of spring loaded contact pins (Pogoâ pins) located to correspond with desired measurement points (nodes) on a printed circuit board.

    Bend Radius. The radius at the inside of the bend at (1) the lead shoulder leading to the leg and (2) the base of the leg leading to the foot.

    BEOL. Back End Of The Line

    BGA. Ball Grid Array

    Bi. Chemical symbol for the element bismuth.

    Bifurcated Terminal. Terminal, Bifurcated

    Binder. Materials added to pastes and adhesives to provide strength for handling purposes.

    Binning. Classifying components by their performance at the final test. The analogy is to physically drop things into different bins.

    Bipolar. (1) A signal that includes positive and negative values. (2) A type of semiconductor.

    Birdcage. A defect in stranded wire where the strands in the stripped portion between the covering of an insulated conductor and a soldered connection (or an end-tinned lead) have separated from the normal lay of the strands.

    BIST. Built-In Self Test

    BIT. Built-In Test

    Blind Via. Via, Blind

    Blister. Raised areas on the surface of the laminate caused by the pressure of volatile substances entrapped within the laminate.

    Blow Hole. A cavity in the solder surface whose opening has an irregular and jagged form, without a smooth surface.

    Board. Printed Circuit Board

    Board-Level (Circuitry) Repair. Repair, Board-Level (Circuitry)

    BOD. Biological Oxygen Demand

    Bond Strength. The force per unit area required to separate two adjacent layers of a package. The force is applied perpendicular to the surface of the package.

    Bonding. Joining of two materials.

    Bonding Alloy. Solder

    Bonding, Ball. A wire bonding method that melts a sphere of gold wire, melts the sphere at the first connection point, draws a loop in the wire, and makes a wedge bond at the other connection point.

    Bonding, Die. The attachment of an integrated circuit chip to a substrate.

    Bonding Pad. Pad. Termination

    Bonding, Tape. Using a metal or plastic tape material to support the carrier of a component in a gang bonding process.

    Bonding, Thermocompression. Machines that use pressure and heat in the absence of electrical current and without an intermediate material to form wire bonds.

    Bonding, Thermosonic. Machines that use heat (typically 150罜), ultrasonic energy, force, and time to form wire bonds.

    Bonding, Ultrasonic. Machines that use ultrasonic energy, force, and time to form wire bonds.

    Bonding, Wedge. A wire bonding method that can use either gold or aluminum wire. Aluminum wedge bonds are made with ultrasonic bonding machines. Gold wedge bonds are made using thermosonic bonding machines.

    Bonding, Wire. A die connect methodology that runs either gold or aluminum wires between pads on the integrated circuit to either a lead frame or pads on a printed circuit board. Ball and wedge bonding are primary wire bonding methods, of which ball bonding is more common.

    Boundary Scan. A functional test designed into integrated circuits.

    Bow. A cupped variation from a known flatness of a printed circuit board.

    Breakaway Tabs. Excess material left on printed circuit boards during fabrication to improve board handling that is removed after assembly.

    Breakout. Poor registration between the hole and the pad on a printed circuit board to the degree that the hole is not within the area of the pad.

    Bridging. A buildup of solder between components, conductors, and/or base substrate forming an undesired conductive path.

    British Standards Institute (BSI). A standard setting organization.

    BSI. British Standards Institute

    Buffer. A solution that minimizes changes in hydrogen ion concentration that would otherwise occur as a result of a chemical reaction.

    Built-In Self Test (BIST). Test, Built-In

    Built-In Test (BIT). Test, Built-In

    Bulk Components. Packaging with loose chip or MELF components that with a special feeder present the parts the pick and place head.

    Bump. A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.

    Buried Via. Via, Buried

    Burn-In. An accelerated stress test run at elevated temperature to weed-out marginal components.

    BPA. Bus Pad Array

    Butt Lead Package. I Lead Package.

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    C4. Controlled Collapse Chip Connection

    C5. Controlled Collapse Chip Carrier Connection

    C-Stage Resin. A resin in the final stage of curing.

    CAD. Computer Aided Design

    CAGR. Compound Annual Growth Rate

    CAM. Computer Aided Manufacturing

    Camera, Component. An upward looking camera used to determine part position offsets required for proper placement.

    Camera, Fiducial. A downward looking camera in the placement head used to determine position of the printed circuit board relative to the head. Or vice versa.

    Canadian Standards Association (CSA). A Canadian safety standard certification organization.

    Capability. Process Capability

    Capability Ratio. Cp

    Capability Ratio, Centered. Cpk

    Capacity Buy. Buying of equipment to increase manufacturing capacity, as opposed to a technology buy.

    Capillary Action. A flow of a fluid against gravity between solid surfaces.

    Card. Printed Circuit Board

    Carrier Tape. Tape, Carrier

    CASE (Tools). Computer-Aided Software Engineering.

    Castellation. Metalized features that are recessed on the edges of a chip carrier, which are used to interconnect conducting surfaces or planes within a chip carrier or on the chip carrier.

    Catalyst. A chemical that changes the rate of a chemical reaction.

