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Radial 5 Enhancements

 

There are three (3) enhancements that distinguish the Radial 5 from the Radial IIIXQ:

Auto Recovery
Increased Cycle Rate to 9,200 Cycles/Per Hour
New Machine Cover Package

Auto Recovery:

Auto recovery was introduced to aid our customers in their continuous pursuit of high quality electronics manufacturing. By having the machine repair misinsertions automatically, you greatly reduce the opportunity for operator error, and consequently increase the quality of your product.

First, we will briefly describe auto recovery and then follow with a discussion of some of the common questions customers might have about auto recovery. To initiate auto recovery, there is a set command in the software “auto R” that must be set to 1. If this set command is set to 0, the machine will perform repairs the ame as previous level machines did, with the operator placing a component in the board and pressing the repair button to activate the cut and clinch.

If auto R is set to 1 and the machine experiences a misinsertion, the misinserted component should be cleared from the board by the operator. Once the component has been cleared, the operator presses the repair button, then the start button. At this point, the operator can leave the machine and continue doing what they were before the misinsertion occurred. The chain will sequence the carrier clip back to the dispensing head that the misinserted component came from, and the dispensing head will then place a component in that carrier clip. That carrier clip then travels back to the insertion area and the component is inserted into the printed circuit board. The machine then continues automatically with the remaining insertions of the pattern program.

Some questions that customers may ask are listed below:

  1. Question: Is auto recovery an option that I need to buy?
    Answer: No. It comes standard with the machine software. Also, the price
    of the Radial 5 is the same as the Radial IIIXQ.
  2. Question: How long does it take the machine to perform auto recovery?
    Answer: The time required to perform auto recovery is based on the length
    and configuration of the sequencer module. We have not tested all
    sequencer configurations, but we believe the time for auto recovery
    will be between 29 seconds (20 station straight back) and 90
    seconds (80 station in-line). The other configurations that have
    been tested are 40 station straight back (50 seconds) and 60 station
    straight back (62 seconds).

  3. Question: Do I have to repair misinsertions through auto recovery?
    Answer: No. You can repair misinsertions manually also.

As noted earlier, the customer can choose the operate the machine in auto recovery mode or they can perform repairs in the traditional manner, they simply enter a 1 or 0 in the auto R set command.

  1. Question: If I have a older Radial machine, can I retrofit auto recovery
    onto it?
    Answer: Auto recovery will be available as a purchased retrofit for
    Radial IIIXQ machines only, and is available in the near future.

  • Question: Since auto recovery takes longer to repair a misinsertion than an
    operator does, why would I want to use it?
    Answer: Operators make mistakes and put polarized components
    (electrolytic capacitors, diodes, transistors, etc.) in the board
    backwards which causes test failures after wave solder. This
    causes the PCB line throughput to decrease along with possible
    component damage. Auto recovery will not put a component in
    backwards, and in combination with the Expanded Range Verifier
    (ERV) will verify the component before inserting it again.

    • The auto recovery function should be presented as a repair alternative. Not all customers will use auto recovery because of the time required, especially on larger machines, but the option is there for customers who believe from a manufacturing quality standpoint that misinsertions need to be repaired automatically. From a competitive standpoint, Panasonic through the use of its shuttle can perform auto recovery faster than the Radial 5 users can use auto recovery and still maintain greater throughput vs. Panasonic. When in competition with TDK, it is important to note that we give the customer a choice in terms of auto recovery (see competitive matrix). TDK does not offer auto recovery at all.

     

    Machine Speed Increase:

    Once again, as we introduce a new machine, we also have been able to increase the machine speed. The Radial II had a machine speed of up to 7,300 cycles per hour, the Radial III, 8,700 cycles per hour, the Radial IIIXQ, 9,000 cycles per hour, and now the Radial 5, with 9,200 cycles per hour. This slight speed increase was attained by some subtle changes to the machine and the manufacturing processes. The speed of 9,200 cycles per hour allows us to retain our position as the fastest Radial Inserter on the machine, (TDK’s VC7 with a speed of .39 sec/component–9,230 will not be introduced until the third quarter of 1994). By increasing our speed and maintaining our current pricing, we continue to position ourselves as the best price/performance Radial machine on the market. (Price/performance analysis using your customers data is available through the product teams.)

    New Machine Cover Package:

    When we looked at redesigning the machine cover package, we wanted to accomplish three things. We wanted a cover package with lines that appealed aesthetically, a consistent “look” with the VCD/Sequencer 3, and to aid the manufacturability of the machine.

    The new cover package features rounded edges and corners, along with an integrated pushbutton panel for a smoother, more modern look. The new VCD/Sequencer 3 and the Radial 5, now have the same cover package. This allows us to have a consistent look for our machines, especially when they are sitting side by side in a manufacturing line.

     

     
    Radial IIIXQ Enhancements

     

    I. – 70% fewer setup adjustments.
    – 56% fewer piece parts.
    – Larger component body diameters.
    – Increased reliability of component transfer from chain to chain
    to insertion head.
    – Clip locating at all component transfer points.

    Component Transfer Assembly:

    The component transfer assembly (CTA) on the Radial IIIXQ replaces the loader used on the Radial II and III machines. The CTA provides the same function as the loader did, namely moving components from the chain clip into the insertion head, but does so without the use of loader blades. The elimination of the loader blades and their associated setup and adjustment reduces the wearable tooling and the required adjustments in the loader area. (See Component Transfer Assembly (Drawing 1))
    Drawing here.

    Besides reduced setup and adjustment, the new CTA along with a redesigned guide jaw allows the Radial IIIXQ to insert components with 13mm body diameters and a height of 38.5mm as measured from center of tape feedhole to the top of the component. The new CTA also allows for rotation of 10 pin resistor networks by the insert head in 90 degree right, 0, or 90 degree left orientations, with the old loader there were rotational limitations.

    The Component Transfer Assembly also features clip locating similar to the clip locating found on the dispensing head. The clip locating combined with the smooth cam action (see drawing 2) of the CTA helps to ensure reliable component transfer from the carrier clip into the insert head.

    II. – 13mm Body Diameter Capability
    – Ability to run wider range of components.

    As mentioned earlier, there have been some changes to the insert head. The footprint of the insertion jaw was slightly elongated in the back to allow for 13mm body diameter capability. The 10.5mm insert head is still offered for those customers who have 10.5mm body diameter as their largest component, and required the smaller footprint for board density issues. For customers who only insert 5mm span components and require yet a smaller footprint, we still offer high density tooling, but the maximum body diameter is 9.0mm.

    Along with the modifications that were done to be able to run 13mm body diameter components, further modifications were done to the insertion jaw for all insertion heads to allow for more reliable insertion of a wider range of components. The area of the insertion jaw where the component leads are grasped has been polished at a 8 micro inch finish; any sharp corners/edges have been rounded. This, combined with the CTA transferring components into the head at a higher point allows us to run a wider range of components in terms of different standoffs on the bottom of the component and on the leads (such as box capacitors).

    III. – Superior clinch scrap lead removal.
    – Easier access to machine assemblies.

    Another area of the machine that has been enhanced is the clinch scrap lead removal system. This system clears lead scrap out of the cutter head. This new system features improved air flow through the cutter head due to an in-line vacuum transducer that is able to allow scrap material to pass through it. This allows for the transducer to be located closer to the clinch for superior air flow and scrap clearing characteristics.

    To further air in scrap removal, a hole has been added to the cutter head (see drawing 3). This hole allows for greater air flow through the clinch which aides in clearing scrap from the clinch.
    Drawing here.

    Along with the enhancements done to improve air flow through the cut and clinch, the scrap bowl was relocated to the back side of the cover door for easier access and the bowl was enlarged to allow for longer run times between bowl emptyings. With the scrap bowl mounted on the access panel door, a window was added (see drawing 4) so that the scrap level could be checked without removing any cover panels. Along with the scrap bowl being relocated, the cut and clinch valve pack was relocated; this was done to allow easier access to the clinch base.

    Drawing here.

    IV. – European Code Enhancements
    – Enhanced Tape Scrap Removal System
    – Enhanced Documentation

    The Radial IIIXQ also addresses the unique code issues of our European customers with a new “E” stop redundant interlock circuit on the inserter and sequencer covers. This new redundant interlock circuit features European code approved componentry including failsafe mechanical relays. A new light curtain cover package was also developed for European customers ordering non pass-thru machines. A new power disconnect lockout and main power circuit breaker was added to the machine (see drawing 4). Other enhancements were also done to the electronics of the machine that were not related to European code issues. Examples include new servo amplifier, new power supply, and the addition of a power conditioner.

    The tape scrap removal system and machine documentation were enhanced. The tape scrap removal system was designed with anti-static consideration in mind, such as different tubing material and a grounded scrap bin (see drawing 5). The machine documentation has added icons for clarification and has replaced some text with tables that are easier to use and understand (see attachment 1 and 2).

