Why choose “One stop solution “?

Southern Machinery provide the whole line installation ,training and after sales services. Improve efficiency , reduce cost.

The wole SMT line process including: Printer, pick &place ,reflow oven, conveyor.
One stop improve the whole line pruduction capacity , with line balance.
Overall considering to improve product quality , not just by a single machine.
It is the best solution proved by most of our customers.

Southern Machinery-AI and SMT machine/Accessaries/ELCINA member

Dedicated to provide customers with one-stop service, research and development, production, testing, sales, after-sales service, provide the whole line  sales and service .
According to the needs of customers, with our professional technology to provide customized service.
 
1.PCB AI/SMT Equipment Manufacture.Offering comprehensive solution in AI/SMT Technology
2.For different components process insert /Pick& Place , like Radial and Axial components ; odd form components (Rivet,Pin,Switch,Connector,Terminal and so on
);SMD LED components (0402-7474 SMD components, 15mm IC, and different capacitance,resistance,IC,QFP,SOP,SOT,CSP and so on.)
3.To meet the needs of different industries
(1)Electrical industries appliances:Air conditioner, Television, Microwave, Electric cooker, Electric kettle, Induction cooker etc.
(2)Power supply appliance: Vehicle power supply, Energy saving power supply, Ballast etc.
(3)LED application:LED lighting, LED display, LED lights, LED control systems, LED luminous characters.
(4)Vehicle industries application: Vehicle power supply, Vehicle light, Car audio etc.
(6)Energy saving lighting industries application: Industrial lighting, outdoor lighting, street lamp, floodlight etc.
(7)Other electronic industries application: Electronic watch, Electronic Instrument, electronic spare parts etc.
4.AI/SMT spare parts of different brand machine .
With the original drawing to provide high copy spare parts , To a large extent save much cost for customer ,and keep the spare parts life.
5.Have the most extensive contacts network, for customers to find all kinds of second-hand accessories.

 

PastedGraphic-10

Are You Ready for Lead-Free Reflow Oven s-6600

Reflow-Oven-

FEATURES:

· Complete for the free process

·Adopt instrument control System and closed loop control for heating sources of each zone 

·Temperature control adopt circulation hot air heating mode for each zone 

·Closed loop control for conveyor system,can go along steadily stepless rate-adjusting

·With over heating alarm function

Product Description:

Machine Dimension (L*W*H) 5378 *1320 *1490 mm
Weight Approx.2300 Kg
umber of Heating Zones Top 8/Bottom 8
Length of Heating Zones 3110mm
Heating Mode Circulation hot air
Number of Cooling Zone Top 2
Nozzle Plate Aluminum Alloy Plate
Max. Width of PCB 400 mm (Option 450 mm)
Range of Rail Width 50-400 mm (Option 50-450 mm)
Conveyor Direction L→R (Option R→L)
Conveyor Height 900±20 mm
PCB Transmission Mode Mesh
Conveyor Speed 300-2000 mm/min
Power Supply 5 Wire 3 phase, 380V,50/6 0HZ
Total Power 64KW
Start up Power 30KW
Power Consumption 9KW
Warming Time Approx: 30 Min
Temperature Range Room Temp 300℃
Temperature Control Method PID Close Loop Control + SSR Driving
Temperature Control Precision +-1℃
Temperature Deviation on PCB +-1.5℃
Abnormal Alarm Abnormal Temperature (Extra-high temp /Extra-Low temp)

USA IPC APEX EXPO 2016 exhibition

 

 

 

 

 

 

 

 

 

 

 

 

Welcome to visit our booth No. :#2930 in USA IPC APEX EXPO (Mar. 15th-Mar17, 2016)

ETA and Southern will attend the USA IPC APEX EXPO 2016 exhibition to share the industry’s top feast.You are warmly welcome to visit our booth No. :#2930 in USA IPC APEX EXPO (Mar. 15th-Mar17, 2016)

As the industry’s leading manufacturers, Wewould show our latest T-series lead-free reflow oven and at the same time, we will Strongly recommended Strongly recommended our Odd Form machines

in USA IPC APEX EXPO 2016 exhibition.This is unique machine in China now. It refreshes the traditional perception of reflow oven.

We are the professional manufacturer of reflow oven and offer full SMT solutions for customers. We have more than 20 years experience and technology in SMT filed. The most professional term and the best service are waiting for you. Our goal is to provide the reliable full SMT solutions to all the customers around the world.

ETA is our good global partner. We would provide the high-value technical support to our customers together.