    Cation. A positively charged ion in an electrolyte solution, attracted to the cathode under the influence of a difference in electrical potential. Sodium ion (Na+) is a cation.

    Cation Exchange. Ion Exchange. A water conditioning process, commonly used for water softening.

    Cation Exchange Resin. Cation exchanger. Base exchanger. An ion exchange material possessing reverse exchange ability for cations. Sulfonated polystyrene copolymer divinylbenzene (DVB) exchange resin is used almost exclusively today in ion exchange water softeners.

    CBGA. Ceramic Ball Grid Array

    Chip Carrier

    CCGA. Ceramic Column Grid Array

    Centered Capability Ratio. Cpk

    Centering. Correcting the actual center of a part on a nozzle after picking to the true center of the nozzle.

    Centering, Mechanical. Repositioning a part on a nozzle after it has been picked using spring-loaded jaws that close around the part and move it to the proper position.

    Centering, Vision. Using a camera to determine position offsets to compensate for the location of the part on the nozzle.

    Ceramic. An inorganic, nonmetallic material, such as alumina, beryllia, steatite, or forsterite, which is fired at a high temperature. Ceramics are used in electronics as a substrate or to create component packages.

    Ceramic Ball Grid Array (CBGA). A ball grid array (BGA) package of cofired alumina ceramic substrate allowing various lid sealing and encapsulation techniques.

    Ceramic Column Grid Array (CCGA). A ceramic ball grid array (CBGA) with solder columns replacing the solder balls.

    Certification. The act of verifying and documenting that personnel have completed required training and have demonstrated specified proficiency and have met other specified requirements.

    CFC. Chlorinated Fluorocarbon (Chlorofluorocarbon)

    CFR. Code of Federal Regulation

    CGA. Column Grid Array

    Chelating Agent. This agent forms a bond with the ions, such as calcium and magnesium ions and prevents precipitation of calcium and magnesium salts as hard water.

    Chelation. The mechanism by which chemicals that would otherwise precipitate are complexed in solution with a chelating agent.

    Chemical Etched Aperture. Aperture, Chemical Etched.

    Chemical Etched Stencil. Aperture, Chemical Etched.

    Chemical Vapor Deposition (CVD). Deposition of thin films (usually dielectrics/insulators) on silicon wafers by placing the wafers in a mixture of gases which react at the surface of the wafers.

    Chem-Etched. Chemical(ly) Etched.

    Chip. (1) Chip Component. (2) Integrated Circuit. (3) Bare die.

    Chip Carrier. A low profile four sided (rectangular) part package, whose semiconductor chip cavity or mounting area is a large fraction of the chip size.

    Chip Component. A SMT passive device, including resistors, capacitors, and inductors.

    Chip On Board (COB). An unpackaged silicon die mounted directly on the printed circuit board and connected with wire bonds.

    Chip Scale Package. A popular description is that a CSP must be no more than 120% the X and Y dimensions of the silicon die within the package. So, the CSP is a die on a carrier substrate. In order to maintain the CSP die to package ratio the CPS is generally a ball grid array. So, this description becomes fuzzy because CSP fabricators routinely shrink the die to reduce cost, but generally do not change packaging.

    Chip Shooter. A high speed surface mount component handler and placer.

    Chlorofluorocarbon (CFC). A chemical that was used in the electronic, chemical, and refrigeration industries.

    CIM. Computer Integrated Manufacturing

    Circuit. Circuitry

    Circuit Width. Conductor Width

    Circuitry. The configuration or design of the conductive material on the base material. This includes conductors, lands, and through connections when these connections are an integral part of the manufacturing process.

    Circuitry-Level Repair. Repair, Board-Level (Circuitry)

    Circumferential Separation. A crack or void in the plating extending around the entire circumference of a PTH, or in the solder fillet around the conductor, in the solder fillet around an eyelet, or at the interface between a solder fillet and a land.

    Clamshell (Fixture). A two sided test fixture that opens like a book (clamshell) to accept the printed circuit board or assembly for testing.

    Class XXXX Clean Room. A clean room rating system. For instance, a Class 100,000 Clean Room limits the particle count to less than 3500 particles per liter (100,000 particles per cubic foot) of a size of 0.5 micron or larger, or 25 particles per liter (700 particles per cubic foot) of a size 5.0 microns or larger.

    CLCC. Ceramic Leaded Chip Carrier

    Clean Room. An enclosed room employing control over particulate matter in the air with temperature, humidity, and pressure controls.

    Cleaning. The process of removing flux residues and other contaminants from the surface of a printed circuit assembly.

    Cleaning, Aqueous. Cleaning parts with water (e.g., tap, pure, or de-ionized) as the primary cleaning fluid.

    Cleaning, Manual. Spot cleaning flux residues from assembly surfaces, usually using a brush and isopropyl alcohol as the cleaning agent or solvent.

    Cleaning, Plasma. A bonding pad preparation process that uses electrically excited gas molecules to remove surface contamination.

    Cleaning, Semiaqueous. A cleaning process using a solvent followed by a hot water rinse and drying.

    Cleaning, Solvent. A cleaning process using chlorinated and fluorinated hydrocarbon liquids.