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    Radial Historical Matrix

    Feature

    6346A/6348A

    Radial II

    6360A

    Radial III

    6360B

    Radial IIIXQ

    Benefit
    Machine Speed

    .5 Sec/Ins**

    (7,200/Hour)

    .41 Sec/Ins

    (8,700/Hour)

    .40 Sec/Ins

    (9,000/Hour)

    		 Higher throughput.
    Chain Clip Locating

    No*

    Yes

    Yes

    		 Reliability
    Soft Touch Pusher

    (STP)

    No*

    No

    No

    		 Higher throughput reliability.
    100 Station Sequencer

    No

    No

    No

    		 More components/input.
    Component Transfer Loader Blades

    Loader Blades

    Loader Blades

    Component Transfer

    		 Increased uptime/reduced wear tooling, fewer adjustments.
    Auto Recovery

    No

    No

    No*

    		 Higher PCB quality.
    Clinch Scrap Lead Enhancement

    No*

    No*

    Yes

    		 Increased uptime.
    Odd Form Capability

    Limited

    Yes

    Yes

    		 Increased component insertion capabilities.
    In-Line Sequencer Available

    No

    Yes

    Yes

    		 Manufacturing floor space.
    Single Pivot Clinch

    No*

    Yes

    Yes

    		 Increased uptime/longer tooling life, fewer adjustments.
    13mm Body Diameter Component Capability

    No

    No

    Yes

    		 Increased component insertion capabilities.
    Audible Low Part Warning

    Yes

    No

    Yes

    		 Audible as well as visual notification to operator.
    Tech Advisor

    (Available Std or Purchase)

    No

    No

    Yes*

    		 Provides on-line maintenance documentation and step-by-step troubleshooting procedures.
    CE Mark European Code

    No

    No

    No

    		 Compliant with European community safety standards.

     

     

     

     

     

    Feature

    6360C

    Radial 5

    6360D

    Radial 5

    6360E

    Radial 5

    6380A

    Radial 8

    Benefit
    Machine Speed .39 Sec/Ins (9,200/Hour) .39 Sec/Ins (9,200/Hour) .327 Sec/Ins (11,000/Hour) 0..22 Sec/Ins (16,0000/Hour) Higher throughput.
    Triple Span Radial

    No

    No

    Yes

    Yes

    		 Can insert either 2.5/5.0/7.5 mm span components, or 5.0/74.5/10.0 mm span components.
    Main Drive System Pneumatic Pneumatic Pneumatic DC Brushless Servo Significant reliability increase.  Lower noise level and higher machine uptime.
    Machine Controller

    DEC J11

    DEC J11

    DEC J11

    VME 68000

    		 Higher speed, higher resolution capable of running more machine features than the DEC J11.  Modern architecture supporting future developments.
    Man/Machine Interface

    UICS

    UICS

    UICS

    IM-UPS (Like GSM) USOS

    		 Windows, powerful color interface with CRT, keyboard, trackball, consistent with GSM products.
    Management Data Non-user friendly binary format Non-user friendly binary format Non-user friendly binary format Easily accessible management data Displays management data in graph form at the click of a button.
    Diagnostics Non-user friendly binary format Non-user friendly binary format Non-user friendly binary format Menu Driven Powerful IM diagnostics allow for easy troubleshooting and machine feedback.
    On Line Documentation

    No

    No

    No

    Yes

    		 Supports quick on-line retrieval of machine operating and maintenance information.
    Chain Clip Locating

    Yes

    Yes

    Yes

    Yes

    		 Reliability
    Soft Touch Pusher (STP)

    Yes

    Yes

    Yes

    Yes

    		 Higher throughput reliability.

    Feature

    6360C

    Radial 5

    6360D

    Radial 5

    6360E

    Radial 5

    6380A

    Radial 8

    Benefit
    100 Station Sequencer

    Yes

    Yes

    Yes

    Yes

    		 More components/input.
    Component Transfer Loader Blades Component Transfer Component Transfer Component Transfer Component Transfer Increased uptime/reduced wear tooling, fewer adjustments.
    Auto Recovery

    Yes

    Yes

    Yes

    Yes

    		 Higher PCB quality.
    Clinch Scrap Lead Enhancement

    Yes

    Yes

    Yes

    Yes

    		 Increased uptime.
    Odd Form Capability

    Yes

    Yes

    Yes

    Yes

    		 Increased component insertion capabilities.
    In-Line or Straight back  Sequencer Available

    Yes

    Yes

    Yes

    Yes

    		 Manufacturing floor space.
    Single Pivot Clinch

    Yes

    Yes

    Yes

    Yes

    		 Increased uptime/longer tooling life, fewer adjustments.
    13mm Body Diameter Component Capability

    Yes

    Yes

    Yes

    Yes

    		 Increased component insertion capabilities.
    Audible Low Part Warning

    Yes

    Yes

    Yes

    Yes

    		 Audible as well as visual notification to operator.
    Uninterruptable Power Supply Optional Optional Optional Standard Allow for proper machine shut down and uninterrupted operation in power unstable environments.
    Tech Advisor

    (Available Std or Purchase)

    Yes*

    Yes, standard.

    Yes, standard.

    No

    		 Provides on-line maintenance documentation and step-by-step troubleshooting procedures.
    Product Trainer

    No

    No

    No

    Operation Module Standard

    		 CD Rom Software that provides on-line training for basic machine operation.
    CE Mark European Code

    No

    Yes***

    Yes***

    Yes, In BHS Only

    (6388A)

    		 Compliant with European community safety standards.
    Sound level for a BHS package

    NA

    NA

    78 dba

    75 dba

    		 Quieter operation!
    4 Tier Light

    No

    Yes*

    Yes

    Yes

    		 Improved machine status information for more efficient machine operation.
    CD-ROM for software loading

    No

    No

    No

    Standard

    		 Allows for fast loading of software updates and on-line documentation.

     

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    Comparative Matrix – Radial 8 vs RHSII & RH5

    Feature Webseite

    Universal

    6380A/6388A/6389A

    Panasonic

    RHS2

    Panasonic

    RH 5

    Insertion Rate

    		 16,000 CPH 18,000 CPH 12,400 CPH
    Tact Time 0.225 sec Constant Speed 0.2 sec Maximum (0.25 sec for the component with 12mm diameter and 18mm height or bigger) 0.29 sec Maximum   (Speed slows depending on component type.)

    4 Axis Insertion

    		 Yes, by rotating insertion head and/or table.  Head rotates in three directions; -90, 0, and +90 degrees. Yes, the insertion head can rotate in four directions: 0,     -90, +90, and 180 degrees. Yes, but optional.

    (Standard Only) 0, 90 Degrees by Head

    Rotary Table

    		 Yes, 90 and 180 Degree Increments No – Head Rotates 3600 No

    Insertion Span

    		 2.5/5.0mm Dual Span

    2.5/5.0/7.5 or 5.0/7.5/10.0 Triple Span

    		 2.5/5.0mm 2.5/5.0mm
    Maximum Body Diameter/Height (Height measured from center of feedhole to top of component.) 13.0mm/38.5mm 13mm/39mm 13mm/39mm
    Board Handling Transfer Time (from the last insertion of the first PCB to the first insertion of the second PCB, including table movement) 3.5 seconds 4 to 5 seconds 5 to 6.5 seconds (NM 8245 A,B,C)

    4 to 5.5 seconds (NM 8244 A,B,C)
    Maximum Board Size 559 x 470mm (NPT)

    483 x 406mm (PT)

    		 508mm x 381mm 508mm x 381mm (NM 8245 A,B,C) 330mm x 250mm (NM 8244 A,B,C)
    Insertion Area 470 x 470mm (NPT)

    470 x 406mm (PT)

    		 508mm x 371mm 508mm x 371mm (NM 8245 A,B,C) 330mm x 240mm (NM 8244 A,B,C)
    Allowable PCB Thickness 0.79mm to 2.36mm 1.6 +/- 0.15mm standard

    The RHS can accommodate a range of 0.8 to 2.0mm, however the PCB transfer rails must be changed for PCBs with nonstandard thickness.

    This is an option.   Even when using the standard 1.6mm thick PCB, there are chances of lead length/angle variation which causes PCB transfer error depending on the shapes of boards and/or insertion holes.

    		 1.6 +/- 0.15mm standard

    The RH5 can accommodate a range of 0.8 to 2.0mm, however the PCB transfer rails must be changed for PCBs with nonstandard thickness.

    This is an option.   Even when using the standard 1.6mm thick PCB, there are chances of lead length/angle variation which causes PCB transfer error depending on the shapes of boards and/or insertion holes.
    PCB Warpage Maximum of 3.17mm downward and 1.6mm upward Maximum of 1.2mm downward and 0.5mm upward Maximum of 1.2mm downward and 0.5mm upward

    Part Transfer Method

    		 Sequencer Sequencer Shuttle
    Number of Input Stations 20, 40, 60, 80, 100 80 40, 62 (Single Shuttle)

    80 (Dual Shuttle)

    Component Supply

    		 Reels or ammo packs on any input. Reels or ammo packs.  Reels can only be used on the lower input bank (40 station). Reels or ammo packs.  Reels can only be used on the lower input bank
    Component Taping Pitch 12.7/15/25.4**/30mm** 12.7/15.0mm 12.7/15.0mm
    Odd Form Component Insertion Yes, at a constant rate of speed Yes, but at a derated insertion speed, dependent on component shape/size. Yes, but at a derated insertion speed,  dependent on component shape/size.