You are warmly welcome to visit our booth No. :#2930.

 

3JL2@CTO66X1$AU_`YF$]JJ EH[MFM@97)KM071$D6AW[NL

 

 

 

 

Welcome to #2930 IPC APEX EXPO 2016


The need to reduce the size and weight of
electronic products is continuing as Surface
Mount Technology matures further. Size reduction
in both active and passive components coupled
with improved printed circuit board technology
is producing smaller, lighter weight, and
higher performing end products. Extensive
research and development continues to reduce
the size of active packages. Passive components
have also been reduced in size to enable designers
to use smaller printed circuit boards to perform
a given task. The use of 0603 and 0402
components have been prevalent for a number
of years. These component sizes can be run in
high volume applications at very high yields.
More recently, 0201 components have been
implemented in high density applications. The
0201 component is approximately one-quarter
the size of a 0402 component and this could
reduce the assembly process robustness and
yield

Component Size Comparison

Stencil Aperture Position Relative to Attachment Pad

Insufficient Solder Volume

Excessive Solder Volume

AI, Auto Insertion : Axial Inserter; Radial Inserter; JW (Jumper Wire) Inserter; Odd form Inserter; PIN inserter; Eyelet Inserter; Terminal Inserter IM, Insertion Mount, MI,Manual Insertion, DIP, Wave soldering 5, SMT - Souface Mount Technology: BHS: PCB board handling system, Loader, Unloader, Conveyor,Shuttle Printer: Solder paste screen printer SPI: Solder Paste Inspection Mounter: Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter AOI Reflow Oven

Auto Insertion machine CPU board EPC-1316 Boot Sector and BIOS Corruption Procedure for Re-flash

48797301 board
Procedure

Symptoms of corrupted BIOS and/or Boot Block:

  • No video signal from the EPC-1316
  • No activity on
  1. The keyboard, no status lights at power-on
  2. The floppy drive with a disk in or out
  3. The hard disk drive evident by the light off after a certain amount of time
  • The EPC-1316 is trying to access the CD-ROM drive with failed attempts every second or so.
  • The EPC-1316 is in this cycle indefinitely

Steps to take:

  1. Power down the EPC-1316 board/machine.
  2. Make sure that this instructions file is opened on a different computer.
  3. At the last step of these instructions is an embedded object of the .zip folder; it contains all of the files needed for this procedure.
  4. Right click on the .zip folder, select ‘Package Object’ and click on ‘Activate Contents’. If a message regarding a trustworthy source is displayed, confirm that this source can be trusted
  5. Create a new folder on the Desktop and rename it to “EPC-16FBD1.00.10”
  6. Click ‘File’, then select and click on ‘Extract All…’
  7. Extract the .zip folder into the folder on the Desktop, created in Step 3.
  8. Obtain a 3.5in Floppy Disk and insert it into the drive.
  9. Open the “EPC-16FBD1.00.10” folder from the Desktop
  10. To run an MS-DOS program, double click on the CRISDISK.BAT file.
  11. To run a Windows Application, double click on the WINCRIS.EXE file.
  12. Go through prompts of the program attentively; and a crisis disk will be created.
  13. Remove the EPC-16 board from the VME chassis/rack.
  14. At the bottom of the board there are 2 x 5 jumper pins: MFG/Flash. (Figure 1)


Figure 1 EPC-1316 Board jumper pin location

  1. See Figure 2 for PIN-out of the Jumper pins.


Figure 2 EPC-1316 Board jumper pin numbering

  1. Using 2 jumpers (Figure 3): place one to jumper pins 4-6. (jumper setting ‘Write Boot Block’)
  2. Place the second to jumper pins 3-5. (jumper setting ‘Force flash recovery’)


Figure 3 EPC-1316 Board flash jumpers configuration

  1. Replace the EPC-1316 board to the VME chassis/rack.
  2. Insert the 3.5in Floppy Disk that was created from the steps above into the floppy drive.
  3. Power-up the machine/chassis/EPC-1316.
  4. If the status light on the floppy drive comes on and stays on, then the floppy disk is being accessed.
  5. When the floppy drive stops accessing the Floppy Disk, wait about 5 seconds, and then remove the disk.
  6. Power down the EPC-1316, and remove it from the VME interface.
  7. Remove jumpers from the board and replace the board to the VME interface.
  8. Power-up the machine/chassis/EPC-1316 and make sure that it boots the operating system.
  9. Refer to UIC procedures for proper BIOS settings/ configuration

 