    Cleaning, Ultrasonic. A cleaning process using ultrasonic energy (mechanical oscillation ) along with a chemical solvent.

    Cleaning, Vapor Degreaser. A cleaning process where a heated solvent is condensed on the printed circuit board to be cleaned.

    Client. A software application which communicates with another software application (the server). The server normally supplies data or functions to the client.

    Clinched Lead. A pin through hole lead that is bent on the solder side of the printed circuit board to hold the component in place prior to soldering.

    Contract Manufacturing (Manufacturer)

    CMOS. Complementary Metal Oxide Semiconductor

    CMS. Contract Manufacturing Services

    Coating. A thin layer of conductive or dielectric material applied over components or a base material.

    COB. Chip On Board

    Cohesive Failure occurs when internal strength of the adhesive is not as great as the forces applied to it. Adhesive remains bonded to both substrates.

    Coefficient of Thermal Expansion (CTE). The ratio of change in dimension per unit change in temperature.

    Cofire. A process for forming multilayer ceramic substrates in which thick-film conductors and dielectrics are simultaneously processed by a firing cycle.

    Cold Flow. Movement of insulation (e.g. Teflon) caused by pressure. Creep.

    Cold-Junction Compensation. An artificial reference level that compensates for ambient temperature variations in thermocouple circuits.

    Cold Solder Joint. Solder Joint, Cold

    Colloid. A substance that remains suspended in a solution or fails to settle out of solution.

    Column Grid Array (CGA). A packaging technology similar to a pin grid array, in which a device’s external connections are arranged as an array of conducting pins on the base of the package. However, in the case of a column grid array, small columns of solder are attached to the conducting pads.

    Comb Pattern. Two sets of interconnected interspaced finger-like arrays of uniformly spaced conductors. SIR testing requires comb patterns on printed circuit boards.

    Combinational Testing. Test, Combinational

    Compiler. A program that translates high-level-language statements into codes that a computer can execute.

    Component. (1) A functional subdivision of a system, generally a self-contained combination of assemblies performing a function necessary for the system’s operation. Examples: power supply, transmitter, gyro package, etc. (2) A part of an assembly or subassembly. A part.

    Component Camera. Camera, Component

    Component Hole. Plated-Through-Hole (PTH)

    Component Lead. A wire or formed conductor extending from a component and serving as a mechanical and/or electrical connection.

    Component-Level Repair. Repair, Component-Level

    Component Side. Primary side

    Composite. A resin combined with another material, such as glass fiber, to improve physical properties.

    Computer Aided Design (CAM). A design method that uses computer generated images, rather than mechanical drawings.

    Computer-Aided Software Engineering (CASE) Tools allow users to make changes in the way they access information from a relational data base.

    Computer Integrated Manufacturing (CIM). Linking computer aided design data to the computer controlled assembly and test equipment used to produce the product.

    Conductive Adhesive. Adhesive, Conductive

    Conductive Material. Electrostatic Conductive Material

    Conduction (Soldering). Soldering, Conduction

    Conductor. A lead, solid or stranded, or printed wiring path serving as an electrical connection.

    Conductor Spacing. The distance between traces on a printed circuit board.

    Conductor, Thermal. Thermal Conductor

    Conductor Thickness. The thickness of the conductor including all metallic coatings, excluding non-conductive protective coating.

    Conductor Width. The observable width of a circuit or conductor at any point chosen at random. The width is measured from directly above.

    Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection.

    Conformity. The ability to satisfy specified requirements.

    Connection. An electrical termination that was soldered. A solder joint.

    Connection, Interlayer. An electrical connection between conductive patterns in different layers of a printed circuit board. Via

    Construction Analysis. Destructive Physical Analysis (DPA). The process of destructively disassembling, testing, and inspecting a device for the purpose of determining conformance with applicable design, process, and workmanship requirements.

    Contact Angle. Wetting angle. The angle of wetting between a solder fillet and the pad or component lead. A small contact angle indicates good wetting, and a large angle indicates poor wetting.

    Contact Resistance. The maximum resistance allowed between a pin and the socket contacts of a connector when assembled and in use.

    Contaminant. An impurity or foreign substance present in a material that affects one or more properties of the material. A contaminant may be or not be ionic.

    Control Chart. A chart for tracking a series of measurements taken over time.

    Control System. A system to guide or manipulate various elements in order to achieve a prescribed result.

    Convection. Transfer of energy (heat) by the circulation of a fluid or gas.

    Conveyor. A machine that supports a printed circuit board and moves it from one location to another.

    COO. Cost Of Ownership

    Coplanarity. The vertical spread in the measurement of the lowest and highest contact (“out-of-line”) of a package.

    Copper Tin Intermetalic. Intermetalic, Tin Copper

    Core Material. In printed circuit board fabrication, fully cured inner layers of a multilayer printed circuit board.

    Core Solder. Solder, Wire/Core

    Corrosion. The chemical reaction of a metal in contact with the air.

    COTS. Commercial Off The Shelf

    Coupon. A portion of a printed circuit board used for testing.

    Court Yard. The keepout area of a surface mount component.