    Verification

    		 Yes, value polarity. No No
    Board Error Correction Yes, Standard Yes Yes
    Low Part Warning Yes, Standard No No
    Insertion Density Tooling effects footprint. Tooling effects footprint. 0.5mm on all sides–use of guide pins allows for same insertion density capabilities regardless of component
    Auto Recovery Yes – Semi-Automatic Yes – Interrupt Recovery Enabled (Automatic supply recovery function) Yes – Fully Automatic
    Component Replenishment Any disp.head location can be spliced w/o stopping the machine. Although this is a sequencer based machine, when a feeder is low on components, that feeder and the two adjacent feeders must be turned off before reloading or splicing additional components.  If during the reloading process the machine requires components from those three feeders, the machine stops until the reloading process is completed by the operator. Machine needs to be stopped for component replenishment.
    Uninterrupted Power Supply Standard.  When the UPS detects a power interruption, its fully-charged battery can run the machine for up to 10 minutes. No No

    Language

    		 English is the main language, however Chinese is available for event messages. Japanese/English Japanese/English
    Machine Dimensions 80 Stations (In-line):

    W = 5428mm

    D = 3226mm

    H = 1746mm

     

    80 Stations (Straight Back):

    W = 1800mm

    D = 6397mm

    H = 1746mm

    		 80 Stations:

    W = 3125mm

    D = 2210mm

    H = 1560mm

    		 NM-8244C (80 Sta):

    W = 5160mm

    D = 1860mm

    H = 1650mm

     

    NM-8245C (80 Sta):

    W = 5160mm

    D = 2110mm

    H= 1600mm

     
    Marketing Evaluation 2 years with more than 200 installed machines worldwide, good public praise Brand new machine without marketing evaluation New machine with few marketing evaluation

     

     

    ** Capable of processing 25.4 mm and 30 mm pitch taped components.

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    Comparative Matrix of Universal Radial 8 & the Panasonic RHS and RH III

    Feature

    Universal

    6380A6389A

    Panasonic

    RHS

    Panasonic

    RH III

    Insertion Rate

    		 16,000/Hour Constant Speed 14,400 Maximum  10,000 Maximum   (Speed slows depending on component type.)

    4 Axis Insertion

    		 Yes, by rotating insertion head and/or table.  Head rotates in three directions; -90, 0, and +90 degrees. Yes, the insertion head can rotate in four directions; 0, -90, +90, and 180 degrees. Yes, but optional.(Standard Only)

    0, 90 Degrees by Head

    Rotary Table

    		 Yes, 90 and 180 Degree Increments No – Head Rotates 3600 No

    Insertion Span

    		 2.5/5.0mm Dual Span2.5/5.0/7.5 or 5.0/7.5/10.0 Triple Span 2.5/5.0mm 2.5/5.0mm
    Maximum Body Diameter/Height (Height from center of feedhole to top of component.) 13.0mm/38.5mm 13mm/38mm 13mm/38mm
    Board Handling Transfer Time 3.5 seconds with BHS. “About 3 seconds” Approximately 4.5 to 6 seconds.

    Maximum Board Size

    		 457 x 508mm (NPT)406 x 457mm (PT) 381mm x 508mm 508mm x 381mm (NM 8225 A,B,C) 330mm x 250mm (NM 8224 A,B,C)

    Part Transfer Method

    		 Sequencer Sequencer Shuttle

    Number of Input Stations

    		 20, 40, 60, 80, 100 80 40, 62 (Single Shuttle)80 (Dual Shuttle)

    Component Taping Pitch

    		 12.7/15/25.4**/30mm** 12.7/15.0mm 12.7/15.0mm
    Odd Form Component Insertion Yes, at a constant rate of speed Yes, but at a derated insertion speed, dependent on component shape/size. Yes, but at a derated insertion speed,  dependent on component shape/size.

    Verification

    		 Yes, value polarity. No No

    Board Error Correction

    		 Yes, Standard Yes Yes

    Low Part Warning

    		 Yes, Standard No No

    Insertion Density

    		 Tooling effects footprint .5mm on all sides–use of guide pins allows for same insertion density capabilities regardless of component

    Auto Recovery

    		 Yes – Semi-Automatic Yes – Interrupt Recovery Enabled (Automatic supply recovery function) Yes – Fully Automatic

    Component Replenishment

    		 Any disp. Head location can be spliced w/o stopping the machine.

    Uninterrupted Power Supply

    		 Standard.  When the UPS detects a power interruption, it’s fully –charged battery can run the machine for up to 10 minutes. No No

    Language

    		 English is the main language, however Chinese is available for event messages Japanese/Chinese Japanese/Chinese

    Optical Safety Device

    		 Yes, Optional Yes Yes
    Machine Dimensions 20 Input Stations:W = 80 Inches (2032mm)

    D = 115 Inches (2921mm)

    H = 66 Inches (1676mm)

     

    100 Input Stations:

    W = 253 Inches (6426mm)

    D = 115 Inches (2921mm)

    H = 66 Inches (1676mm)

    		 80 Input Stations:W =Inches (3125mm)

    D = Inches (2210mm)

    H = Inches (1560mm)

    		 40 Input Stations:W = 151.97 Inches (3860mm)

    D = 62.6 Inches (1590mm)

    H = 63 Inches (1600mm)

     

    62 Input Stations:

    W = 168.5 Inches (4280mm)

    D = 65.74 Inches (1670mm)

     

    80 Input Stations:

    W = 203.1 (5160mm)

    D = 83.0 (2110mm)

     

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    Panasonic Auto Recovery vs. Universal’s Auto Recovery

    Jpmedzone.com

     

    Fact Both the UIC Radial 8 and Panasonic RH III and RHS feature auto recovery capability; the TDK VC7C does not.  The TDK VC-21S does have auto recovery, but its full capability is still unknown.
       
    Fact The Panasonic RH III auto recovery is faster than the Radial 8 auto recovery because the RH III is a shuttle based machine with random access capability, while the Radial 8 has pre-sequenced components that must be left on the sequencer chain.

     

    The Panasonic RHS is a sequencer.  However, the sequencer moves in either direction and more quickly when auto recovery is invoked.  The RHS auto recovery is possible in 8 –10 seconds for an 80 station machine.
       
    Fact The UIC Radial 8 with a machine speed of 16,000 CPH is 9% faster than an RHS with a machine speed of 14,400 CPH.
       
    Fact The Radial 8 and RHS both offer reliable insertions and low PPM levels.
       
    Fact The Radial 8 offers 3 modes of Auto Recovery:

    ¨      Auto Recovery Disabled

    ¨      Active Auto Recovery: Upon a misinsertion, the chain will cycle for a new component, stop at the head, and wait for the operator to clear the board and push Repair.

    ¨      Passive Auto Recovery: Upon a misinsertion, the machine will stop, wait for the operator to clear the board and push Repair before cycling the chain to retrieve a new component.
       
    Conclusion Universal Radial 8's Auto recovery is not advantageous on a Manual Load machine.  However, in an Automatic Board Handling environment, Universal’s 3 modes of Auto Recovery provide the flexibility that manufacturers need to maintain their production flow and level of quality.

     

     

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    TDK Radials

     

     

    TDK is a Japanese manufacturer and supplier of both radial components and Radial insertion equipment.  Unlike other Japanese companies, TDK is not vertically integrated in that they do not produce end products.  In the past, they did not have dedicated Axial or DIP insertion equipment; this served as a deterrent to customers desiring to buy all their insertion mount equipment from a single source.  In 1995, TDK addressed this issue by teaming up with ex-Dynapert personnel to design an Axial component inserter.  This agreement produced the AC7 in 1996, followed by the ACS-2 Axial Sequencer.

     

    Similarly, TDK's Radial Inserter's are not manufactured by TDK.  Instead, they are manufactured by Okuma, Japan, which also produces other TDK products.

     

    Machine Design:

     

    The VC7B, VC7C, and now VC-21S machine designs incorporate a sequencer chain that delivers sequenced components to the insertion http://www.buydiazepamcheaponline.org area, much the same as UIC's Radial.  The main advantage associated with a sequencer design over a shuttle design (such as Panasonic) is greater throughput speed.  The component location does not effect throughput speed, and allows for replenishment of depleted components without interrupting production.

     

    VC-21S

    In late 1999 TKD introduced the VC-21S, a Radial inserter with a maximum speed of 15,000 cph.  Available either as a 2.5/5.0 mm or 5.0/7.5 mm lead span machine, The VC-21S is equipped with an Auto Recovery feature.  Additionally, the VC-21S operated with Windows NT.  It is available in 40, 80, or 120 stations.

     

    Although the VC-21S has been advertised, no further information is available at this time.