UIC, EPC-1316 Boot Sector and BIOS Corruption Procedure for Re-flash

Procedure

Symptoms of corrupted BIOS and/or Boot Block:

  • No video signal from the EPC-1316
  • No activity on
  1. The keyboard, no status lights at power-on
  2. The floppy drive with a disk in or out
  3. The hard disk drive evident by the light off after a certain amount of time
  • The EPC-1316 is trying to access the CD-ROM drive with failed attempts every second or so.
  • The EPC-1316 is in this cycle indefinitely

Steps to take:

    1. Power down the EPC-1316 board/machine.
    2. Make sure that this instructions file is opened on a different computer.
    3. At the last step of these instructions is an embedded object of the .zip folder; it contains all of the files needed for this procedure.
    4. Right click on the .zip folder, select ‘Package Object’ and click on ‘Activate Contents’.  If a message regarding a trustworthy source is displayed, confirm that this source can be trusted
    5. Create a new folder on the Desktop and rename it to “EPC-16FBD1.00.10”
    6. Click ‘File’, then select and click on ‘Extract All…’
    7. Extract the .zip folder into the folder on the Desktop, created in Step 3.
    8. Obtain a 3.5in Floppy Disk and insert it into the drive.
    9. Open the “EPC-16FBD1.00.10” folder from the Desktop
    10. To run an MS-DOS program, double click on the CRISDISK.BAT file.
    11. To run a Windows Application, double click on the WINCRIS.EXE file.
    12. Go through prompts of the program attentively; and a crisis disk will be created.
    13. Remove the EPC-16 board from the VME chassis/rack.
    14. At the bottom of the board there are 2 x 5 jumper pins: MFG/Flash. (Figure 1)

Figure 1 EPC-1316 Board jumper pin location

    1. See Figure 2 for PIN-out of the Jumper pins.

  

Figure 2 EPC-1316 Board jumper pin numbering

    1. Using 2 jumpers (Figure 3): place one to jumper pins 4-6. (jumper setting ‘Write Boot Block’)
    2. Place the second to jumper pins 3-5. (jumper setting ‘Force flash recovery’)

Figure 3 EPC-1316 Board flash jumpers configuration

    1. Replace the EPC-1316 board to the VME chassis/rack.
    2. Insert the 3.5in Floppy Disk that was created from the steps above into the floppy drive.
    3. Power-up the machine/chassis/EPC-1316.
    4. If the status light on the floppy drive comes on and stays on, then the floppy disk is being accessed.
    5. When the floppy drive stops accessing the Floppy Disk, wait about 5 seconds, and then remove the disk.
    6. Power down the EPC-1316, and remove it from the VME interface.
    7. Remove jumpers from the board and replace the board to the VME interface.
    8. Power-up the machine/chassis/EPC-1316 and make sure that it boots the operating system.
    9. Refer to UIC procedures for proper BIOS settings/ configuration

 

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display

ETA and Southern Machinery will attend the USA IPC APEX EXPO 2016 exhibition

ETA and Southern Machinery will attend the USA IPC APEX EXPO 2016 exhibition to share the industry’s top feast.

 

You are warmly welcome to visit our booth No. :#2930 in USA IPC APEX EXPO (Mar. 15th-Mar17, 2016)

As the industry’s leading manufacturers, ETA would show our latest T-series lead-free reflow oven together with Southern Machinery in USA IPC APEX EXPO 2016 exhibition.This is unique machine in China now. It refreshes the traditional perception of reflow oven. T-series lead-free reflow oven could ensure the lead-free process optimization under the condition of the smallest footprint and the lowest power consumption. It could meet all customer’s demand. Meanwhile, Many new special equipment will also be displayed at this show.

ETA is the professional manufacturer of reflow oven and offer full SMT solutions for customers. We have more than 20 years experience and technology in SMT filed. The most professional term and the best service are waiting for you. Our goal is to provide the reliable full SMT solutions to all the customers around the world. Southern Machinery is our good global partner. We would provide the high-value technical support to our customers together.

www.smt11.com,

www.smthelp.net

You are warmly welcome to visit our booth No. :#2930.

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display
Southern Machinery:Provide SMT whole line solution.
AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display

2 video to compare Manual and Auto PIN/ Eyelet/Terminal insertion for electronic manufacturing PCBA

The Through Hole Assembly, also known as thru hole assembly, process uses the latest models with the quickest possible turnaround rate in the industry. Assembling excellent stable sequencing performance with easy operating software utilizing its high precision through hole assembly both by hand and automation to create electronic solder connections.