    Cover Tape. Tape, Cover

    Cp. Capability Ratio. Measurement of the width of the distribution of process measurements, compared to a desired point.

    Cpk. Centered Capability Ratio. Measurement of the mean of process measurements, compared to a desired point.

    Crazing. An internal condition occurring in the laminate base material in which the glass fibers are separated from the resin, caused by mechanical stress.

    Creep. Cold Flow

    Critical Dimension (CD). The minimum width that is allowed as part of the circuit design, on any given patterning layer.

    Critical Path Method. A technique to determine the order in which operations must be executed to complete a project in minimum time, and determine which operations have some “float” or capacity to be rescheduled without affecting the minimum time.

    CRT. Cathode Ray Tube

    Crystallinity. A state of molecular structure in some polymers denoting uniformity and compactness of the molecular chains.

    CSA. Canadian Standards Association

    CSP. Chip Scale Package

    CSP-C. Ceramic Chip-Scale Package

    CSP-L. Laminate Chip-Scale Package

    CTE. Coefficient of Thermal Expansion

    CTE Mismatch. The difference in the CTE of two materials or components joined together. This mismatch can produce strains and stresses at joining interfaces or in attachment surfaces.

    Cu. Chemical symbol for the element copper.

    Cup Terminal. Terminal, Cup

    Cure. A heat, catalyst, or pressure activated chemical reaction that changes the physical properties of a material.

    Curing Cycle. The time-temperature profile needed to cure a thermosetting material like a bonding adhesive.

    Curing Time. The time needed to cure a thermosetting plastic material.

    Cycle Rate. A dry run time.

    CVD. Chemical Vapor Deposition

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    DAC or D/A Converter. Digital-To-Analog Converter

    DARPA. Defense Advanced Research Projects Agency

    Data Acquisition System. Any device that acquires information from sensors using amplifiers, multiplexers, and analog to digital converters.

    DCA. Direct Chip Attach

    DCS. Distributed Control System

    DDA. Direct Die Attach

    DDE. Dynamic Data Exchange

    Defect. Any nonconformance to specified requirements by a unit or product.

    Definition. Degree that a produced pattern matches the master pattern.

    Defluxing. Cleaning. Removing flux residues after a soldering operation.

    Degradation. Destructive change in the chemical structure of a plastic reflected in its appearance or physical properties.

    Degreasing. Cleaning. Removing wave oil and flux residues after a soldering operation.

    Deionized (DI) Water. A pure form of water with no ionized material.

    Delamination. A separation of the bonded layers or foils of a laminated material, such as a printed circuit board.

    Dendrite. Metallic filaments growing by electromigration between two points.

    Density. The weight of a material in relationship to its volume.

    Deposition. The process of applying a material on a substrate by applying pressure through a screen or stencil.

    Desiccant. A substance, such as calcium oxide or silica gel, with a high attraction for water and is used as a drying agent.

    Desiccant Cabinet. A nitrogen atmosphere storage area for moisture sensitive parts.

    Design Of Experiments (DOE). A statistical technique for determining the relationship between and relative importance of various factors controlling a process.

    Design Rules. Allowable dimensions, keepout areas, and tolerances used in the layout and design of circuitry.

    Desoldering. A disassembly method of removing the solder from components on a printed circuit board.

    Detergent. A product designed to make materials, often oils and greases, soluble in water. Usually, detergents are made from synthetic surfactants.

    Deviation. A specific authorization, granted before the fact, to depart from a particular requirement of specifications or related documents.

    Device. Component

    Dewetting. The condition in the solder joint in which the liquid solder has not adhered intimately with one or more the components. Characterized by an abrupt boundary between the solder and the component lead or conductor. Can be distinguished by a “rolling back” of the solder from the lead or conductor.

    DFA. Design For Assembly

    DFT. Design For Test

    DI (Water). Deionized water.

    Diazo. A type of artwork film.

    Die. Integrated circuit chip as diced or cut from the finished wafer.

    Die Attach. Bonding a die to its mount in its package. This is often done with a metal based glue-like silver epoxy for good conduction of heat away from the chip.

    Die Bonding. Bonding, Die

    Dielectric. Nonconducting material used to encapsulate circuitry and in the manufacture of capacitors and printed circuit boards.

    Dielectric Constant. That property of a dielectric which determines the electrostatic energy per unit volume for unit potential grade.

    Dielectric Strength. The voltage at which an insulating material can withstand before breaking down occurs, usually expressed as volts per mil.

    DIP. Dual Inline Package

    Diffusion. A material transport phenomena that occurs in solids, and is caused by the continual physical motion of atoms from one position to another. This results in the flow of material from regions of high concentration to regions of low concentration.

    Digital. A type of circuit in which the signals can have only one of two possible states, a “1” or a “0”.

    Digital-To-Analog Converter (DAC or D/A Converter). A device that converts digital information into a corresponding analog voltage or current.

    Dikes. Side Cutter

    Direct Chip Attach (DCA). Chip-on-board technology.

    Direct Die Attach (DDA). Direct Chip Attach

    Direct Memory Access (DMA). The direct transfer of information between a computer’s memory and a device while the computer’s CPU does something else.