     

     

    VC7B & VC7C

     

    Horizontal Transfer

    There is one fundamental difference between the Radial 8 sequencer design and TDK's design.  The VC7A/B/C series transfers the components by grasping the cardboard carrier tape of the component and carrying it horizontally. During the component transfer from the chain clip to the insertion head, the component is rotated 90 degrees to a vertical position and the cardboard tape is cut from the component.  The component is then ready for insertion into the PCB, but must be transferred one more time to the insertion head.

     

    Advantages

    When equipped with certain optional features, various processes can be exercised on the component while it is being transferred on the sequencer chain. Components may be electrically verified for capacitance, resistance, and inductance.  Minor bends in the leads may be corrected (straightened) by a reforming unit (standard on the VC7B).  Components may be rotated using the four position component rotator for insertion of polarized components but not for moje-lekarna insertion tooling density clearance issues. However TDK's process requires an increased number of component transfers. TDK does not offer a rotary table, which is one reason why they offer the component rotator.

     

    Disadvantages:

    1)      Horizontal component transfer increases the frequency a component is handled, increasing the possibility of mishandling and mis-insertions. In contrast, the Radial 8 carries the component to the insertion area vertically by the component leads, reducing the “handling” to a single step once the component is placed in the carrier clip.

    2)      The VC7A/B/C series machine must slow down and therefore reduce productivity for certain component types depending on type and size.

    3)      The VC7A/B does not offer an auto recovery capability, while the Radial 8 features auto recovery as a standard feature.

    4)      Like the Radial 8, TDK can employ a soft touch pusher motion when inserting delicate components (stamped leaded parts, for example).  However, unlike the Radial 8, this programmable feature slows down the machine.  UIC's soft touch pusher design is utilized for all insertions and does not effect cycle speed, but rather enhances insertion reliability for all components being inserted.

     

     

    Until the release of the VC-21S in late 1999, The VC7C was TDK's current Radial offering, a 2.5/5.0 mm lead span machine designed to insert traditional Radial components and radially taped “odd form” type components such as tact switches, potentiometers, and fuse clips.  The VC7C can insert components with a maximum body diameter of up to 11mm and is available in three sequencer sizes; 40, 80, and 120 feeder stations.

     

    Options available on TDK's Radial machines include the four direction reverse unit, reforming (lead straightening) unit (standard on the VC7B), parts checker (verifier), component supply warning (low parts sense) unit, optical correction device (BEC), and board handling (which may include automate PCB width adjuster).

     

    Axial Equipment

    TDK offers also offers limited Axial insertion equipment.  The AC7 single head inserter with a 16,360/hour cycle rate.  They also offer a ACS-2 Axial component sequencer with up to 180 stations.  TDK's product line also includes a full line of SMC products.

     

    Distribution & Pricing Strategies

    TDK's presence is global and they maintain a large installed base.  Their pricing strategy is both geographic and situation specific.  TDK's prices tend to be lower and their allowable discounts tend to be higher in Asia and with multi-national accounts, than in other parts of the world.

     

    We have seen aggressive discounting by TDK to acquire or in an attempt to retain key accounts in North America.  When board handling is required, the Radial 8 with board handling allows UIC to be very price competitive with similarly configured VC7B/C.  The price should be weighed against other factors such as features, capabilities and on a price/performance basis.  While TDK's machine is generally perceived as a reliable machine, when a hard failure does occur is has been difficult and time consuming to return the machine to production status.  Also, there have been reports (especially in North America) of poor field service and replacement parts availability.

     

    By News and Events 0 Comments

    Panasonic Radials

    About Panasonic

    Panasonic is a division of Matsushita (Japan), one of the largest companies in the world.  They are highly vertically integrated in that they manufacture Radial componentry, Radial insertion equipment and end products with PCB's populated with Radial components (consumer electronics, for example).  This structure affords them some advantages and disadvantages.  The advantages include:

     

    1)                              first hand experience using equipment,

    2)                              in-house production testing prior to release of new equipment designs,

    3)                              ability to sell components and equipment,

    4)                              keen understanding of market trends, new componentry and design considerations from both componentry and end product perspectives.

     

    One glaring disadvantage is that many times their customers are also their competitors–this sometimes causes conflict of interest.

     

    Machine Design:

     

    RHS

    The RHS was introduced in late 1998.  It operates at a maximum speed of 14,400, and is different from previous Panasonic Radials in 2 main areas:

    ¨      it uses a sequencer design

    ¨      it no longer uses guide pins

     

    Advantages

    The sequencer and insertion head designs that Panasonic adopted carry many of the same advantages as the Radial 8.  The additional advantages are:

    1)      Auto Recovery is still fast (8 – 10 seconds), even though the RHS uses a sequencer.  The sequencer chain is bi-directional, and increases speed when only travelling with a component.

    2)      30% smaller footprint.  Even with a sequencer, the RHS footprint is smaller than the Radial 8.

    3)      1800 head rotation, although this feature slows down the machine.

     

    Disadvantages

    The main disadvantage for Panasonic is that they have no prior experience with this design.  The RHS, consequentially, has gotten off to a bumpy start.  However, we anticipate the experience gap to close quickly.

    RH II & RH III

    Shuttle Design

    The RH II and RH III utilize a component shuttle system to bring the components to the insertion area.

    Advantages

    The advantage of a shuttle system is that “automatic recovery” (repair) can take place quickly.  Once a misinsertion is detected, a replacement component is automatically dispensed and inserted into the original location.  Manufacturers desire this feature as it leads to less operator interface and it ensures that the correct component is reinserted in the correct position and polarity.  This recovery mode is selectable and may be programmed to attempt up to ten (10) “auto recoveries” before the machine stops.  This feature reduces operator interaction and ensures the correct component is inserted.

    Disadvantages

    The shuttle design has two negative impacts on the inserters throughput capability:

    1)                              Depleted components cannot be replenished “on the fly”, because the entire shuttle system (all reels/packs) moves to deliver a component to the insertion area.  The inserter must be stopped to replenish reels/ammo packs.  To improve this situation the RH III utilizes a split shuttle (2x 40 inputs = 80 total). While this improves this flaw, it does not eliminate it. Components must be double-loaded to take advantage of this feature and maintain production.

    2)                              The specific component location on the shuttle effects throughput.  Shuttle travel time must be added for each insertion cycle.  Reels located at the end of the shuttle system (furthest from the head) will have a longer insertion cycle.  This also requires increased machine programming in order to optimize the component location, and maintain throughput at an acceptable level.

     

    Guide Pin System

    The RHII and RHIII use guide pins instead of an insertion head.  The pins come up from the clinch through the holes in the PCB guide the component leads into the PCB while the component is pushed from the top.

    Advantages

    The guide pin system provides excellent topside insertion density capability.  However, the cut and clinch, which determines their bottom side density, has a footprint similar in size to that of the Radial 8.

     

    By comparison, the Radial 8 utilizes insertion tooling to guide the component leads into the hole.  The footprint associated with the Radial 8's insertion head tooling limits the overall topside insertion density capabilities in comparison to Panasonic's guide pin design.  Panasonic's guide pins allow for a component to be inserted with only .5mm clearance on all four sides.

     

    Disadvantages

    The guide pins are delicate and have a tendency to wear and break.  They are only (.040″) 1mm in diameter and approximately 6″ long (152mm).  Operators typically carry “spare” pins in their pocket.

     

    Panasonic Machine types

    Panasonic, like Universal, has a number of machine styles.  The RH, RH6, RHB, RH6B, RH II and RH III insert 5mm components with two or three leads and are capable of 2.5mm insertion (2 leads) as an option.  These older models differ in the number of input locations and the size of the components they can insert.  The RH II features 80 input locations on a split shuttle (40 + 40), with a cycle speed of 7,800 CPH (maximum on certain components) vs. 6,000 CPH on other older Panasonic Radial Inserters. The RH III is similar to the RH II, but it is available as a 40, 62, and 80 station machine configurations. The RHUP and the RHU are Panasonic's large component insertion machines that feature body diameter capability of up to 18mm and 7.5mm lead pitch.  The RHU “special”, features a body diameter capability of 20mm and up to 10mm lead pitch.  These machines are very slow and expensive.

     

    The main advantages of the RH III over the RH II is its price, speed, and automatic recovery features.  It also appears to be priced well below their previous machine models, with pricing estimated at 226K-270K (US$) and a maximum speed of 10,000 cycles per hour.  The RH III's only “real” performance advantage when compared to the Radial 8 is in terms of its insertion density as discussed earlier in its use of guide pins.  However, this can be offset by the Radial 8's throughput and reliability.

     

    Panasonic offers a complete product line in both IMC and SMC technologies.  All Panasonic inserters (RH II, RH III and AVK) use a shuttle design to deliver components to the point of insertion.

     

    Two (2) Axial Inserters; Models AVK and AVK

    A Jumper Wire Inserter; Model JVK

    Odd Form Inserter; Model U2 (which also inserts DIP components), Square Pin Inserter, Model P, Round Pin Inserter, Model G, Eyelet Inserter, Model E

     

    All are designed with board handling capability.