 

C (20121106 212843894) Audio003

Automatic PIN/ Eyelet/Terminal insertion:

ManualPIN/ Eyelet/Terminal insertion:

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display

SMT Lead-Free Reflow Over S-R1000 for electronic manufacturing PCB assembly

AI spare parts、Universal Parts,UIC,TDK.VCD Sequencer.SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering,PCB Assembly, LED, LED lamp, LED display

CatchBDD7(02-01-(02-01-11-12-19)

 

 

Features:

1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be more than 99.99%.

2.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ ambient temperature to a temperature stabilization .

3.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display.

4.Cooling System: new cooling zone, quick and easy adjustment, easily reach the cooling requirements of different slopes.

5.Temperature protection: using third-party over-temperature protection, multiple layers protection to ensure safe operation.

6.Products comply with CE, CCC, UL , other standards and specifications.

7.User-friendly design: fault detection (such as heaters abnormal alarm, etc.), regular maintenance reminders, the economy functions and tool-free maintenance, reducing equipment failure rates.

8.Heating module: Transverse reflow design makes temperature from each zone is not influenced by neibour to ensure accurate temperature curve, while ensuring a high production capacity and heat exchange capacity to achieve high adaptability (to meet the soldering of automotive, communications, electronics, computers and mobile phones consumer electronics.)

9.Hot air motor with independently inverter controlled, set operating frequencies depending on different technology to meet a variety of lead-free processes.

10. Machine using zero gas source design, furnace cover with motor lifting, safety rod support, providing significant security.

11.Main parts:Imported main parts ensure equipment runs smoothly and lower the maintenance cost.

12. Customers can choose optional flux processing system according to their own production features  to ensure furnace chamber clean.

13.Closed-loop transmission speed control systems, transportation accuracy ± 2mm / min, ensuring more stable transmission speed.

14.Central support, dual transmission, external water cooling system is optional.

TOP Advantage:

1.Simple: combined with advanced international concepts, based on the Oriental-designed operating system, easy to understand, easy to learn, easy to maintain.

2.Expertise: learn imported reflow oven’s advanced design concepts, and the machine core components are using imported top brands.

3.Hedging: Import hardware configuration,low failure rate in production,more than a decade service life.

4.Safety: Based on the general rules of international design, close to imported reflow rating, the highest security level.

5.Stable: mature software, hardware and top production processes ensures stability of each equipment.

Application  

Widely used in high precision products like 01005-QFP, BGA, CSP, Flip,and POP ,automotive electronics, mobile devices, home appliances, communications, LED, semiconductor and other industries.

Specification:

 

Southern Machinery  Reflow Oven Specifications
S – Standard, O – Option, M – Manual, A – Auto, N/A – Not Availible)
Specifications S-R800 S-R1000 Specifications E8 E10
Dimension (L*W*H)mm 5310x1353x1490 6100x1353x1490 Board Dropped Alarm S S
Standard Color Computer Grey Computer Grey Electrical SMEMA Interface S S
Weight Approx.2150KG Approx.2400KG Computer Lenovo Lenovo
Number Of Heating Zones Up8/Bottom8 Up10/Bottom10 Max.Width Of PCB 400mm 400mm
Length Of Heating Zones 3121mm 3891mm Temperature Deviation on PCB ± 1.0℃ ± 1.0℃
Rail Width Adjustment A and M(Multi mode) A and M(Multi mode) Max. Temp. Gap Between Preheat Zones Setting 40℃ 40℃
Rail Number 1 Lane or 2 Land 1 Lane or 2 Land Temperature Control Precision ± 1.0℃ ± 1.0℃
Exhaust Volume 10M3/minx2 Exhausts 10M3/minx2 Exhausts Conveyor Height 900+/-20mm 900+/-20mm
Control System PLC+Computer PLC+Computer Length Of Cooling Zones 600mm 600mm
Transmission Agent  Chain + Mesh  Chain + Mesh Center Support O O
Electric Supply Required 3phase,380V 50/60Hz 3phase,380V 50/60Hz Siemens PLC S S
Power For Warm Up 30KW 36KW Lubrication Auto-Afflux S S
Power Consumption 8KW 12KW Ups S S
Warming Time Approx.25 minute Approx.25 minute Temp. Thermocouple Slot S S
Temp. Setting Range Room Temp.– 300℃ Room Temp.– 300℃ Driven Top Hood Opening A A
Oil Supply A and M(Multi mode) A and M(Multi mode) Temperature Control Method PID + SSR S S
Conveyor Speed Range 300~2000mm/min 300~2000mm/min Number of Cooling Zones 2 2
Components Clearance Top/ Bottom is 25mm Top/ Bottom is 25mm On Line Editing S S
Conveyor Direction L→R (Option: R→L) L→R (Option: R→L) Max.Temp.Gap Between Preheat & Reflow Setting 80℃ 80℃
Commutated Element Aluminum Alloy Plate (8mm) Aluminum Alloy Plate (8mm) Max. Temp. Gap Between Reflow Zones Setting 50℃ 50℃
Fixed Rail Side Front Fixed  (Option:Rear  Fixed) Front Fixed  (Option:Rear  Fixed) Process Data & Status Storage S S
Cooling Method Forced-Air Motor and fan (Standard) Forced-Air Motor and fan   (Standard) Temperature Alarm S S