    Discrete Components. Individual resistors, capacitors, diodes etc.

    Dispense (ing). A machine or manual method of applying solder paste, adhesives, and other gels using air or mechanical pressure to force the material being dispensed through a nozzle or tip onto a substrate.

    Dispersants. Organic and inorganic phosphates and polymers used in aqueous cleaning to assist in the removal of insoluble materials.

    Dissipation Factor. The tangent of the loss angle of the insulating material.

    Dissipative Material. Electrostatic Dissipative Material

    Dissociation. The separation of an electrolyte into ions of opposite charge.

    Distributed Control System (DCS). A real-time control system for continuous and batch process applications.

    Distributed Processing. The physical and/or logical connectivity of hardware, software, information and load sharing.

    Disturbed Solder Joint. Solder Joint, Disturbed

    Divinylbenzene (DVB). A widely used cation exchange resin.

    Document Management System. Provides storage, retrieval and manipulation of documents in a compact space.

    DOE. Design Of Experiments

    Double-Sided Assembly. A printed circuit assembly with components on both sides of the substrate.

    Double Sided Reflow Soldering. Reflow Soldering, Double Sided

    Down Force. Squeegee Pressure.

    DMA. Direct Memory Access

    DPA. Destructive Physical Analysis or Construction Analysis

    DPM. Defects Per Million (opportunities)

    DRAM. Dynamic Random Access Memory

    Draw Bridge. Tomb Stone

    Drill Files. Precise x-y location and sizes of all holes required on a printed circuit board.

    Drill Wander. In printed circuit board fabrication, deviation from the target drilling location.

    Dry Etching. Plasma Etching

    Dry Run (ning). Operating a machine without processing. For instance, dry running a placement machine sequentially moves the head to the feeders and the component placement locations.

    Dross. Chiefly tin oxide, but contains oxidized lead and other contaminants that form on the surface of molten solder.

    Dross Content. A measure of the cleanliness of solder powder.

    DSP. Digital Signal Processor

    Dual Inline Package (DIP). A PTH package with two parallel rows of leads extending from the base of the component. Standard lead pitch is 0.100 inch.

    Dry Film (Solder Mask). Solder Mask, Dry Film

    Dual Gantry. A machine positioning system with two independent gantries.

    Dual Wave Soldering. Soldering, Dual Wave

    Dummy Component. A non-functional component package.

    Dummy Land. A conductor on a printed circuit board that is not connected electrically to other circuitry.

    Dummy Pad. Pad, Dummy

    Durometer. A measure of the hardness of a non-metal.

    DVB. Divinylbenzene

    Dynamic Data Exchange. DDE is a communication protocol that allows Windows® programs to communicate with each other.

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    E

     

    Edge Connector. The portion of the PCB used to provide external electrical connection.

    Edge Clearance. A keepout area on the side and each ends of printed circuit boards required for board handling.

    EDS. Energy Dispersive Spectrograph

    EIA. Electronic Industries Association

    EIAJ. Electronic Industries Association of Japan

    Elastomeric. A material that at room temperature can be stretched repeatedly to at least twice its original length, and upon release of the stress, will return with force to its approximate original length. Rubber band material is elastomeric.

    Electrochemical Migration. An unplanned electrolytic plating process. A film of polar solvent, often water, on a substrate surface provides for current flow between points with a difference in electrical potential.

    Electrode. A conductor through which a current enters or leaves an electrolytic cell, vacuum tube, or any nonmetallic conductor.

    Electroformed Aperture. Aperture, Electroformed

    Electroformed Stencil. Stencil, Electroformed

    Electroless Nickel – Immersion Gold. A coating applied during printed circuit board fabrication to protect copper features from oxidation.

    Electroless Plating. Plating, Electroless

    Electrolyte. Compounds that conduct an electric current by the movement of ions.

    Electrolytic Corrosion. Corrosion by means of electrochemical action.

    Electrolytic Plating. Plating, Electrolytic

    Electromagnetic Compatibility (EMC). (1) The ability of electronic equipment to operate in an intended electromagnetic environment without degradation caused by interference. (2) The ability of equipment to operate in its electromagnetic environment without creating interference with other equipment.

    Electromigration. Electrochemical Migration

    Electroplating. Electroless Plating.

    Electropolished Aperture. Aperture, Electropolished

    Electropolished Stencil. Stencil, Electropolished

    Electrostatic Conductive Material. Material with a surface resistivity of 10 ohms per square maximum.

    Electrostatic Discharge (ESD). The transfer of a charge when the two objects have different electrostatic potentials. The potentials can be caused by either direct contact or induced by an electrostatic field. In electronic manufacturing, the employee working on a printed circuit board and a component on the same board can have different electrostatic potentials, which will damage electronic components.

    Electrostatic Dissipative Material. Materials with a surface resistivity greater than 10^5, but less than 10^12 ohms per square.

    Electrostatic Field. A voltage gradient between an electro-statically charged surface and another surface of a different electrostatic potential.

    Electrostatic Insulating Material. Materials with a surface resistivity greater than 10^12 ohms per square.