     

    Although Panasonic's presence is global, their main thrust in IMC has been in Japanese and Korean multi-national companies.  They have a large installed base and as a manufacturer of electronics end products, they utilize much of their equipment in their own plants and influence their many sub contractors to utilize Panasonic equipment as well.

     

    Panasonic's pricing strategy varies depending upon the geographic location account and the specific situation.  In the United lisez plus ici States, for example, in comparison to the Radial 8, Panasonic's RH product line is much higher in price (although they typically discount between 10 and 15%).  In Southeast Asia, however, their prices are much lower and in some cases their prices have been considerably less than UIC's (up to 30-40% below UIC list price).

     

     

    By Article • • • 0 Comments

    Radial 8 Competitive Matrix – Universal vs. TDK

    Comparative Matrix of Universal Radial 8 & TDK

     

    Feature

    Universal

    6380A/6388A

    TDK

    VC-21S

    TDK

    VC7C

    TDK

    VC7B
    Maximum Board Size 457 x 508mm (NPT), 406 x 457mm (PT) 400mm x 300mm (508mm x 381mm – Optional) 400mm x 300mm 400mm x 300mm
    Insertion Span 2.5/5.0mm 2.5/5.0 or 5.0/7.5 mm 2.5/5.0mm 2.5/5.0mm
    Cycle Rate 16,600 cph (0.22 sec./insert.)Constant Speed 15,000 cph (0.24 sec/insert), for X -Y movements under 30 mm (1.20”) 12,400 cph Maximum (Speed is dependent on component type.) 10,500/7,200/6,000 cph (Speed is dependent on component type.)
    Rotary Table Yes, 90 and 180 degree increments. No information No No
    Part Transfer Method Sequencer Sequencer Sequencer Sequencer
    4 Axis Insertion Yes, by rotating insertion head and/or table. Head rotates in three directions; -90, 0, and +90 degrees. Orientation: 0, +-90, 180 Head only rotates 0+90 (std).  Part is rotated for polarity at station prior to insertion head.  This is possible only with optional 4 direction reverse unit. Head only rotates 0+90 (std).  Part is rotated for polarity at station prior to insertion head.  This is possible only with optional 4 direction reverse unit.
    Number of Input Stations 20, 40, 60, 80, 100 40,80,120 40, 80, 120 40, 80, 120
    Operating system OS/2, IM-UPS Windows NT
    Languages English, Event messages available in: Chinese, Spanish, Polish,  French English, Japanese
    Verification Yes, value, polarity. No information Yes, optional. Yes, optional.
    Board Error Correction Yes, standard. No information Yes, optional. Yes, optional.
    Low Part Warning Yes, standard. No information Yes, optional. Yes, optional.
    Optical Safety Device Yes, optional. No information Yes, optional. Yes, optional.
    Maximum Body Diameter/Height (Height measured from center of feedhole to top of component.) 13.0mm/38.5mm 13.0mm / 26.0 mm 10.0mm/32.25mm 10.0mm/32.25mm
    Odd Form Comp Insertion – Stamp leaded parts including; potentiometers, tact switches, fuse clips, connectors. Yes, standard. No information Yes, but at a derated insertion speed which is dependent on component shape and size. Yes, but at a derated insertion speed which is dependent on component shape and size.

     

     

    Comparative Matrix of Universal Radial 8 & TDK (Continued) 

    Feature

    Universal

    6380A/6388A

    TDK

    VC-21S

    TDK

    VC7C

    TDK

    VC7B
    SIPs Yes, up to 10 pin. No information Yes, up to 9 pin.
    Lead Diameter Range .3mm – .7mm No information .4mm – .65mm
    Insertion Density Tooling effects footprint.* No information Tooling effects footprint.*
    Component Taping Pitch 12.7/15/25.4**/30mm** No information 12.7/15.0mm
    Auto Recovery Yes Yes No
    Board Handling Transfer Time 3.5 seconds on BHS equipped inserters. Approx. 2.5 sec. Approximately 4 seconds.
    Machine Dimensions 20 Input Stations:W = 2,032mm (80”)

    D = 292 mm (115”)

    H = 1,676mm (66”)

     

    100 Input Stations:

    W = 6,426 mm (253”)

    D = 292 mm (115”)

    H = 1,676mm (66”)

     

    		 40 Input Stations:L = 2,120 mm (83.5”)

    W = 1,980 mm (80”)

    H = 1,850 mm (73”)

     

    80 Input Stations:

    L = 3,580 mm(141”)

    W = 1,980 mm (80”)

     

    120 Input Stations:

    L = 5,100 mm (201”)

    W = 1,980 mm (80”)

     

    		 40 Input Stations:W = 5,870mm (231”) (Front)

    W = 2,890mm (114”) (Seq)

    D = 2,210 mm (87”)

    H = 1,390 mm (54.7”)

     

    80 Input Stations:

    W = 4,160 mm (164”)

    D = 2,210 mm (87”)

     

    120 Input Stations:

    W = 5,870mm (231”) (Front)

    W = 5,430mm (214”) (Seq)

    D = 2,210 mm (87”)

     

    By Article 0 Comments

    Competitive Checklist – RH II vs. Radial 5

    RH II

     

     

    Radial 5

     

     

     

     

     

     

    62 Input, Single Shuttle

    X

    20-100 Input Sequencer

    Top Speed – 8,000 CPH

    X

    Machine Speed – 11,000 CPH; 37% Faster than Panasonic

    Automatic Recovery

    Automatic Recovery

    No electronic support system.

    X

    Electronic support system (Tech Advisor – Bi-Lingual).

    X

    Pin Method – High density insertion.  (Sell Around:  Pin method is complex and expensive, pins break.  See sell around section.)

    Guide Jaw – Provides positive control of the component leads; non-fragile.

    Small Machine Footprint

    Footprint is relative to cost/insertion.  UIC offers superior cost per insertion and two machine shapes.

    Machine speed can vary based on component type; 4,000, 6,000, 8,000 CPH.

    X

    Constant machine speed for all insertable components; 11,000 CPH.

    No parts checker.

    X

    Parts Checker (ERV)

    Optical Correction Unit

    Optical Correction Unit
    By Article 0 Comments

    Competitive Checklist – VC7A or B vs. Radial 5

    VC7

     

     

    Radial 5

     

     

     

     

     

     

    25% faster than VC5.

    X

    Radial 5 is 19% faster than the VC7A or B.

    X

    Smaller machine footprint than the Radial 5.  (Sell Around:  Production capability per square foot.)

    The VC7A or B is only 4 square meters smaller; comparisons should be speed based.

    Four direction reversing unit.

    X

    The VC7A or B’s four direction unit slows the machine down.

    No electronic support system.

    X

    Electronic support system (Tech Advisor – Bi-Lingual).

    X

    Lead Reforming Unit (Sell Around:  Questionable performance.)

    No lead reforming unit.

    X

    Square Pin Inserter (Sell Around:  Significantly decreases throughput.)

    No square pin inserter.

    Optical Correction Unit

    Optical Correction Unit (BEC)

    Parts Checker

    Parts Checker (ERV)

    Bad Board Sensor

    Bad Board Sensor

    Three Lead Sensing Clinch (See sell around section.)

    X

    Only two lead sensing needed.

    Machine speed can vary based on components.

    X

    Two component transfer points.

    X

    120 station sequencer capability (40, 89, 120).

    100 station sequencer capability (20, 40, 60, 80. 100).

    10mm maximum body diameter.

    X

    13mm maximum body diameter.

    No auto recovery capability.

    X

    Auto recovery capability.
    By News and Events • • 0 Comments

    Radial 8 N-Clinch tooling

     

     

     

    Radial 8 N-Clinch tooling for machines that have the following Product Trees:

     

    Dual Span

    Triple Span (2.5/5.0/7.5)

    Triple Span (5.0/7.5/10.0)

    47040006

    90055555

    90055556

    47040007
    NA

    NA

    47040008

    90055838

    90055848

     

    To determine the machine’s Product Tree, refer to the silver tag on the right side of the machine, near the red power switch.

     

    The new N-clinch tooling has been redesigned to increase its strength and wear resistance. This new tooling is easily identified by its black color as opposed to the gold color of the current tooling.

     

    According to our records you have purchased at least one Radial 8 which can benefit from this new tooling.  We are informing you of this so that you may consider changing over to this new tooling to take advantage of the enhancements if you have not already done so.  We are also informing you that we will cease to offer the current gold color tooling by October 2000.

     

    The new black tooling pieces are not interchangeable with the previous gold tooling.  The clinch tooling must be changed as a full set, using one of the retrofit kits in the table below.  Replacement parts ordered after the retrofit kit is installed may be ordered individually. The parts we have changed only affect the normal wear tooling pieces that you normally change during preventive maintenance cycles.  We recommend that you allow your current gold color tooling to reach the end of its life and then replace it with the enhanced kit.

     

    Please refer to the table below to order the proper part numbers.