 

 

Independent Upper and Lower PID Temperature Controls

Independent Upper and Lower PID Temperature Controls for Each Heating Zone Permit Precise Temperature Profiling

S-R1000’s heating zone temperature controllers have an accuracy of ±1°C and, in conjunction with a high-speed blower adjacent to each heat source for maximum convection, ensure a ΔT of ±2°C across the PCB assembly. The Series diffuser design provides low-velocity, low-turbulence air flow to prevent component shift or disturbance.

Optional thermocouples can be attached at critical locations on the PCB and connected to three built-in inputs (standard) on the oven for communication with  control software for accurate, real-time temperature profiling to match any solder paste manufacturer’s specifications.

CR-10000 SMT Reflow Oven Pin over mesh conveyor

Pin-Over-Mesh Conveyor Meets Virtually Any Product Specification or Production Requirement

The S-R1000 is supplied as standard with an adjustable-rail, pin-type conveyor system that handles PCBs up to a maximum of 450 mm (17.7″) installed over a 570 mm (22″) stainless-steel mesh belt. The pin conveyor permits inline and double-sided processing. The mesh belt is ideal for fast changeovers.

To eliminate the possibility of jamming or dropped PCB assemblies, all components are constructed of high-quality, high-strength, stainless steel and are built to maintain dimensional tolerances at the high temperatures of lead-free processing.

Advanced automatic chain lubrication and motorized width adjustment are standard features on the pin conveyor. Automatic width adjustment of the pin conveyor, based on the parameter settings for specific reflow programs, is available as an option. For processing of larger PCBs at higher lead-free temperatures, a center support system is available to prevent board warpage.

Conveyor speed is programmable from 400-1800 mm (16″-71″) per minute to accommodate any process requirement.

Nitrogen Atmosphere Compatible Models Widen Lead-Free Processing Window Through Reduced Oxidation

While the debate over air or inert reflow atmospheres continues, as an option, offers the S-R1000 in a nitrogen-compatible configuration for manufacturers who want the flexibility for soldering in both environments.

Most experts agree that the reduction of oxygen through the introduction of an inert gas (usually N2) will allow a wider process window and provide better solder joints through reduced oxidation. The enhanced flow design of the heating chamber in the S-R1000 nitrogen compatible system lends itself to efficient heat transfer and ensures low nitrogen consumption while maintaining O2 levels between 300-1000 ppm.

CR-10000 reflow oven internal water-chilled recirculating cooling system available

Internal Water Cooling Provides Maximum Control Over Critical Cooling Rates Required By Some Lead-Free Solders

Because the higher liquidus temperatures required by lead-free solders approach the limits of many SMT components and PCB assemblies, more aggressive cooling is often required to reduce peak temperature exposure times. Some recent studies also indicate that cooling rates have a significant effect on solder joint grain structure.

For these reasons, an internal water-chilled recirculating cooling system is available for the S-R1000. It allows users to alter cooling rates to meet solder paste manufacturers recommendations to a much greater degree than is possible with the exclusive use of air cooling.

CR-10000 reflow oven real-time profiling

Advanced Functionality and Process Management Capability

Operation and control of all  reflow systems is accomplished through an attractive, colorful, visual user interface that features a full-screen, virtual view of the system with display of pre-set and actual zone temperatures, system status and conveyor speed.

The Windows-based operating system and control software includes advanced functions for temperature profiling, timed automatic startup and shutdown, audible and visual alarms, and password protection.

A PC-controller with 15″ flat screen monitor, keyboard and trackball allow unlimited storage and networking capability.

All systems employ UPS battery backup to ensure removal of all product from the oven in the event of a power outage.