    Elevator, Tray. Feeder, Tray

    Elongation. The fractional increase in length of a material stressed in tension.

    Embossed Tape. Tape, Embossed

    EMC. Electromagnetic Compatibility

    EMI. Electromagnetic Interference

    EMS. Electronic Manufacturing Services

    Emulsifier. An aqueous additive used to keep soils dispersed throughout the cleaning fluid.

    Emulsion. A material that suppliers build-up on a printing screen to block portions of the screen. The un-blocked (open) portion of the screen define the pattern for depositing solder paste on the printed circuit board.

    Encapsulating. Potting. Enclosing an article in an envelope of adhesive.

    Encapsulating Compound. An electrically nonconductive compound used to completely enclose and fill in voids between electrical components or parts.

    Encoder. A precision glass or metal ruler mounted on the frame of a machine that is used to measure the location of a moveable head. Encoders can be either linear or rotary.

    ENIG. Electroless Nickel – Immersion Gold

    Enterprise Resource Planning (ERP). A logistical extension of MRP.

    EPBGA. Enhanced Plastic Ball Grid Array

    Epoxy. A polymer thermosetting resin used to bond materials.

    Epoxy Resin. A material that forms straight chain thermoplastic and thermosetting resins. Epoxy resins have excellent mechanical properties and good dimensional stability.

    EPROM. Electronic Programmable Read Only Memory

    ERP. Enterprise Resource Planning

    ESD. Electrostatic Discharge

    ESD Sensitive. Electrical and electronic parts, assemblies and equipment that could be damaged by ESD voltages.

    ESDS. Electrostatic Discharge Sensitive

    Etch Factor. The ratio of etch depth to the amount the resist is undercut during etching.

    Etching. The process of selectively removing any material not protected by a resist using an appropriate solvent or acid.

    Ethyline Vinyl Acetate Resins (EVA). Co-polymers of the polyolefins family derived from random co-polymerization of acetate and ethylene.

    Eutectic. An alloy with a lower melting point lower than the melting points of its components. 63% tin and 37% lead (63Sn/37Pb) solder is referred to as eutectic solder. Eutectics change directly from liquid to solid, and the reverse, with no intermediate plastic states.

    EVA. Ethyline Vinyl Acetate Resins.

    Event Counter. A circuit that counts the occu

    By News and Events • • • • 0 Comments

    Eyelet Suppliers Listing

     

    A list of some domestic market eyelet suppliers follows. It is not comprehensive and is not an endorsement of particular suppliers. The first suppliers listed are those which seem to be most frequently associated with Auto Insertion projects.

    Stimpson Co., Inc.
    Bayport, NY 11705-1097 USA
    Phn 516-472-2000
    Fax 516-472-2425

    Round, Oval, Oblong, Square Shoulder, Closed-End Telescoping, Tongue, Over 3,250 Different Styles and Sizes, Hand, Foot and Automatic Eyeletting Machines, Snap Fasteners, C-E Rivets, Ferrules, Fasteners and Automatic Attaching Machines. Assembly Service Department will assemble your article with the appropriate fastener and submit with prices.

    PCI Group, Inc.
    New Bedford, MA 02741 USA
    Phn 800-232-2346
    Fax 508-995-4950
    Cust Serv Fax 508-998-7446

    Precision Industrial Fasteners, Industrial Eyelets, Shoe Eyelets, Grommets and Washers. Eyelet/Grommet Setting Tools, Eyelet/Grommet Insertion Machinery, Metal Stampings.

    Mark Eyelet
    63 Wakelee Road
    Wolcott, CT 06716
    Phn 203-756-8847
    Fax 203-755-9410