     

    Clinch tooling retrofit kits

     

    Radial 8 Dual Span

    CLINCH STYLE

    RETROFIT KIT P/N

    DESCRIPTION

    NEW P/N

    QTY

    90L Offset Higher Pivot

    (46666601)

    48678201

    Anvil, Exterior

    43902303

    2

    Anvil, Interior

    43902103

    1

    Cut/Form, Exterior

    43902204

    2

    Cut/Form, Interior

    43902006

    1

    90S Offset Higher Pivot

    (47803401)

    48678202

    Anvil, Exterior

    47803302

    2

    Anvil, Interior

    47803102

    1

    Cut/Form, Exterior

    47803202

    2

    Cut/Form, Interior

    47803002

    1

     

    Radial 8 Triple Span

    CLINCH STYLE

    RETROFIT KIT P/N

    DESCRIPTION

    NEW P/N

    QTY

    2.5/5/7.5 90 SLL RSP (90055732)

    48678203

    Anvil, Exterior

    47803302

    2

    Anvil, Interior

    47803102

    1

    Cut/Form, Exterior

    47803202

    2

    Cut/Form, Interior

    47803002

    1

    Anvil, Exterior 7.5

    90055841

    1

    Cut/Form Exterior 7.5

    90055840

    1

    5/7.5/10 90 SLL RSP (90055752)

    48678204

    Anvil, Exterior

    47803302

    2

    Anvil, Interior

    47803102

    1

    Cut/Form, Exterior

    47803202

    2

    Cut/Form, Interior

    47803002

    1

    Anvil, Exterior 7.5

    90055841

    2

    Cut/Form Exterior 7.5

    90055840

    2

     

    2.5/5/7.5 90 LLL RSP (90055729 or 90055743)

    48678207

    Anvil, Exterior

    90055863

    2

    Anvil, Interior

    90055864

    1

    Cut/Form, Exterior

    90055865

    2

    Onde consegue comprar 10 mg Levitra Genérico online

    Cut/Form, Interior

    90055866

    1

    Anvil, Exterior 7.5

    90055839

    1

    Cut/Form Exterior 7.5

    90055819

    1

    5/7.5/10 90 LLL RSP (90055436 or 90055750)

    48678208

    Anvil, Exterior

    90055863

    2

    Anvil, Interior

    90055864

    1

    Cut/Form, Exterior

    90055865

    2

    Cut/Form, Interior

    90055866

    1

    Anvil, Exterior 7.5

    90055839

    2

    Cut/Form Exterior 7.5

    90055819

    2

     

     

     

    New High Pivot N-Clinch

    If you own a Radial 8 with a Product Tree number other than those listed above, or any of our Radial 5 machines, you may also take advantage of this new enhanced clinch tooling by ordering a new style high pivot N clinch.  The high pivot N clinch automatically comes with this new tooling.  The high pivot N clinches offer greater cutting force than the former low pivot clinches.  You will need the high pivot N clinch in order to take advantage of this new tooling.

     

    If you chose not to purchase a high pivot N clinch, the tooling that accommodates the low pivot clinches will still be available.

     

    Since all Universal Instruments Corp. radial machines use the same clinch mounting system, you may simply order the new style high pivot N clinch to replace your low pivot type.  It’s a “drop-in” replacement.

     

    New High Pivot Clinch

    Clinch

    Lead spans

    Part number
    90 Short lead length

    2.5/5.0 mm

    47803402
    90 Long lead length

    2.5/5.0 mm

    46666602
    90 Short lead length

    2.5/5.0/7.5 mm

    90055850
    90 Long lead length

    2.5/5.0/7.5 mm

    90055868
    90 Short lead length

    5.0/7.5/10.0 mm

    90055852
    90 Long lead length

    5.0/7.5/10.0 mm

    90055862

     

     

    By News and Events • • • • • 0 Comments

    Fiducials and Pad Sites

    Fiducials and Pad Sites

    A fiducial is a board feature used for global and local error correction to determine the difference between programmed coordinates and actual locations on the board. This ensures that parts are not placed before their locations are verified.

     

    A pad site is a pad pattern on the production board that can be used in the same manner as a fiducial.

     

    The most typical types of fiducial failures are caused by improper color, size of fiducial, and lighting values. Other factors such as the confidence level and search area can also be trouble spots but as the programmer’s experience level increases, these will be less likely to cause problems.

     

    How many fiducials to use on a board or circuit will depend on board quality and the amount of time the manufacturing process can allocate to finding fiducials. The following is a general guide as to the number of fiducials used and the benefits of accuracy.

     

     

    Number of Fiducials Found

    Correction Possibilities

     

    1

     

    X and Y

     

    2

    X, Y, and Theta

     

    3 Klick hier

     

    X, Y, Theta, and Uniform Stretch

     

    4-5

    X, Y, Theta, and Independent X & Y Stretches

    6-10 (max)

     

    X, Y, Theta, Independent X & Y Stretches, and Corners not equal to

    90°

     

    The total number of fiducials and pad sites that can be used for a global correction cannot exceed ten.

     

    To use a combination of fiducials and pad sites for global error correction, you must assign them in the Circuit List window.

     

    The total number of fiducials and pad sites that can be used for a local correction cannot exceed five.

     

    To use a combination of fiducials and pad sites for local error correction, you must assign them in the Local Fiducials dialog box in the Placement List window.

     

    When creating a fiducial or pad site, use the Tab key to move between the data fields. If you use the Enter key, the fiducial placement is attempted and error checking is performed.

     

    To successfully create valid fiducial placements:

    –      Fiducials must be placed within the borders of the board.

    –      Fiducials cannot be placed directly on offsets. (Fiducials placed on circuits

    are automatically duplicated on all the offsets associated with that circuit.)

    –      Fiducials cannot be partially on a board or circuit.

     

    If a fiducial is on an offset and that offset is rotated, the fiducial location is rotated but the fiducial is not. Only fiducials with rotational symmetry are supported in this manner. All others will not be found.

     

    If multiple fiducial or pad site definitions are selected when using the Fiducial or Pad Site Copy function, all new fiducials and pad sites are distanced from the originals by the same X and Y Offset values.

     

    If fiducials or pad sites are consistently not found by the vision system, lower the confidence level. If the vision system finds objects other than the fiducials or pad sites, increase the confidence level.

     

    When defining a search area, keep in mind that it should be large enough to allow some tolerance in board handling, but not so large that additional board features are found instead of the fiducial or pad.

     

    Some recommended lighting levels for fiducials and pad sites.

     

    Fiducial Type / Pad Site

    Inner Ring

    Outer Ring

    Tinned / Tinned

    80 / 80

    20 / 20

    Solder Mask over Bare Copper (not recommended) / Gold

    0 / 0

    50 / 35

    Bare Copper with Copper Bright / Bare Copper

    0 / 0

    35 / 35

     

     

    The pad site functionality is not available for the Odd Form system at this time.

     

    In most cases, standard lighting cannot be used to image a pad site since solder paste or flux may not allow a good contrast between the pad site and the circuit board. Special lighting settings may need to be installed in order to image the pad site. If  Pad Site Find is the only way to get component corrections, and lighting is the only issue, consult your UIC Application Engineer.

     

    Use the Fiducial Lighting procedure located in the Operation Features Module within the User’s Guide, to determine whether a pad site can be imaged with the PEC camera. Verify contrast and the lighting level required.

     

    When to use Pad Site Find

    1) When fiducials do not exist on the circuit board

    2) When the pad site accurately represents a component type

    3) When fiducials do not give an accurate enough correction

    4) When accuracy is more important than speed

     

    If any errors occur finding pad sites, you will be taken to the Fiducial Repair screen. In the case of failed pad site finds, manual alignment is not recommended. For GSM1 systems, select the Reject Board button to remove the board. For GSM2 systems, palm down the machine to manually remove the board.

     

    The need for a pad site correction is more typical of fine pitch placements such as C4 placements or fine pitch BGA’s.

     

    Pad sites are based on component definitions. To associate a pad site definition with a component, the component must be defined in the database. Refer to the New Component module for information on adding a component to the database.

     

     

    PEC Lighting

     

    On the GSM machine, a Pattern Error Correction (PEC) camera passes an image to the vision system which attempts to recognize a programmed fiducial or pad site based on parameters in the Fiducial or Pad Site List. These parameters consist of type and size, center of fiducial identified by its “X,Y coordinates”, and the search area identified by “Search Area X,Y”.

     

    After the PEC camera moves to the programmed location of the fiducial, it illuminates the Search Area using the programmed “IN/OUT” (inner ring/outer ring) light levels. Within the search area of the image, light intensity differences between the fiducial and the board help the vision system detect the fiducial’s edges.

     

    The vision system is able to detect the North, South, East, and West edges of the fiducials by relying on the differences in contrast between the board and the fiducial color. Called vector points, triangles of red, blue, green, and yellow are displayed in the Vision Window.

    The vision system uses six vector points per edge (N, S, E,W). In order for the vision system to obtain 100% confidence, 24 out of 24 of the vector points must be detected on an edge of a fiducial. The default confidence level is 80% (19.2 rounded up to 20 vector points).