    Highland Mfg Co., The – Waterbury, CT
    Cly-Del Manufacturing Co., The – Waterbury, CT
    Braxton Mfg. Co., Inc. – Watertown,CT
    Stimpson Co., Inc. – Bayport, NY
    Platt Bros. & Co., The – Waterbury, CT
    PCI Group, Inc. – New Bedford, MA
    Carby Corp., The – Watertown, CT
    Utitec, Inc. – Watertown, CT
    Perterson Manufacturing Co., Inc. – Sarasota, FL
    International Eyelets, Inc. – Vista, CA
    Gem Manufacturing Co., Inc. – Waterbury, CT
    Trans-Matic – Holland, MI
    National Die Company, The – Wolcott, CT
    Eyelets For Industry, Inc. – Thomaston, CT
    Stevens Company, Inc. -0 Thomaston, CT
    WTM Company, Inc. – Thomaston, CT
    Auto-Form, Inc. – Waterbury, CT
    Demsey Mfg. Co., Inc. – Watertown, CT
    Zero Stamping Co., Inc. – Taylor, MI
    Twinplex Mfg. Co. – Wood Dale, IL
    Howard Engineering Co., Inc. – Naugatuck, CT
    Nutmeg Eyelet & Stamping Co., Inc. – Naugatuck, CT
    Hylie Products, Inc. – Watertown, CT
    Bouffard Metal Goods, Inc. – Watertown, CT
    Truelove And Maclean, Inc. – Waterbury, CT
    Line Manufacturing Inc. – Waterbury, CT
    Prospect Machine Products Inc. – Prospect, CT
    Accurate Forming A Tyco International Ltd., Co. – Hamburg, NJ
    Semco Tool & Mfg. Co. – Naugatuck, CT
    Presspart, Inc. – Cary, NC
    Superior Eyelets, Inc. – Waterbury, CT
    Advance Stamping Co. – Detroit, MI
    Jo-Vek Tool & Die Mfg. Co., Inc. – Waterbury, CT
    Marga Service Co. – Bethany, CT
    Olympic Tool – Redford, MI
    Preyco Manufacturing Co., Inc. – Waterbury, CT
    Gary Industries Inc. – Bethany, CT
    Electronic Eyelet & Interconnect, Inc. – San Jose, CA
    Metaltec, Div. of Technology General – Franklin, NJ
    Automatic Drawn Products Inc. – Skokie, IL
    FPC Corporation – Wauconda, IL
    G & J Steel & Tubing Inc. – Somerville, NJ
    Thompson Machine:The Tool & Die Group, Inc. – Albuquerque, NM
    Segal, Edward, Inc. – Thomaston, CT
    Gabriel Mfg. Co., Inc. – Stony Point, NY
    Fastener Dimensions, Inc. – Ozone Park, NY
    Gasser & Sons, Inc. – Commack, NY
    Production Tube Cutting, Inc. – Dayton, OH
    Columbia Nut & Bolt Corp. – Moonachie, NJ
    Eagle Alloys Corp. – St. James City, FL
    Arens Controls, Inc. – Evanston, IL
    Ball Chain Mfg. Co. Inc. – Mount Vernon, NY
    L.C.S. Company – St. Paul, MN
    All-Tex Industries, Inc. – Chicago, IL
    Roselle Precision Products Inc. – Berkeley Heights, NJ
    Marion Mfg. Co., The – Cheshire, CT
    Cornell Mfg. Co., Inc. – Orangeburg, NY
    Carpin Mfg. Inc. – Nettbasert bestilling av impotenspiller Waterbury, CT
    OEM Fastening Systems – Norcross, GA
    Falcon Metal Corp. – Charlotte, NC
    Mohawk Manufacturing Co. Middletown, CT
    International Metal Products Corp. – Avon, CT
    Ultimate Hydroforming, Inc. – Sterling Heights, MI
    Automatic Turning & Machining Inc. – Kersey, PA
    Johnson & Hoffman Mfg. Corp. – Carle Place, NY
    Metallon, Inc. – Thomaston, CT
    Autoswage Products, Inc. – Shelton, CT
    Anomatic Corp. – Newark, OH
    Active Screw & Fastener – Elk Grove Village, IL
    Thoroughbred Metals, Inc. – Green Brook, NJ
    Proto-Tube Products Inc. – Eagleville, PA
    JLO Metal Products Inc. – Chicago, IL
    United Industrial Trading Corp. – Troy, MI
    Electroline Products – Canton , OH
    Samson Industries, Inc. – Los Angeles, CA
    Evans – East Providence, RI
    Kenlen Wire Co., Inc. – Livingston, NJ
    P & G Machining, Inc. – Bay Shore, NY
    Volkert Precision Technologies, Inc. / Arlin Tool Div. – Queens Village, NY
    Fabricated Metal Products, Inc. – Naugatuck, CT
    Aranda Tooling, Inc. – Huntington Beach, CA
    Cambridge Automatic Inc. – Natick , MA
    Clary Div. Of Alpine Engineered Products, Inc. – Grand Prairie, TX
    American Micro Products, Inc. – Batavia, OH
    Vicar International – Union, NJ
    Hardware Specialty Co., Inc. – Long Island City, NY
    J & J Swiss Precision, Inc. – Deer Park, NY
    Diamond Fasteners, Inc. – Farmingdale, NY
    Olin Brass/Fabricated Products – East Alton, IL
    Western Metal Spinning & Mfg. Corp. – Perris, CA
    Seidel, Inc. – Waterbury, CT
    O.P.M. Trading Co. USA, Inc. – Massapequa Park, NY
    AIMSCO, Inc. – Seattle, WA
    Hardware Specialty Co., Inc. – Carlsbad, CA
    Hanlon Industrial Fasteners, Inc. – Marlboraugh, MA