     

    Since the success of fiducial finds depends on the vision system’s ability to discern the contrast between the board and the fiducial, some combinations of fiducials (or object(s) to find) and their backgrounds may call for different types of PEC cameras. Currently 2-sided and 4-sided lighting is being used and FlexLight, a new feature, will soon be available. The 2-sided PEC camera was non-symmetrical in its lighting pattern. It illuminated in one direction, from the North and South. The 4-sided PEC camera improved on this by illuminating in four directions, from the North, South, East, and West. Originally both cameras used red LED’s.  When looking at solder-mask covered fiducials, the red light would be absorbed by the solder mask (green). To overcome this problem, green LED’s were added. The 4-sided scheme expanded the capability to illuminate gold fiducials on white ceramic as well as fiducials on flexible circuits.

     

    FlexLight (trademark) is an enhanced PEC lighting module.  It was originally developed to address the imaging challenges associated with advanced substrates such as ceramics and flexible circuits.  Although FlexLight was initially targeted at these markets, it can effectively image a wide variety of substrate materials ranging from FR-4 to more exotic materials.  The chief advantages of FlexLight are: 1) Symmetric illumination, 2) Polarization flexibilty,

    3) Wavelength flexibility, 4) Ease of reconfiguration, and 5) Monolithic design.

     

    A mechanical support structure holds eight LED petals and an inner LED ring. Each petal is a small printed circuit board containing 10 LED’s.  The petals can contain light sources of various wavelengths ranging from blue to red.  The petals and the inner ring can be exchanged in a “plug-and-play” fashion.  This allows the illumination wavelengths of the module to be quickly and easily changed.  It also facilitates ease of service in the field. The supporting electronics allow the petals to be configured in various series and parallel combinations to support a wide variety of LED’s.

     

    The structure supports an optional polarizing film that covers four of the eight petals as shown in the following diagram.

    Corner Feature Enhancement for Multipattern Components

     

    Multipattern components consist of components or objects (RF shields, connectors etc.) which cannot be described adequately as either leaded or leadless components, but rather are defined in terms of an arrangement of geometric features.  The multipattern object is located by locating each of the features of which it is comprised, using a single or multiple fields of view.  One such feature, which is commonly used to locate rectangular or pseudo-rectangular objects, is the corner feature.  At present, this feature is defined simply by entering the length of each of the two line segments, which make up the 90 degree corner (the horizontal corner edge length and the vertical corner edge length).  With this special software, this feature definition has been extended to allow for two more optional parameters.  These parameters define “ignore zones” at the apex of the corner, and allow the image processing to ignore these regions of the edges when locating the corner.  By this means corners which are rounded, chamfered or poorly defined at the apex can still be located by using segments of the corner away from the apex, which subtend 90 degrees to each other.

     

    The diagram below indicates the meaning of each of the parameters.

     

     

     

     

     

    X2, Y2 should not exceed 25% of X1, Y1

    If  X2 or Y2 = 0, the standard corner find is employed

     

     

     

     

     

    Enhanced Product Setup

     

     

    A very helpful feature when programming components is Enhanced Product Setup. It consists of two parts, Enhanced Component Setup and Enhanced Board Setup. Each process involves a live image, of the object being taught, to be manipulated while the programmer sees the changes as they are being made.

     

    When defining a new component, fill in as many data fields as possible while paying special attention to the following; Component Height, PreOrient, Number of Leads, Lighting Type, Camera Type, Default Feeder, Default Orientation, and Reject Station.

     

    Enhanced Component Setup supports, Four Spindle, C4, OFA (Oddform Assembly) and High Accuracy (UFP) Heads.

     

    If anything goes wrong with the Platform machine during this entire process (reject station not mounted, feeder not mounted, exclusion zone, drop bin not defined, centering fails due to invalid parameter, etc…) recover by palming the machine down, and up again. Then push the Start button and proceed to pick the part again.

     

    If the Platform machine was not calibrated correctly prior to using EPS, the scale of the drawing may be incorrect and the Draw Component function cannot be used.

     

    All changes made are immediately written back to the database scroll list where the part was defined. Exit the Inspection screen at any time to view the results of the changes there. Nothing is saved permanently until the part is saved.

     

     

    Common ECS Hinderances and Solutions

     

    Before the part can be picked, all the values associated with component definition must be entered. This is necessary because these values are all needed to inspect a component.

     

    All changes to the drawing are immediately applied to the definition database of the component. If a mistake is made, rectify the error by using the Undo function. No change is permanent until the component is saved.

     

    To switch from editing the body of the drawing to any of the leads/bumps/features, click on the leads/bumps/features. To switch back to editing the body, click where there is no lead/bump/feature.

     

    Due to the method used for programming leads, it can be difficult to line up all the leads over their displayed counterparts. This is because pitches are measured from the center of the side of the component, and when they are adjusted, leads move symmetrically out or in from/to the center. To help the adjustment, if there is an odd number of leads, position the single lead in the center of a side over its corresponding displayed counterpart. If there is an even number of leads, position the two center leads over their displayed counterparts before adjusting the pitch.

     

    To define a C4 component it is sometimes convenient to define only one bump initially, and add bumps when the image is displayed, wherever necessary until the part is found. This is a good procedure because it may be difficult to determine how bumps will image before seeing an image of the part.

     

    When dealing with a large number of leads/bumps at once (over 50), the drawing function will automatically move only the single lead selected, instead of all the leads. This is done to increase the performance of the drawing operations. If less than 50 leads/bumps are selected, they will all be repositioned at once to give a better indication of their final positions.

     

    One of the more difficult things to deal with is when the displayed part’s rotation is slightly off. Make sure that the feeder pick position is optimal to present the part accurately. Use the pick/inspect/drop-off sequence more than once if necessary until the part is basically square on the screen.

     

    Lead groups can cause additional problems. The drawing always assumes that all leads are present on a side, but does not draw some of them if they were deselected in the leadgroup screen. This can make it difficult for pitches to be adjusted.

     

    If the component is too large to fit into a single field of view, the vision system will take more than one image and stop at the first image where it could find all leads/bumps/features. This might be the first image seen, or the last. If the part is found successfully, it will be the last. This makes editing of the components, by using the Draw Component function, difficult. Sometimes it is more convenient in this case to go back and forth between the Database Component Definition screen and the Inspection screen.

     

    When viewing a component on the monitor, the image detail may require enhancement. With the use of Vision Level Diagnostics, the operator can increase or decrease the detail of the viewed image by raising or lowering the current vision level. By increasing the Vision Level Diagnostics to a level 5 setting, the operator can view the image with the maximum amount of detail. Using a lower vision level results in a decrease in display detail.

     

     

     

    Specific Component Programming

     

    If a change is necessary while adding a  new component to the database, do not change the component type, exit and begin the procedure again.

     

    The Accuracy field applies only to a GSM2 (Dual Beam) machine. When the value is set at high, this means stop the opposite beam while I place this particular part with the other beam. Our accuracy studies indicate there is no need to ever run the machine with this value set to high. It adversely effects throughput and does not contribute to the accuracy of the machine when placing standard SM devices. Ignore this field for any other machine configuration.

     

    For parts that do require a more accurate placement it may be advantageous to turn on preorient.  This indicates to the machine that the part will be rotated to it's place rotation prior to being scanned through the upward looking camera.This allows the machine to minimize the amount of correction required after being centered and inherently contributes to a more accurate and repeatable placement.  It does however adversely affect throughtput.  Therefore, if you find you the placement accuracy does not meet your expectation with preorient turned off, turn it on and reevaluate the accuracy/repeatability of your placements.

     

    When choosing a lighting level for BGA, C4, or C4-Pattern components, a level of +7 should only be used with side-lighting.

     

     

    C4 Types

     

    The following restriction applies to programming C4 components on a machine equipped with an AISI 3500 vision system: A maximum of 16 unique C4 components, with 20 programmed features per component, can be contained in a product. This restriction is based on the number and type of programmed C4 features.

     

    Placement pressure values above 350 grams are typically used for C4 applications. If the placement head is not C4 capable, these pressures will not be possible.

     

    The current bump process is ‘A’, selected as the default. Bump processes B-E are reserved for future UIC vision inspection algorithms.

     

    The X or Y Vector value will be ignored if the X or Y Number value equals 1.

     

    The % Bumps Required for a C4 component is the percentage of bumps required to return an accurate image.

     

    If C4-Pattern is not available from the Component Types list box, you must create a new database. This is done by using the New option under the Database menu bar heading. If desired, existing component definitions can then be brought into the new database using the Merge option.

     

    For C4-Pattern, the value for Critical should be chosen as Yes.

     

    There should be no entry in the Min Precise Patterns, Pattern Inspection, Location Tolerance X, Location Tolerance Y, or Relative Distance fields.

     

    BGA  Types (Requirements and Limitations)

     

    A special version of software is needed, developed after an RFQ, for use with UPS 2.x

     

    The component can only be processed in a single field of view

     

    The appropriate magnification, circular lit camera (circular lit cameras take up 2 additional feeder slots

     

    The vision system must be an AIS630 Lantern vision system only.

     

    The % Bumps Required for a BGA component is the percentage of bumps required simply to display an image.