    Fischer Special Mfg. Co – Cold Spring, KY
    Empire Fasteners, Inc. – Long Island City, NY
    Neider, F.A., Co. – Augusta, KY
    Mathews & Co. – San Clemente, CA
    American Tube Fabricating Corp. – Watertown, CT
    Owen Tool & Mfg. Co., Inc. – Plainville, CT
    Eddy Corporation, The – New Milford, CT
    R.I. Metpro Inc. – Warwick, RI
    Celus Fasteners Mfg., Inc. – Andover, MA
    Precision Stamping – Farmers Branch, TX
    Jagemann Stamping Co. – Manitowoc, WI
    Axelrod, S., Co. – New York, NY
    Nova Wesco Inc. – Waterbury, CT
    Ho Hung Ming/Hiker Enterprises Ltd. – Scarborough, ON
    Bedford Products Co., Div. of Legg Plastic Products, Inc. – Roanoke, VA
    Marvell Pharmacal & Packaging Co. – Fairfield, NJ
    Gerstle, Walter N., Inc. – Irvington, NJ
    Globe Products Co., Inc. – Ennis, TX
    Lord & Hodge, Inc. – Middletown, CT
    Labold Corp. – Columbus, IN
    Barratt Tool Co., Inc. – Wolcott, CT
    Braxton Mfg. Co. of California, Inc. – Costa Mesa, CA
    Tranoco, Inc. – Travelers Rest, SC
    Wall, A.T., Co., Metal Components Div. (MCD) – Warwick, RI
    Eyelet Crafters, Inc. – Waterbury, CT
    Microwave Specialties, Inc. – Plainville, MA
    VAK Industries, Inc. – Moriarty, NM
    Amark Industries, Inc., Kenlen Wire Products Div., – Livingston, NJ
    Amark Industries, Inc., K&K Screw Machine Products Div. – Livingston, NJ
    Drawn Metal Products Co. – Niles, IL
    Elect-O-Matic Co., Inc. – Watertown, CT
    Johner Mfg. Corp. – West Milford, NJ
    AMP, Inc. – Wolcott, CT
    Process Metal Stamping Co. – City of Commerce, CA
    Samson Industries, Arizona Div. – Phoenix, AZ
    Walsh Eyelet Co. – Waterbury, CT
    Transfer Tool Products, Inc. – Grand Haven, MI
    Nytex Automatic Products, Inc. – Fredericksburg, TX
    J&J Precision Eyelet Inc. Thomaston, CT
    Admiral Screw Co. – Elk Grove Village, IL
    Bowcraft Trimming Co., Inc. – Passaic, NJ
    Geiger, H.G., Mfg., Inc. – Bronson, MI
    Industrial Die & Machine Corp. – Canton, MA
    International Stamping, Inc. – Warwick, RI
    Metal Flow Corp. – Holland, MI
    Page Madden Corp – Livingston, NJ
    Rau Fastener, Inc – Providence, RI
    Snapco Mfg. Co. – Irvington, NJ
    Hydro Aluminum Adrian – Adrian, MI
    Eyelematic Mfg. Co., Inc. – Watertown, CT
    Knight Mfg. Co. – Waterbury, CT
    Marvin Mfg. Inc. – Prospect, CT
    Neuweiler, Karl – Berkeley Heights, NJ
    Dask, J.B., Corp. – Norwood, MA
    Greene, G.G., Enterprises, Inc. – Warren, PA
    Neo Products Corp. – Henderson, TN
    Precision Stamping Co., Inc. – Howell, MI
    Spiveco, Inc. – Anaheim, CA
    SureSnap Fastener & Trim Inc. – New York, NY
    Truex Inc. – Pawtucket, RI
    Apparel Adornables – New York, NY
    Ben-Art Mfg. Co., Inc. – Prospect, CT
    Davey Products – Red Lion, PA
    Eyelet Enterprises, Inc. – Dorchester, MA
    Fixam Inc. – Racine, WI
    Teleflex Automotive Mfg. Corp. – Waterbury, CT
    Setting Tools, Inc. – Naperville, IL
    Bridgeport Slitting Co., Inc. – Bridgeport, CT
    Acme Eyelet & Stamping Co. – St. Charles, IL
    Ark Products Co. Inc. – Willow Street, PA
    Atlanta Hardware Specialty Co. – Norcross, GA
    Ferre Form Metal Products, Inc. – Oakville, CT
    PCB Eyelets Inc. – Goleta, CA
    Taylor Metal Products Co. – Mansfield, OH
    Electro Optics Mfg., Inc. – Wyandotte, MI
    Cerzel Tool & Engineering Co., Inc. – Broadview, IL
    Richards Metal Products Inc. – Wolcott, CT
    Zenex Tool Co. – North Bergen, NJ
    GKY Industries – Jersey City, NJ
    Sentenac Associates Inc. – Panorama City, CA
    Anstro Mfg. Co. – Wolcott, CT
    Burgess Mfg. Corp. – Suwanee, GA
    Challenge Eyelet Press Co., Inc. – East Dorset, VT
    Draw Form Inc. – Zeeland, MI
    Enterprise Carbide Tool Co. – Watertown, CT
    Liberty Metal Products Co. – Woodside, NY
    Metalock Repair Service, Inc. – Willow Springs, IL
    Scientific Decorating – Millis, MA
    Yale Hook & Eye Co. – Newark, NJ
    BMW Inc. – Lynn, MA
    Boston Machine Works Co. – Lynn, MA
    Duvall Screw Products, Inc. – Cedar Hill, MO
    Henefelt Precision Products, Inc. – Largo, FL
    Eyelet Design Inc. – Wolcon, CT
    Swiss Automatic Products – San Jose, CA
    Thuro Metal Products, Inc. – Brentwood, NY
    C & R Machine Products, Inc. – Bohemia, NY
    Hi-Tech – Greenville, SC
    Van-Ho Mfg. Inc. – Waterbury, CT