     

    Missing Ball detection for BGA components

     

    Centering – the vision system identifies the defined features (bumps) and determines the x, y, and theta corrections required for an accurate placement. Bump Process A should be chosen in the component definition.

     

    Inspection – after the centering process is complete, an additional algorithm is applied to determine if any bumps are missing. When centering and inspection are is desired, Bump Process E should be chosen in the component definition.

    This software inspects BGAs for missing balls using a two step approach.  First the regular ball find algorithm is executed and five candidates are selected as potential missing ball sites.  The selection is based on either the failure to locate a ball at an expected site, or a low correlation, or ball recognition score.  Then an intelligent pattern recognition algorithm is trained  on sites which are known to contain good ball images, and the trained algorithm is used to classify the suspect sites and verify the presence/absence of a solder ball.  Various graphic overlays are used during the execution of the algorithm:

     

    • It will be necessary to use circular lighting for bump imaging in order to realize optimum reliability. This is because the image quality of balls with the standard lighting is poor.
    • This algorithm uses a training method based on balls which are found.  If the image quality is such that noise can be incorrectly labeled as a ball, it is possible to mis-train the algorithm and fail to correctly identify missing balls.
    • Only components which fit into a single field of view can be processed.
    • In order to switch on missing ball inspection the customer must select “processing type E” in the product editor (the default is A).  This processing type flag is provided to allow for customer defined image processing and in general is not used.  It is expected that using this flag will have no impact on the overall functionality of the machine, since processing types B-D are still available for customer specific tuning.
    • This will be a special vision release to support the missing ball inspection.
    • The five missing ball candidates are labeled by blue crosses with blue boxes.
    • The trained existing balls around the missing ball candidates are labeled by blue crosses only
    • The recognized missing ball is labeled by a small red cross on the center of the candidate label

     

    If the colored graphics are an annoyance, you can change the Vision Diagnostic Level. The value is probably set at 4 or 5. The range is between 0-5. The lower the value the faster the machine.

     

    BGA Type

    1.4x UPS

    Pick and Place

    Capable

    2.x UPS

    Pick and Place

    Capable

    Special Camera

    Requirements

    for inspection

    Missing Ball

    Inspection

    Capability

    CBGA (ceramic)

    Yes

    Yes

    None

    Need Analysis

    CCGA, White (ceramic-column)

    Yes

    Yes

    None

    No

    CCGA, Dark (ceramic-column)

    Yes

    Yes

    None

    No

    uBGA

    Yes

    Yes

    2.6-3.0 Mil/Pixel Camera

    Need Analysis

    PBGA (plastic)

    Yes

    Yes

    None

    Yes

    TBGA (taped)

    Yes

    Yes

    Circular Lighting

    No

     

    Camera

    Maximum Single Field of View Size

    Minimum Pitch

    Minimum Ball Diameter

    Super High Mag (0.5 mil/pixel)

    4mm (0.160”)

    0.125mm (0.005”)

    0.075mm (0.003”)

    High Mag

    (1.0 mil/pixel)

    10mm (0.39”)

    0.25mm (0.010”)

    0.125mm (0.005”)

    Medium Mag

    (2.6 mil/pixel)

    20.8mm (0.8”)

    0.5mm (0.20”)

    0.25mm (0.010”)

    Medium Mag

    (3.0 mil/pixel)

    24mm (0.8”)

    0.5mm (0.20”)

    0.25mm (0.010”)

    Standard Mag

    (4.0 mil/pixel)

    32mm (1.25”)

    0.8mm (0.031”)

    0.4mm (0.016”)

     

    Leaded Components

     

    Lead information must be programmed symmetrically. Information entered for Sides 1 and 2 of the component is input to Sides 3 and 4, respectively. The data can then be edited. To accommodate nonsymmetrical components or components with different lead lengths or pitches, the Lead Groups option may be used.

     

    Lead groups can cause additional problems. The drawing always assumes that all leads are present on a side, but does not draw some of them if they were deselected in the leadgroup screen. This can make it difficult for pitches to be adjusted.

     

    If 0.0 (zero) is entered in any of the following Tolerance data fields, that inspection is bypassed; Lead Tolerance From Body, Lead Tolerance Across Body, Lead Spacing Tolerance, Lead Length Positive Tolerance, Lead Length Negative Tolerance, Coplanarity Tolerance, and Colinearity Tolerance.

     

    If an excessive number of components are rejected, check the component definition relative to vendor specification sheet for the component. Also, use ECS (Enhanced Component Setup) to adjust inspection parameters (geometry, lighting, etc…).

     

    Lead Groups

     

    The Lead Groups window is not used to toggle leads off for the purpose of increasing the speed of vision inspection (SMC components only). This will only result in a rejected component. All components must be defined as they physically exist. Non-symmetrical leads can be accommodated by defining the component as a Special-Leaded Component.

     

    Lead 1 in the component database is not necessarily the component’s electrical pin 1. It is only the first lead in the lower left corner of the component when the component is in the 0° orientation. We define/assign leads as beginning with lead one in the lower left hand corner and count up as we define the part in a counter-clockwise fashion.

     

    If you select the Remove All Leads option, all component leads are toggled off and considered to be phantom leads. If a lead was already toggled off when the Remove All Leads option was selected, it would remain off.

     

    If you select the Enable All Leads option, all component leads are toggled on and are inspected by the vision system. If a lead was already toggled on when Enable All Leads option was selected, it would remain on.

     

    Special Leaded Components

     

    Program the component as if all leads on the same side are identical and symmetrical with each other.

    When defining a component with different pitches, find the greatest common denominator and enter that as the pitch.

     

    The machine memory supports a maximum of 15 lead groups per component.

     

    When all lead information is entered, select the Lead Groups option. Select the leads you want to be ignored by the vision system. The leads are now phantomed with just a broken line to indicate their existence.

     

    Example:

    Let's use the 23pin SMT connector as an example…  There are physically 12 leads on one side of the device and 11 on the opposite side. It would be a reasonable approach to define both sides as having 23 leads with a pitch of 1mm, and turning off every other lead in a manner where the database matches the physical description of the part. However, by turning off every other lead this creates 23 lead groups, and this is why the machine hangs up!

     

    We define/assign leads as beginning with lead one in the lower left hand corner and count up as we define the part in a counter-clockwise fashion.  For example, for a 14 pin SOIC, lead # 1 is in the lower left corner and lead # 14 is in the upper left corner (assuming the part is defined with the leads facing north and south).  There are two lead groups when we define a 14 pin SOIC.  Lead group 1 is defined as leads 1-7 and lead group 2 is defined as leads 8-14.  However, if you turn off lead 4 there are now 3 lead groups (lead group 1 = leads 1-3, lead group 2 = leads 5-7, and lead group 3 = leads 8-14).  Notice lead 4 is not included.

     

    By turning off every other lead you are creating 23 lead groups. We only have enough RAM on the machine controller to support a maximum of 15 lead groups. However, the number of lead groups is dynamic and can be limited (reduced) by the number of components, component placements, and process complexity.  Therefore, the number of supported lead groups can be £ 15, depending on the product complexity.

     

    Program the part as it is…  Assuming the part is coming in tape and the12 leads are facing 6 O'clock and the 11 leads are facing 12 O'clock, let's define the part as having 12 leads on side 1 at a pitch of 2mm and side 3 as having 11 leads at a pitch of 2mm.

     

     

     

     

     

     

     

     

     

     

     

    Component Terminology

     

    Acronym            Name

     

    BGA                   – Ball Grid Array

    uBGA                 – micro Ball Grid Array

    CBGA                 – Column Ball Grid Array

    C4 or Flip Chip   – Controlled Collapse Chip Connection

    COB                    – Chip On Board

    CSP                     – Chip Scale Package

    DCA                   – Direct Chip Attach

    FPT                     – Fine Pitch Technology (20 to 40 mil pitch)

    ILB                     – Inner Lead Bonding

    MCM                  – Multi Chip Module

    MELF                 – Metalized ELectrode Face bonded

    MSP                    – Mini Square Pack

    OLB                    – Outer Lead Bonding

    OMPAC              – Over Molded Plastic pad Array Carrier

    PBGA                 – Plastic Ball Grid Array

    PLCC                  – Plastic Leaded Chip Carrier

    PQFP                  – Plastic Quad Flat Package

    QFP                     – Quad Flat Package

    SOD                    – Small Outline Device

    SOIC                   – Small Outline Integrated Circuit

    SOJ                     – Small Outline J lead

    SOT                     – Small Outline Transistor

    SQFP                  – Shrink Quad Flat Package; QFP with a lead pitch of .016” or less

    TAB                    – Tape Automated Bonding

    TSOP                  – Thin Small Outline Package

    UFPT                  – Ulta Fine Pitch Technology (<20 mil pitch)

    V-QFP                – Very Small Quad Flat Package

    V-SOP                – Very Small Outline Package

     

     

     

    Industry Terms

     

    CER-QUAD              – Digital Equipment Component

    C-QUAD            – Northern Telecom Package

    Tape Pak             – Trade Mark/National Semiconductor

    V-PAK         – Vertical Package (Texas Instruments – memory package)